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    BACK CAVITY LEAKAGE TEST FOR ACOUSTIC SENSOR
    31.
    发明申请
    BACK CAVITY LEAKAGE TEST FOR ACOUSTIC SENSOR 有权
    回声孔泄漏测试用于声学传感器

    公开(公告)号：US20150195665A1

    公开(公告)日：2015-07-09

    申请号：US14149708

    申请日：2014-01-07

    Applicant: Invensense, Inc.

    Inventor： James Christian Salvia ,  Baris Cagdaser ,  Aleksey S. Khenkin

    IPC: H04R29/00

    CPC classification number: H04R29/004 ,  H04R19/005 ,  H04R2201/003

    Abstract: An acoustic sensor system has an acoustic sensor with a cavity, a cavity leakage, and a cavity pressure. The acoustic sensor system further has a test controller coupled to the acoustic sensor that causes a change in the cavity pressure. A response of the acoustic sensor to the change in the cavity pressure is used to measure the cavity leakage.

    Abstract translation: 声学传感器系统具有具有腔体，腔体泄漏和腔体压力的声学传感器。 声学传感器系统还具有耦合到声学传感器的测试控制器，其引起腔体压力的变化。 使用声学传感器对腔体压力变化的响应来测量腔体泄漏。

    Electrical testing and feedthrough cancellation for an acoustic sensor
    32.
    发明授权
    Electrical testing and feedthrough cancellation for an acoustic sensor 有权

    公开(公告)号：US10587969B2

    公开(公告)日：2020-03-10

    申请号：US15598214

    申请日：2017-05-17

    Applicant: INVENSENSE, Inc.

    Inventor： James Salvia ,  Baris Cagdaser ,  Aleksey S. Khenkin

    IPC: H04R29/00 ,  G01H17/00 ,  H04R19/00 ,  H04R19/04 ,  G01V13/00

    Abstract: A method and circuit for testing an acoustic sensor are disclosed. In a first aspect, the method comprises using electro-mechanical features of the acoustic sensor to measure characteristic of the acoustic sensor. In a second aspect, the method comprises utilizing an actuation signal to evaluate mechanical characteristics of the acoustic sensor. In a third aspect, the method comprises using a feedthrough cancellation system to measure a capacitance of the acoustic sensor. In the fourth aspect, the circuit comprises a mechanism for driving an electrical signal into a signal path of the acoustic sensor to cancel an electrical feedthrough signal provided to the signal path, wherein any of the electrical signal and the electrical feedthrough signal are within or above an audio range.

    Integrated temperature sensor in microphone package
    33.
    发明授权
    Integrated temperature sensor in microphone package 有权

    公开(公告)号：US10142718B2

    公开(公告)日：2018-11-27

    申请号：US14856262

    申请日：2015-09-16

    Applicant: INVENSENSE, INC.

    Inventor： Anthony D. Minervini ,  Kieran Harney ,  Aleksey S. Khenkin ,  Baris Cagdaser

    IPC: G01K13/00 ,  G01K1/14 ,  G01K1/16 ,  H04R1/02 ,  H04R19/00 ,  H04R19/04

    Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

    Signal processing for an acoustic sensor bi-directional communication channel
    36.
    发明授权
    Signal processing for an acoustic sensor bi-directional communication channel 有权

    公开(公告)号：US09749736B2

    公开(公告)日：2017-08-29

    申请号：US14975155

    申请日：2015-12-18

    Applicant: INVENSENSE, INC.

    Inventor： Baris Cagdaser ,  Fariborz Assaderaghi

    IPC: H04R25/00 ,  H04R3/00 ,  H04R19/00 ,  G06F13/38

    CPC classification number: H04R3/00 ,  G06F13/38 ,  H04R19/005 ,  H04R2201/003 ,  H04R2420/09

    Abstract: Signal processing for an acoustic sensor bi-directional communication channel is presented herein. The acoustic sensor can comprise a micro-electro-mechanical system (MEMS) transducer configured to generate, based on an acoustic pressure, an audio output; and a bi-directional communication component configured to send and/or receive data that has been superimposed on the audio output using common mode signaling, time division multiplexing, or frequency separation. In an example, a signal processing component is configured to send the audio output directed to an external device utilizing differential mode signaling between respective pins of the acoustic sensor; and send the data utilizing the common mode signaling comprising a sum of voltages of the respective pins. In other examples, the signal processing component is configured to send and/or receive the data, and send the audio output, during different time periods; or send the data based on a frequency range outside an audio band.

    Preamplifier for a microphone
    38.
    发明授权
    Preamplifier for a microphone 有权
    麦克风前置放大器

    公开(公告)号：US09451359B2

    公开(公告)日：2016-09-20

    申请号：US14553973

    申请日：2014-11-25

    Applicant: INVENSENSE, INC.

