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公开(公告)号：US12266878B2
公开(公告)日：2025-04-01
申请号：US17484865
申请日：2021-09-24
Applicant: Intel Corporation
Inventor： Daqiao Du , Zhen Zhou , Ismael Franco Núñez , Gordon P. Melz
Abstract: An apparatus comprising an interconnect comprising a conductive core; a first conductive layer connected to the conductive core and extending parallel to the conductive core towards a first end of the conductive core; a second conductive layer connected to the conductive core and extending parallel to the conductive core towards a second end of the conductive core; a first non-conductive layer between the conductive core and the first conductive layer; and a second non-conductive layer between the first conductive layer and the second conductive layer.
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公开(公告)号：US20240120651A1
公开(公告)日：2024-04-11
申请号：US17957752
申请日：2022-09-30
Applicant: Intel Corporation
Inventor： Zhen Zhou , Tae Young Yang , Timo Huusari , Renzhi Liu , Wei Qian , Mengyuan Huang , Jason Mix
IPC: H01Q3/26 , H01L23/498 , H01L23/66
CPC classification number: H01Q3/2676 , H01L23/49827 , H01L23/66 , H01L2223/6677
Abstract: Photonically steered impedance surface antennas are disclosed. A disclosed example apparatus includes a semiconductor substrate to be communicatively coupled to a radio frequency (RF) source, an at least partially transparent dielectric layer, the semiconductor substrate at a first side of the at least partially transparent dielectric layer, an at least partially transparent conductive film at a second side of the at least partially transparent dielectric layer that is opposite the first side of the at least partially transparent dielectric layer, and an illumination source to illuminate at least a portion of the semiconductor substrate to generate a photoinduced solid-state plasma pattern that beam steers an RF signal corresponding to the RF source.
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33.发明公开公开(公告)号：US20230369289A1
公开(公告)日：2023-11-16
申请号：US17742799
申请日：2022-05-12
Applicant: Intel Corporation
Inventor： Jong-Ru Guo , Zhen Zhou , Jason Mix , Chia-Pin Chiu , Zuoguo Wu
IPC: H01L25/065 , H01L23/31 , H01L23/498 , H01L25/00
CPC classification number: H01L25/0657 , H01L23/3157 , H01L23/49811 , H01L23/49838 , H01L25/50 , H01L2225/06506 , H01L2225/06548
Abstract: Embodiments of a microelectronic assembly comprise a package substrate, a first integrated circuit (IC) die, a second IC die between the first IC die and the package substrate, a dielectric material between the first IC die and the package substrate, and a plurality of vias through the dielectric material, the vias coupling the first IC die and the package substrate. The microelectronic assembly is in a space defined by three mutually orthogonal axes, a first axis, a second axis and a third axis; the package substrate, the first IC die and the second IC die are mutually parallel in first planes defined by the first axis and the third axis; the vias are in one or more second planes defined by the second axis and the third axis; and the vias are inclined at an angle not equal to ninety degrees around the first axis.
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公开(公告)号：US11571133B2
公开(公告)日：2023-02-07
申请号：US16642561
申请日：2017-09-30
Applicant: INTEL CORPORATION
Abstract: Technologies for monitoring a health-risk condition of a user include a virtual reality compute device having one or more near infrared (NIR) sensors. The virtual reality compute device presents a virtual reality (VR) presentation to the user. The virtual reality compute device produces sensor data through the one or more NIR sensors that is indicative of a heart rate of the user and a blood pressure of the user while the VR presentation is presented to the user. The virtual reality compute device determines whether the user is in a health-risk condition based on a comparison of the heart rate of the user to a heart rate safety threshold and a comparison of the blood pressure of the user to a blood pressure safety threshold. The virtual reality compute device performs a health-risk condition response in response to a determination that the user is in the health-risk condition.
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公开(公告)号：US20220229495A1
公开(公告)日：2022-07-21
申请号：US17711905
申请日：2022-04-01
Applicant: Intel Corporation
Inventor： Hao Luo , Somnath Kundu , Brent Carlton , Zhen Zhou
IPC: G06F3/01 , G06F3/0488 , G01S13/89
Abstract: Techniques for radiofrequency (RF) touch and gesture recognition are disclosed. In the illustrative embodiment, RF transmitters and receivers are connected to data lines and gate lines of a display. RF signals sent on one data or gate line may be scattered to a different data or gate line based on the presence of a nearby object, such as a finger. The amount of scattering on different data or gate lines can be used to determine a location of one or more objects.
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Patent Agency Ranking
公开(公告)号：US20220171704A1
公开(公告)日：2022-06-02
申请号：US17598190
申请日：2019-05-31
Applicant: INTEL CORPORATION
Inventor： Yao Zu Dong , Qiming Shi , Chao Xie , Bin Yang , Zhen Zhou
Abstract: Systems, apparatuses and methods may provide for technology that detects a creation of a thread, dedicates a memory region to objects associated with the thread, and conducts a reclamation of the memory region in response to a termination of the thread. In one example, the memory region is a heap region and the reclamation bypasses at least a pause phase and a copy phase of a garbage collection process with respect to the heap region.
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公开(公告)号：US11297163B2
公开(公告)日：2022-04-05
申请号：US16973856
申请日：2019-01-17
Applicant: INTEL CORPORATION
Inventor： Shoumeng Yan , Xiao Dong Lin , Yao Zu Dong , Zhen Zhou , Bin Yang
Abstract: Method, systems and apparatuses may provide for technology that divides an application into a plurality of portions that are each associated with one or more functions of the application and determine a plurality of transition probabilities between the plurality of portions. Some technology may also receive at least a first portion of the plurality of portions, and receive a relation file indicating the plurality of transition probabilities between the plurality of portions.
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公开(公告)号：US20220013944A1
公开(公告)日：2022-01-13
申请号：US17484865
申请日：2021-09-24
Applicant: Intel Corporation
Inventor： Daqiao Du , Zhen Zhou , Ismael Franco Núñez , Gordon P. Melz
Abstract: An apparatus comprising an interconnect comprising a conductive core; a first conductive layer connected to the conductive core and extending parallel to the conductive core towards a first end of the conductive core; a second conductive layer connected to the conductive core and extending parallel to the conductive core towards a second end of the conductive core; a first non-conductive layer between the conductive core and the first conductive layer; and a second non-conductive layer between the first conductive layer and the second conductive layer.
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公开(公告)号：US11116072B2
公开(公告)日：2021-09-07
申请号：US15817098
申请日：2017-11-17
Applicant: Intel Corporation
Inventor： Jun Liao , Zhen Zhou , James A. McCall , Jong-Ru Guo , Xiang Li , Yunhui Chu , Zuoguo Wu
Abstract: An apparatus is described. The apparatus includes a semiconductor chip having cross-talk noise cancellation circuitry disposed between a disturber trace and a trace to be protected from cross-talk noise emanating from the disturber trace. The trace is to be coupled to a receiver disposed on a different semiconductor chip.
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公开(公告)号：US11099385B2
公开(公告)日：2021-08-24
申请号：US15579593
申请日：2016-12-30
Applicant: Intel Corporation
Abstract: A virtual reality headset system includes a vision correction module. The vision correction system can detect a degree of myopia or other visual ailment of a user of the VR system, and then adjust a vision correction lens to adjust for user myopia. An implementation of the vision correction module can adjust right and left lenses separately.
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