公开(公告)号：US20220338344A1

公开(公告)日：2022-10-20

申请号：US17855680

申请日：2022-06-30

Applicant: Intel Corporation

Inventor： Zhen Zhou ,  Gordon Melz ,  Daqiao Du ,  Ismael Franco ,  Jason Mix

IPC: H05K1/02 ,  H05K1/11

Abstract: Methods and apparatus relating to phase heterogeneous interconnects for crosstalk reduction are described. In one embodiment, an interconnect includes a plurality of links. A first set of links from the plurality of links communicates signals and a second set of links from the plurality of links provides a return path. The interconnect also includes one or more links from the first set of links that include one or more structures with a larger diameter than a minimum diameter of the one or more links. The larger diameter modifies an inductance or capacitance of the one or more links to provide a heterogenous phase delay amongst the plurality of links. Other embodiments are also claimed and disclosed.

公开(公告)号：US20240120651A1

公开(公告)日：2024-04-11

申请号：US17957752

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Zhen Zhou ,  Tae Young Yang ,  Timo Huusari ,  Renzhi Liu ,  Wei Qian ,  Mengyuan Huang ,  Jason Mix

IPC: H01Q3/26 ,  H01L23/498 ,  H01L23/66

CPC classification number: H01Q3/2676 ,  H01L23/49827 ,  H01L23/66 ,  H01L2223/6677

Abstract: Photonically steered impedance surface antennas are disclosed. A disclosed example apparatus includes a semiconductor substrate to be communicatively coupled to a radio frequency (RF) source, an at least partially transparent dielectric layer, the semiconductor substrate at a first side of the at least partially transparent dielectric layer, an at least partially transparent conductive film at a second side of the at least partially transparent dielectric layer that is opposite the first side of the at least partially transparent dielectric layer, and an illumination source to illuminate at least a portion of the semiconductor substrate to generate a photoinduced solid-state plasma pattern that beam steers an RF signal corresponding to the RF source.

公开(公告)号：US20230369289A1

公开(公告)日：2023-11-16

申请号：US17742799

申请日：2022-05-12

Applicant: Intel Corporation

Inventor： Jong-Ru Guo ,  Zhen Zhou ,  Jason Mix ,  Chia-Pin Chiu ,  Zuoguo Wu

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49838 ,  H01L25/50 ,  H01L2225/06506 ,  H01L2225/06548

Abstract: Embodiments of a microelectronic assembly comprise a package substrate, a first integrated circuit (IC) die, a second IC die between the first IC die and the package substrate, a dielectric material between the first IC die and the package substrate, and a plurality of vias through the dielectric material, the vias coupling the first IC die and the package substrate. The microelectronic assembly is in a space defined by three mutually orthogonal axes, a first axis, a second axis and a third axis; the package substrate, the first IC die and the second IC die are mutually parallel in first planes defined by the first axis and the third axis; the vias are in one or more second planes defined by the second axis and the third axis; and the vias are inclined at an angle not equal to ninety degrees around the first axis.

公开(公告)号：US20240007050A1

公开(公告)日：2024-01-04

申请号：US17854534

申请日：2022-06-30

Applicant: Intel Corporation

Inventor： Timo Huusari ,  Mohamed A. Abdelmoneum ,  Brent R. Carlton ,  Somnath Kundu ,  Hao Luo ,  Sarah Shahraini ,  Jason Mix ,  Eduardo Alban

IPC: H03B5/36 ,  H03B5/06

CPC classification number: H03B5/36 ,  H03B5/06 ,  H03B2200/0094

Abstract: An apparatus, system, and method for multi-frequency oscillator control are provided. A circuit can include a resonator circuit including an input and an output, the resonator circuit configured to resonate at a fundamental frequency and a different, non-fundamental frequency, a startup circuit electrically coupled to the input, the startup circuit configured to generate a signal at about the non-fundamental frequency and detect when the resonator circuit is resonating at the non-fundamental frequency, and an oscillator driver circuit electrically coupled to the output, the oscillator driver circuit configured to amplify and buffer the output of resonator circuit and drive a load.

公开(公告)号：US11611346B2

公开(公告)日：2023-03-21

申请号：US16449107

申请日：2019-06-21

Applicant: Intel Corporation

Inventor： Catharina Biber ,  Jason Mix ,  Mark Carbone ,  Mohamed A. Abdelmoneum ,  Joshua Linden Levy ,  Timo Huusari ,  Sarah Shahraini

IPC: H03L1/04 ,  H01L25/16 ,  H03B5/30

Abstract: Techniques and mechanisms for regulating a temperature of a resonator structure. In an embodiment, a thermoelectric cooler (TEC) is thermally coupled to a resonator which is proximate thereto. The resonator supports operation with an oscillator circuit, wherein a resonance characteristic of the resonator contributes to oscillations of a master clock signal, or other oscillatory signal, which is provided with the oscillator circuit. The TEC provides Peltier functionality to selectively perform either one of heating or cooling the resonator. In another embodiment, the TEC is configured to conduct heat which is transferred via a path between the TEC and the resonator, wherein the path omits any circuitry which is to perform operations which are synchronized based on the oscillatory signal.

公开(公告)号：US20220416428A1

公开(公告)日：2022-12-29

申请号：US17357658

申请日：2021-06-24

Applicant: Intel Corporation

Inventor： Zhen Zhou ,  Tae Young Yang ,  Shuhei Yamada ,  Tolga Acikalin ,  Johanny Escobar Pelaez ,  Kenneth Foust ,  Jason Mix ,  Renzhi Liu

IPC: H01Q9/04 ,  H01Q1/22

Abstract: Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.