中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

48 records (took 0.022 seconds)

    34.
    发明专利
    未知

    公开(公告)号：DE50007792D1

    公开(公告)日：2004-10-21

    申请号：DE50007792

    申请日：2000-05-12

    Applicant: LINDE AG

    Inventor： WANDKE ERNST ,  STRIGL REINHARD

    IPC: B08B3/04 ,  B08B7/00 ,  D06F37/30 ,  D06F43/02

    Abstract: A cleaning apparatus includes (1) a pressure tank with at least one cleaning tank arranged therein; (2) means for supplying the cleaning apparatus with a cleaning fluid; and (3) means inside the pressure tank for setting the at least one cleaning tank in motion, wherein by these means the at least one cleaning tank is movably arranged relative to the pressure tank in terms of at least one of rotational or translational movement.

    Cleaning of textiles or yarns and the like and/or surfaces, uses a liquid and/or supercritical gas in a reactor, which is also used for a following low pressure plasma treatment
    35.
    发明专利
    Cleaning of textiles or yarns and the like and/or surfaces, uses a liquid and/or supercritical gas in a reactor, which is also used for a following low pressure plasma treatment 未知

    公开(公告)号：DE10111427A1

    公开(公告)日：2002-09-12

    申请号：DE10111427

    申请日：2001-03-09

    Applicant: LINDE AG

    Inventor： WANDKE ERNST

    IPC: D06B19/00 ,  D06B21/00 ,  D06L1/00 ,  D06M10/02 ,  D06M23/10

    Abstract: To clean textiles or yarns and similar materials and/or surfaces, the cleaning agent is a liquid and/or supercritical gas. The material to be cleaned is treated with a low pressure plasma before and/or after the cleaning action. To clean textiles and yarns, and the like, the cleaning and low plasma stages take place in the same reactor. The cleaning agent is carbon dioxide, helium, argon, krypton, xenon, nitrogen oxide e.g. dinitrogen monoxide, hydrocarbons e.g. methane, ethane, propane, butane, pentane, hexane, ethylene and propylene, halogenized hydrocarbons e.g. trifluoromethane, tetrafluoromethane, chlorodifluoromethane and perfluoropropane, halogen/sulfur compounds e.g. sulfurhexafluoride, and mixtures of the gases. After the cleaning stage, the pressure is set for the low pressure plasma treatment, without increasing the pressure. The process gas for the low pressure plasma is oxygen, hydrogen, nitrogen, argon, carbon dioxide, helium, methane, tetrafluoromethane, air and mixtures of the gases or metal/organic compounds as vapors. The process gas also preferably contains additional halogenized hydrocarbons and/or halogen/sulfur compounds e.g. sulfurhexafluoride. The low pressure plasma is at a pressure of 0.001-200.0 mbar and preferably 0.1-10.0 mbar and especially 0.5-1.0 mbar. An Independent claim is included for an assembly to clean textiles or yarns and/or surfaces, which has a reactor for the cleaning phase using a liquid and/or supercritical gas, followed by treatment with a low pressure plasma. Preferably, the reactor is structured for pressures of 30-500 bar and especially 40-450 bar.

    36.
    发明专利
    未知

    公开(公告)号：DK0631713T3

    公开(公告)日：1997-03-17

    申请号：DK93920519

    申请日：1993-03-17

    Applicant: LINDE AG

    Inventor： WANDKE ERNST

    IPC: B23K1/00 ,  B23K1/012 ,  B23K1/08 ,  H05K3/34

    Abstract: PCT No. PCT/EP93/00624 Sec. 371 Date Dec. 20, 1994 Sec. 102(e) Date Dec. 20, 1994 PCT Filed Mar. 17, 1993 PCT Pub. No. WO93/19575 PCT Pub. Date Sep. 30, 1993.The invention relates to a method for soldering electronic components to printed circuit boards or other elements to be connected by soldering, as well as suitable continuous soldering systems. The use of electronic modules, designed in the form of printed circuit boards populated with pluggable, mountable, or surface-mountable electronic components (Surface Mounted Devices, SMDs), which must be then soldered, is growing steadily. To manufacture these modules, suitably prepared printed circuit boards are populated with the corresponding components, the latter are held in place possibly with an adhesive or soldering paste in preparation for the soldering process, and finally the printed circuit boards and the components are connected together permanently and conductively by a soldering process. This soldering process is performed under low pressure and under the plasma action of a special process gas.