    Inventor： Igor Mucha ,  Tomá{hacek over (s)} Piták ,  James Salvia ,  Baris Cagdaser

    IPC: H04R3/00 ,  H03F3/183

    CPC classification number: H04R3/00 ,  H03F3/183 ,  H03F2200/03 ,  H03F2200/372 ,  H03F2200/375 ,  H03F2200/444 ,  H04R1/08 ,  H04R3/04 ,  H04R19/005 ,  H04R2201/003

    Abstract: Systems and techniques for processing a signal associated with a microphone are presented. The system includes a microphone component and a preamplifier. The microphone component is contained in a housing. The preamplifier includes an input buffer that receives a signal generated by the microphone component. The input buffer also generates an output signal that comprises a direct current (DC) voltage offset in comparison to the signal, where the preamplifier controls a degree of the DC voltage offset based on a control signal.

    Abstract translation: 提出了用于处理与麦克风相关联的信号的系统和技术。 该系统包括麦克风组件和前置放大器。 麦克风组件包含在外壳中。 前置放大器包括接收由麦克风组件产生的信号的输入缓冲器。 输入缓冲器还产生与信号相比包括直流（DC）电压偏移的输出信号，其中前置放大器基于控制信号控制DC电压偏移的程度。

    MEMS ACOUSTIC SENSOR COMPRISING A NON-PERIMETER FLEXIBLE MEMBER
    39.
    发明申请
    MEMS ACOUSTIC SENSOR COMPRISING A NON-PERIMETER FLEXIBLE MEMBER 有权
    包含非周边柔性构件的MEMS声学传感器

    公开(公告)号：US20160264398A1

    公开(公告)日：2016-09-15

    申请号：US14642693

    申请日：2015-03-09

    Applicant: INVENSENSE, INC.

    Inventor： Sushil Bharatan ,  Baris Cagdaser

    IPC: B81B3/00 ,  G01L9/00 ,  B81C1/00

    CPC classification number: B81B3/007 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81C1/00658 ,  G01L9/003 ,  G01L9/0072 ,  G01L9/0095

    Abstract: A micro electro-mechanical system (MEMS) acoustic sensor is disclosed. The acoustic sensor comprises a backplate and a diaphragm. The acoustic sensor further comprises a flexible member and optional spacer member disposed between the backplate and the diaphragm resulting in a gap between the backplate and the diaphragm. The gap can vary in response to impinging pressure on the diaphragm based on the design of the flexible member and resulting in a variable capacitance between the backplate and the diaphragm. The change in the gap can result in a change in an electrical characteristic associated with the variable capacitance and can be converted to an electrical output signal corresponding to the impinging pressure on the diaphragm. The flexible member can be part of the backplate or diaphragm.

    Abstract translation: 公开了一种微机电系统（MEMS）声传感器。 声传感器包括背板和隔膜。 声学传感器还包括柔性构件和设置在背板和隔膜之间的可选间隔构件，导致背板和隔膜之间的间隙。 间隙可以根据柔性构件的设计响应隔膜上的冲击压力而变化，并导致背板和隔膜之间的可变电容。 间隙的变化可导致与可变电容相关联的电特性的变化，并且可以转换成对应于隔膜上的冲击压力的电输出信号。 柔性构件可以是背板或隔膜的一部分。

    Mode-tuning sense interface
    40.
    发明授权
    Mode-tuning sense interface 有权
    模式调谐感应接口

    公开(公告)号：US09304155B2

    公开(公告)日：2016-04-05

    申请号：US13720984

    申请日：2012-12-19

    Applicant: Invensense, Inc.

    Inventor： Baris Cagdaser ,  Derek Shaeffer ,  Joseph Seeger

    IPC: G01R27/26 ,  G01C19/5726 ,  G01D5/24

    CPC classification number: G01C25/00 ,  G01C19/5726 ,  G01D5/24 ,  G01R27/2605

    Abstract: A MEMS capacitive sensing interface includes a sense capacitor having a first terminal and a second terminal, and having associated therewith a first electrostatic force. Further included in the MEMS capacitive sensing interface is a feedback capacitor having a third terminal and a fourth terminal, the feedback capacitor having associated therewith a second electrostatic force. The second and the fourth terminals are coupled to a common mass, and a net electrostatic force includes the first and second electrostatic forces acting on the common mass. Further, a capacitance measurement circuit measures the sense capacitance and couples the first terminal and the third terminal. The capacitance measurement circuit, the sense capacitor, and the feedback capacitor define a feedback loop that substantially eliminates dependence of the net electrostatic force on a position of the common mass.

    Abstract translation: MEMS电容感测接口包括具有第一端子和第二端子的感测电容器，并且具有与其相关联的第一静电力。 还包括在MEMS电容感测接口中的是具有第三端子和第四端子的反馈电容器，所述反馈电容器具有与其相关联的第二静电力。 第二和第四端子耦合到共同的质量，净静电力包括作用在公共质量上的第一和第二静电力。 此外，电容测量电路测量感测电容并耦合第一端子和第三端子。 电容测量电路，感测电容器和反馈电容器定义了基本上消除了净静电力对共同质量位置的依赖性的反馈回路。

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