公开(公告)号：US20180018000A1

公开(公告)日：2018-01-18

申请号：US15546050

申请日：2015-01-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John P. Franz ,  David A. Moore

IPC: G06F1/20 ,  G05B19/4099 ,  H05K7/20

CPC classification number: G06F1/20 ,  B29C64/393 ,  B33Y50/02 ,  B33Y80/00 ,  G05B19/4099 ,  G05B2219/35134 ,  G05B2219/49007 ,  G06F2200/201 ,  H05K7/20272 ,  H05K7/20772

Abstract: Example implementations relate to an integrated liquid cooling of a server system. For example, a method for integrated liquid cooling of a server system can include creating a liquid cooling component that includes creating a three dimensional (3D) design based on a server system, where the 3D design includes customized angle geometry. Further, the method for integrated liquid cooling of a server system can include forming the liquid cooling component based on the 3D design, where the liquid cooling component includes a plurality of liquid flow passages for delivering cooling resources to the server system, and delivering the cooling resources to the server system via the liquid cooling component.

公开(公告)号：US20180017490A1

公开(公告)日：2018-01-18

申请号：US15211875

申请日：2016-07-15

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John Franz ,  William K. Norton

IPC: G01N21/59 ,  G01N21/47 ,  G01N21/55 ,  G01N27/10

CPC classification number: G01N21/59 ,  G01N21/4738 ,  G01N21/85 ,  G01N21/94 ,  G01N2201/12

Abstract: Example implementations relate to an optical biofilm probe. For example, in an implementation, the optical biofilm probe may include a light source to project light towards a substrate disposed within a bypass and a detector to detect light from the substrate. Properties of light detected by the detector may be affected by biofilm formation on the substrate. The bypass may be connected in parallel to a conduit of a fluid system.

公开(公告)号：US12029016B2

公开(公告)日：2024-07-02

申请号：US16945395

申请日：2020-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P. Franz ,  Tahir Cader ,  Matthew Richard Slaby

IPC: H05K7/20 ,  G05B15/02 ,  G01L13/00

CPC classification number: H05K7/20836 ,  G05B15/02 ,  H05K7/20772 ,  H05K7/20781 ,  G01L13/00

Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.

公开(公告)号：US11800682B2

公开(公告)日：2023-10-24

申请号：US17541477

申请日：2021-12-03

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Tahir Cader

IPC: H05K7/20 ,  H01L23/46 ,  H05K1/02 ,  H01L23/473

CPC classification number: H05K7/20272 ,  H01L23/473 ,  H05K1/0203

Abstract: Example implementations relate to a cooling module of a circuit assembly having a frame and an electronic circuit module including first and second chipsets, and a method of assembling the cooling module. The cooling module includes first and second cooling components. The first cooling component is connectable to the frame to establish a first thermal interface between the first cooling component and the first chipset. The first cooling component is positioned within a recess portion of the second cooling component, and each connector of a pair of second fluid connectors in the second cooling component is movably connected to a respective connector of a pair of first fluid connectors in the first cooling component to establish a fluid-flow path between the first and second cooling components. The second cooling component is connectable to the frame to establish a second thermal interface between the second cooling component and the second chipset.

公开(公告)号：US11750629B2

公开(公告)日：2023-09-05

申请号：US17024884

申请日：2020-09-18

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Sergey Serebryakov ,  Tahir Cader ,  Nanjundaiah Deepak

IPC: H04L9/40 ,  H04L43/0817 ,  H04L43/065 ,  H04L43/062 ,  H04L43/04

CPC classification number: H04L63/1425 ,  H04L43/04 ,  H04L43/062 ,  H04L43/065 ,  H04L43/0817 ,  H04L63/20

Abstract: An example device includes processing circuitry and a memory. The memory includes instructions that cause the device to perform various functions. The functions include receiving datastreams from a plurality of sensors of a high performance computing system, classifying each datastream of the each sensor to one of a plurality of datastream models, selecting an anomaly detection algorithm from a plurality of anomaly detection algorithms for each datastream, determining parameters of the each anomaly detection algorithm, determining an anomaly threshold for each datastream, and generating an indication that the sensor associated with the datastream is acting anomalously.

公开(公告)号：US11579952B2

公开(公告)日：2023-02-14

申请号：US16399861

申请日：2019-04-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Mehmet Kivanc Ozonat ,  Tahir Cader ,  Matthew Richard Slaby

IPC: G06F11/00 ,  G06F1/20 ,  G06K9/62 ,  G06F16/901 ,  G06N3/04 ,  G06F1/28 ,  G06N3/10

Abstract: In exemplary aspects of optimizing data centers, historical data corresponding to a data center is collected. The data center includes a plurality of systems. A data center representation is generated. The data center representation can be one or more of a schematic and a collection of data from among the historical data. The data center representation is encoded into a neural network model. The neural network model is trained using at least a portion of the historical data. The trained model is deployed using a first set of inputs, causing the model to generate one or more output values for managing or optimizing the data center with respect to design and risk aspects.

公开(公告)号：US11497137B2

公开(公告)日：2022-11-08

申请号：US17126361

申请日：2020-12-18

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  Harvey J. Lunsman ,  Mitchell Johnson

IPC: H05K7/20 ,  G06F1/20

Abstract: A compute device includes a printed circuit board, at least three compute subassemblies disposed on the printed circuit board, and a liquid loop. The compute subassemblies disposed on the printed circuit board and each of the three compute subassemblies includes a thermal control plate defining a respective internal conduit therethrough. A temperature controlled liquid circuit circulates through the liquid loop through to control the temperature of each of compute subassemblies in series during operation, the liquid loop including each of the internal conduits in each of the thermal control plates in each of the compute subassemblies.

公开(公告)号：US11153992B2

公开(公告)日：2021-10-19

申请号：US16716573

申请日：2019-12-17

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  Wade D Vinson ,  Douglas Kent Garday ,  John P Franz

IPC: H05K7/20 ,  H05K7/14 ,  G06F1/20

Abstract: An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.

公开(公告)号：US20210033226A1

公开(公告)日：2021-02-04

申请号：US16579254

申请日：2019-09-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Tahir Cader

IPC: F16L21/03 ,  H05K7/20

Abstract: Hose barb fittings and apparatuses described herein provide increased fluid-flow rates for cooling loops used for thermal control in computer system. A hose barb fitting comprises a fluid-flow passage that extends through the hose barb fitting from a first opening to a second opening. The ratio of the cross-sectional area of the fluid-flow passage to the cross-sectional area of the hose barb fitting is between 0.4 and 0.7, inclusive. When the hose barb fitting is fully seated within a housing structure, a specialized gasket acts as both a radial seal and a face seal. Also, a flange extending from the housing structure engages with a flange extending from the hose barb fitting to prevent the hose barb fitting from being unseated.

公开(公告)号：US10765040B2

公开(公告)日：2020-09-01

申请号：US15665334

申请日：2017-07-31

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Matthew Richard Slaby

IPC: G05B15/02 ,  H05K7/20 ,  G01L13/00

Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.