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公开(公告)号：US20140098238A1
公开(公告)日：2014-04-10
申请号：US14101258
申请日：2013-12-09
Applicant: FLIR Systems, Inc.
Inventor： Pierre Boulanger , Theodore R. Hoelter , Barbara Sharp , Eric A. Kurth
CPC classification number: H04N5/33 , G01J5/00 , G01J5/02 , G01J5/20 , G01J5/522 , H04N5/2257 , H04N5/2351 , H04N5/2354 , H04N5/332 , H04N7/18
Abstract: Various techniques are disclosed for providing an infrared imaging module that exhibits a small form factor and may be used with one or more portable devices. Such an infrared imaging module may be implemented with a housing that includes electrical connections that may be used to electrically connect various components of the infrared imaging module. In addition, various techniques are disclosed for providing system architectures for processing modules of infrared imaging modules. In one example, a processing module of an infrared imaging module includes a first interface adapted to receive captured infrared images from an infrared image sensor of the infrared imaging module. The processing module may also include a processor adapted to perform digital infrared image processing on the captured infrared images to provide processed infrared images. The processing module may also include a second interface adapted to pass the processed infrared images to a host device.
Abstract translation: 公开了各种技术来提供呈现小尺寸的红外成像模块并且可以与一个或多个便携式装置一起使用。 这种红外成像模块可以用包括可用于电连接红外成像模块的各种部件的电连接的壳体来实现。 此外，公开了用于提供用于处理红外成像模块的模块的系统架构的各种技术。 在一个示例中，红外成像模块的处理模块包括适于从红外成像模块的红外图像传感器接收捕获的红外图像的第一界面。 处理模块还可以包括适于对所捕获的红外图像执行数字红外图像处理以提供经处理的红外图像的处理器。 处理模块还可以包括适于将经处理的红外图像传递到主机设备的第二接口。
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公开(公告)号：US10321031B2
公开(公告)日：2019-06-11
申请号：US15932372
申请日：2018-02-16
Applicant: FLIR SYSTEMS, INC.
Inventor： Jeffrey D. Frank , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp , Andrew C. Teich , Dwight Dumpert , Mark Nussmeier , Eric A. Kurth , Gerald W. Blakeley, III , Michael Fox
Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.
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公开(公告)号：US20180198960A1
公开(公告)日：2018-07-12
申请号：US15932372
申请日：2018-02-16
Applicant: FLIR SYSTEMS, INC.
Inventor： Jeffrey D. Frank , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp , Andrew C. Teich , Dwight Dumpert , Mark Nussmeier , Eric A. Kurth , Gerald W. Blakeley, III , Michael Fox
CPC classification number: H04N5/2252 , H04M1/0254 , H04M1/0264 , H04N5/23254 , H04N5/33 , H04N5/365 , H04N5/3651
Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.
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公开(公告)号：US09948878B2
公开(公告)日：2018-04-17
申请号：US14961829
申请日：2015-12-07
Applicant: FLIR Systems, Inc.
Inventor： Brian Simolon , Eric A. Kurth , Jim Goodland , Mark Nussmeier , Nicholas Hogasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp , Naseem Y. Aziz
CPC classification number: H04N5/3765 , G01R23/00 , G06F1/04 , G06F11/0703 , G06F11/076 , H04N5/2257 , H04N5/33 , H04N5/365
Abstract: Various techniques are provided to detect abnormal clock rates in devices such as imaging sensor devices (e.g., infrared and/or visible light imaging devices). In one example, a device may include a clock rate detection circuit that may be readily integrated as part of the device to provide effective detection of an abnormal clock rate. The device may include a ramp generator, a counter, and/or other components which may already be implemented as part of the device. The ramp generator may generate a ramp signal independent of a clock signal provided to the device, while the counter may increment or decrement a count value in response to the clock signal. The device may include a comparator adapted to select a current count value of the counter when the ramp signal reaches a reference signal. A processor of the device may be adapted to determine whether the clock signal is operating in an acceptable frequency range, based on the selected count value.
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公开(公告)号：US09918023B2
公开(公告)日：2018-03-13
申请号：US14106696
申请日：2013-12-13
Applicant: FLIR Systems, Inc.
Inventor： Brian Simolon , Eric A. Kurth , Mark Nussmeier , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
IPC: H04N5/33 , H04N5/378 , H01L27/146 , H04N5/225
CPC classification number: H04N5/33 , H01L27/14634 , H01L27/1469 , H04N5/2257 , H04N5/378
Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.
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Patent Agency Ranking
公开(公告)号：US09900526B2
公开(公告)日：2018-02-20
申请号：US14749886
申请日：2015-06-25
Applicant: FLIR Systems, Inc.
