Abstract:
PROBLEM TO BE SOLVED: To provide a coating type composition for forming an aluminum film having excellent long-term preservation stability, and handleability under a rough inert atmosphere. SOLUTION: The composition for forming the aluminum film includes a specific complex represented by a complex represented by formula (1) (wherein, R 1 is 9-20C alkyl, 9-20C alkenyl, 9-20C alkynyl or 7-20C alicyclic; and R 2 and R 3 are each independently hydrogen, 1-20C alkyl, 1-20C alkenyl, 1-20C alkynyl or 3-20C alicyclic). COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for inexpensively and easily manufacturing an electromagnetic wave shielding film having improved electromagnetic wave shielding properties and transmission properties. SOLUTION: The manufacturing method of the electromagnetic wave shielding film 7 includes: a process for preparing a transfer base material 4 comprising a metal base material 1 and an insulating film 2 that covers the surface of the metal base material and has a lattice-like recess 3, and plating a metal conductive layer 5 in the recess 3 of the transfer base material 4; a process for applying a transparent resin solution to the formation surface of the metal conductive layer 5 in the transfer base material 4 to form a transparent resin film 6 after drying; and a process for separating the transfer base material 4 from the transparent base material 6 for transferring the metal conductive layer 5 onto the transparent resin film 6 and forming the former on the latter. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a chemical vapor deposition material having excellent preservation stability and further capable of obtaining a ruthenium film of high quality, and to provide a simple method for forming a ruthenium film using the chemical vapor deposition material. SOLUTION: The chemical vapor deposition material comprises a compound expressed by formula (1): RuL 2 Y; wherein, L is a group expressed by formula (2); R 1 , R 2 and R 3 are respectively independently a hydrogen atom, a fluorine atom, a trifluoromethyl radical, a 1 to 10C hydrocarbon radical or a 1 to 10C alkoxy group; and Y is 1,5-cyclooctadiene, 1,3-cyclooctadiene, 1,4-cyclohexadiene, 1.3-cyclohexadiene, cyclopentadienyl, 1-3-butadiene or 2,3-dimethyl-1,3-butadiene. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a chemical vapor deposition material with which a good-quality ruthenium film can be obtained even if the ruthenium film of an extremely thin-film is formed and a simple method of forming the ruthenium film by using the chemical vapor deposition material. SOLUTION: The chemical vapor deposition material is a ruthenium compound having a ligand expressed by general formula (2). In the formula R 1 , R 2 and R 3 are each independently hydrogen atoms, fluorine atoms, trifluoromethyl groups or 1-10C hydrocarbons. The above ruthenium compound is used in the chemical vapor deposition method. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To produce a 1,4-diene compound useful for the production of an unsaturated ethylenic copolymer having high vulcanization rate in high selectivity by reacting ethylene with a 1,3-diene compound in the presence of an iron compound and a specific catalyst under a specific condition. SOLUTION: The objective compound of formula II is produced by reacting ethylene with a 1,3-diene compound of formula I [R1 to R3 are each H, a halogen, a 1-20C (halogenated)hydrocarbon group or an alkylsilyl] (e.g. isoprene) in the presence of a catalyst containing an iron compound [e.g. iron (III) acetylacetonate] and an organic aluminum compound of formula R4nAlZn-3 (R4 is a 1-20C univalent hydrocarbon group; Z is H, an alkoxyl or a halogen; 0 =3 MPa, preferably 3-50 MPa for 3 min to 2 hr.
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate including an aluminum body capable of forming a film-like aluminum body having excellent film-forming characteristics (degree of reflection and adhesion) on the substrate.SOLUTION: A manufacturing method of a substrate including an aluminum body comprises: a plasma processing step of plasma-processing a substrate; a coating step of forming a coating layer composed of a composition for aluminum body formation containing a complex of an amine compound and an aluminum hydride and an organic solvent on the plasma-processed substrate by coating the composition on the substrate; and an aluminum film formation step of forming a film-like aluminum body by at least heating the coating layer or irradiating the coating layer with light.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device using a hard mask that can be formed in a simple manner and that is less likely to cause charge-up.SOLUTION: A method of manufacturing a semiconductor device includes: a step of coating an aluminum film formation material containing a complex of an amine compound and aluminum hydride on a processed film formed on a semiconductor substrate to form a coating film; a step of performing at least one kind of processing chosen from heating processing and light irradiation processing to the coating film to form an aluminum film; a step of etching the aluminum film to form a hard mask; and a step of etching the processed film using the hard mask as a mask.
Abstract:
PROBLEM TO BE SOLVED: To provide a material for forming a copper thin film, which has excellent conductivity and allows a copper thin film to be formed by an application method to be used for many electronic devices easily and inexpensively; and a method of forming a copper thin film by using the material. SOLUTION: A material for forming a copper thin film contains a compound expressed by a formula shown below and a solvent. In the formula, each of R 1 through R 5 represents any of a hydrogen atom, a halogen atom, a hydrocarbon group having a carbon number of 1 to 15, a halogenated hydrocarbon group having a carbon number of 1 to 10, and an ether group having a carbon number of 1 to 10. R 1 through R 5 may be the same or different from each other. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a silicon dioxide precursor and a silicon dioxide precursor composition useful to form a silicon dioxide film of high purity without containing an organic component. SOLUTION: This silicon dioxide precursor is represented by following rational formula (1): (H 2 SiO) n (HSiO 1.5 ) m (SiO 2 ) k (1) (wherein n, m and k are numbers respectively, and when n+m+k=1, n is ≥0.5, m is >0 and ≤0.3, and k is 0 to 0.2), and is a silicone resin of a solid state at 120°C. The silicon dioxide precursor composition comprises the silicone resin and an organic solvent. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation:要解决的问题:提供二氧化硅前体和二氧化硅前体组合物,其用于形成高纯度的二氧化硅膜而不含有机组分。 解决方案:该二氧化硅前体由以下合理的式(1)表示:(H 2 SB> SiO) SB>(HSiO 1.5 SB>) (1)(其中n,m和k分别是数字,当n + m + k = 1时, ,n≥0.5,m> 0且≤0.3,k为0〜0.2),是120℃下的固态硅酮树脂。 二氧化硅前体组合物包含有机硅树脂和有机溶剂。 版权所有(C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming an aluminum film, which method exhibits good film formation capability even when an aluminum film is formed on the inside surface of a fiber having a fine hollow structure and is simple, low-cost, and performing continuous film formation. SOLUTION: The method for forming an aluminum film on the inside surface of a tube comprises applying a composition containing an amine compound/aluminum hydride complex and an organic solvent to the inside surface of the tube and subjecting the applied composition to heating and/or light irradiation. COPYRIGHT: (C)2007,JPO&INPIT