公开(公告)号：US10548242B2

公开(公告)日：2020-01-28

申请号：US15329246

申请日：2014-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  Wade D Vinson ,  Douglas Kent Garday ,  John P Franz

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/14

Abstract: A system to cool a module data center including a fluid cooling device to cool a first set of components of the module data center using a fluid cooling loop and an air cooling device to provide an air to cool a second set of components of the module data center. Also, a control apparatus to determine an air cooling temperature for the air cooling loop based on an environmental condition, determine a fluid cooling temperature for the fluid cooling loop based on the environmental condition, transmit an air signal to the air cooling device to set the air cooling temperature, and transmit a fluid signal to the fluid cooling device to set the fluid cooling temperature.

公开(公告)号：US11153992B2

公开(公告)日：2021-10-19

申请号：US16716573

申请日：2019-12-17

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  Wade D Vinson ,  Douglas Kent Garday ,  John P Franz

IPC: H05K7/20 ,  H05K7/14 ,  G06F1/20

Abstract: An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.

公开(公告)号：US10455726B2

公开(公告)日：2019-10-22

申请号：US15511983

申请日：2014-09-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  John P Franz ,  David Allen Moore ,  Douglas Kent Garday ,  Wade D Vinson

IPC: H05K7/20 ,  G06F1/20

Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.