Inventor： Joseph Kostrzewa , Vu L. Nguyen , Theodore R. Hoelter , Nicholas Högasten , Mark Nussmeier , Eric A. Kurth , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
IPC: H04N5/351 , H04N5/335 , H04N5/235 , H04N5/33 , H04N17/00 , H04N5/365 , H04N5/378 , H04N5/225 , H04N5/217 , H04N101/00
CPC classification number: H04N5/351 , H04N5/2176 , H04N5/2253 , H04N5/2257 , H04N5/2351 , H04N5/33 , H04N5/332 , H04N5/335 , H04N5/3656 , H04N5/3658 , H04N5/378 , H04N17/002 , H04N2101/00
Abstract: Various techniques are provided to compensate for and/or update ineffective (e.g., stale) calibration terms due to calibration drifts in infrared imaging devices. For example, a virtual-shutter non-uniformity correction (NUC) procedure may be initiated to generate NUC terms to correct non-uniformities when appropriate triggering events and/or conditions are detected that may indicate presence of an object or scene to act as a shutter (e.g., a virtual shutter). Scene-based non-uniformity correction (SBNUC) may be performed during image capturing operations of the infrared imaging device, for example, when a virtual-shutter scene is not available. Further, snapshots of calibration data (e.g., NUC terms) produced during the virtual-shutter NUC procedure, the SBNUC process, and/or other NUC process may be taken. Such snapshots may be utilized to provide useful NUC data when the infrared imaging device starts up or is otherwise reactivated, so that the SBNUC or other NUC methods may produce effective results soon after the start-up. Such snapshots may also be utilized to update ineffective calibration terms.
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公开(公告)号：US09848134B2
公开(公告)日：2017-12-19
申请号：US14092794
申请日：2013-11-27
Applicant: FLIR Systems, Inc.
Inventor： Brian Simolon , Eric A. Kurth , Steve Barskey , Mark Nussmeier , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
CPC classification number: H04N5/33 , H01L27/1469 , H04N5/359 , H04N5/365
Abstract: Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.
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公开(公告)号：US20170359526A1
公开(公告)日：2017-12-14
申请号：US15665277
申请日：2017-07-31
Applicant: FLIR Systems, Inc.
Inventor： Pierre Boulanger , Theodore R. Hoelter , Barbara Sharp , Eric A. Kurth
CPC classification number: H04N5/33 , G01J5/00 , G01J5/02 , G01J5/20 , G01J5/522 , H04N5/2257 , H04N5/2351 , H04N5/2354 , H04N5/332 , H04N7/18
Abstract: Various techniques are disclosed for providing an infrared imaging module that exhibits a small form factor and may be used with one or more portable devices. Such an infrared imaging module may be implemented with a housing that includes electrical connections that may be used to electrically connect various components of the infrared imaging module. In addition, various techniques are disclosed for providing system architectures for processing modules of infrared imaging modules. In one example, a processing module of an infrared imaging module includes a first interface adapted to receive captured infrared images from an infrared image sensor of the infrared imaging module. The processing module may also include a processor adapted to perform digital infrared image processing on the captured infrared images to provide processed infrared images. The processing module may also include a second interface adapted to pass the processed infrared images to a host device.
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公开(公告)号：US09807319B2
公开(公告)日：2017-10-31
申请号：US14506430
申请日：2014-10-03
Applicant: FLIR Systems, Inc.
Inventor： Andrew C. Teich , Jeffrey D. Frank , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Eric A. Kurth , Barbara Sharp
CPC classification number: H04N5/33 , H04N5/2253 , H04N5/2257 , H04N5/23209 , H04N5/332 , H04N7/18 , H04N7/181
Abstract: Wearable systems with thermal imaging capabilities may be provided for detecting the presence and location of persons or animals in an environment surrounding the system in accordance with an embodiment. A wearable system may include a wearable structure such as a helmet with a plurality of imaging modules mounted to the wearable structure. An imaging module may include one or more imaging components such as infrared imaging modules and visible light cameras. Thermal images captured using the infrared imaging modules may be used to detect the presence of a person in the thermal images. The wearable imaging system may include one or more alert components that alert the wearer when a person is detected in the thermal images. The alert components may be used to generate a location-specific alert that alerts the wearer to the location of the detected person. A wearable imaging system may be a multidirectional threat monitoring helmet.
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公开(公告)号：US09716844B2
公开(公告)日：2017-07-25
申请号：US14133095
申请日：2013-12-18
Applicant: FLIR Systems, Inc.
Inventor： Mark Nussmeier , Eric A. Kurth , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
CPC classification number: H04N5/33 , H04M1/725 , H04M2250/52 , H04N5/2252 , H04N5/2257 , H04N5/357 , H04N5/378
Abstract: Various techniques are provided for implementing an infrared imaging system, especially for low power and small form factor applications. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. A low-dropout regulator (LDO) is integrated with the FPA and adapted to provide a regulated voltage in response to an external supply voltage. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors in response to the regulated voltage. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.
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