公开(公告)号：US20210327787A1

公开(公告)日：2021-10-21

申请号：US17356014

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Jin YANG ,  Jimmy CHUANG ,  Xicai JING ,  Yuan-Liang LI ,  Yuyang XIA ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Maria de la Luz BELMONT ,  Oscar FARIAS MOGUEL ,  Andres RAMIREZ MACIAS ,  Javier AVALOS GARCIA ,  Jessica GULLBRAND ,  Shaorong ZHOU ,  Chia-Pin CHIU ,  Xiaojin GU

IPC: H01L23/44

Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

公开(公告)号：US20210193552A1

公开(公告)日：2021-06-24

申请号：US16721809

申请日：2019-12-19

Applicant: Intel Corporation

Inventor： Zhimin WAN ,  Jin YANG ,  Chia-Pin CHIU ,  Peng LI ,  Deepak GOYAL

IPC: H01L23/367 ,  H01L25/18 ,  H01L25/065 ,  H01L23/31

Abstract: Embodiments include semiconductor packages. A semiconductor package includes first and second bottom dies on a package substrate, first top dies on the first bottom die, and second top dies on the second bottom die. The semiconductor package includes thermally conductive slugs on the first bottom die and the second bottom die. The thermally conductive slugs are comprised of a high thermal conductive material. The thermally conductive slugs are positioned directly on outer edges of top surfaces of the first and second bottom dies, inner edges of the top surfaces of the first and second bottom dies, and/or a top surface of the package substrate. The high thermal conductive material of the thermally conductive slugs is comprised of copper, silver, boron nitride, or graphene. The thermally conductive slugs may have two different thicknesses. The semiconductor package may include an active die and/or an integrated heat spreader with the pedestals.

公开(公告)号：US20210134726A1

公开(公告)日：2021-05-06

申请号：US17144130

申请日：2021-01-07

Applicant: Intel Corporation

Inventor： Henning BRAUNISCH ,  Chia-Pin CHIU ,  Aleksandar ALEKSOV ,  Hinmeng AU ,  Stefanie M. LOTZ ,  Johanna M. SWAN ,  Sujit SHARAN

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/00 ,  H01L25/065

Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

公开(公告)号：US20200098661A1

公开(公告)日：2020-03-26

申请号：US16139401

申请日：2018-09-24

Applicant: Intel Corporation

Inventor： Kelly LOFGREEN ,  Chia-Pin CHIU ,  Joseph PETRINI ,  Edvin CETEGEN ,  Betsegaw GEBREHIWOT ,  Feras EID

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/367

Abstract: Embodiments include an electronic system and methods of forming an electronic system. In an embodiment, the electronic system may include a package substrate and a die coupled to the package substrate. In an embodiment, the electronic system may also include an integrated heat spreader (IHS) that is coupled to the package substrate. In an embodiment the electronic system may further comprise a thermal interface pad between the IHS and the die. In an embodiment the die is thermally coupled to the IHS by a liquid metal thermal interface material (TIM) that contacts the thermal interface pad.