    37.
    发明专利
    未知

    公开(公告)号：ES2095079T3

    公开(公告)日：1997-02-01

    申请号：ES93920519

    申请日：1993-03-17

    Applicant: LINDE AG

    Inventor： WANDKE ERNST

    IPC: B23K1/00 ,  B23K1/012 ,  B23K1/08 ,  H05K3/34

    Abstract: PCT No. PCT/EP93/00624 Sec. 371 Date Dec. 20, 1994 Sec. 102(e) Date Dec. 20, 1994 PCT Filed Mar. 17, 1993 PCT Pub. No. WO93/19575 PCT Pub. Date Sep. 30, 1993.The invention relates to a method for soldering electronic components to printed circuit boards or other elements to be connected by soldering, as well as suitable continuous soldering systems. The use of electronic modules, designed in the form of printed circuit boards populated with pluggable, mountable, or surface-mountable electronic components (Surface Mounted Devices, SMDs), which must be then soldered, is growing steadily. To manufacture these modules, suitably prepared printed circuit boards are populated with the corresponding components, the latter are held in place possibly with an adhesive or soldering paste in preparation for the soldering process, and finally the printed circuit boards and the components are connected together permanently and conductively by a soldering process. This soldering process is performed under low pressure and under the plasma action of a special process gas.

    DEVICE AND METHOD FOR WAVE SOLDERING
    38.
    发明专利
    DEVICE AND METHOD FOR WAVE SOLDERING 未知

    公开(公告)号：MY165410A

    公开(公告)日：2018-03-21

    申请号：MYPI20070774

    申请日：2007-05-17

    Applicant: LINDE AG

    Inventor： M0XC4STELE JOHANN ,  WANDKE ERNST

    IPC: B23K3/06 ,  B23K1/08

    Abstract: THE INVENTION RELATES TO A DEVICE (1) FOR WAVE SOLDERING WORKPIECES (2), ENCOMPASSING MEANS FOR MOVING THE WORKPIECE (2) , WHICH IS TO BE SOLDERED, ALONG A SPECIFIC PATH ACROSS AT LEAST ONE SOLDER WAVE (10, 11) GENERATED ABOVE A SOLDER RESERVOIR (9), WITH A PROTECTIVE AND/OR ACTIVE GAS ATMOSPHERE OF A FIRST COMPOSITION BEING LOCATED ABOVE THE SOLDER RESERVOIR (9) SO AS TO LARGELY EXCLUDE OXYGEN AND WITH MEANS (14) FOR INTRODUCING THE PROTECTIVE AND/OR ACTIVE GAS AS WELL AS AN ENCLOSURE (8) BEING PROVIDED WITH THE ENCLOSURE (8) BEING CONFIGURED IN SUCH A MANNER THAT IT ENCLOSES AT LEAST THE ESSENTIAL PARTS OF A SOLDER ZONE (15), I.E. THE SOLDER WAVE (10, 11) AND THE SOLDER RESERVOIR (9) AT LEAST PARTIALLY AND WITH THE ENCLOSURE (8) BEING CONFIGURED IN SUCH A MANNER AND THE PATH RUNNING IN SUCH A MANNER THAT AT LEAST A PART OF THE WORKPIECE (2) COMES INTO CONTACT WITH AT LEAST A PART OF THE SOLDER WAVE (10, 11), CHARACTERIZED IN THAT, IN ADDITION TO THE SOLDER ZONE (15) PROVISION IS MADE FOR AT LEAST YET ANOTHER ZONE (5, 6), IN WHICH THE WORKPIECE (2) IS LOCATED BEFORE OR AFTER THE SOLDER TREATMENT AT LEAST FOR A SHORT TIME, WITH A HOUSING (3) BEING PROVIDED WHICH SURROUNDS THE ENCLOSURE (8) AND AT LEAST A FURTHER ZONE (5, 6) , AND PROVISION BEING MADE FOR MEANS (4) FOR INTRODUCING A PROTECTIVE AND/OR ACTIVE GAS ATMOSPHERE OF A SECOND COMPOSITION IN THE HOUSING (3), WITH THE ENCLOSURE (8) SURROUNDING THE PROTECTIVE AND/OR ACTIVE GAS ATMOSPHERE OF THE FIRST COMPOSITION AND THE PROTECTIVE AND/OR ACTIVE GAS ATMOSPHERE OF THE SECOND COMPOSITION SURROUNDING THE ENCLOSURE (8) AND THE HOUSING ( 3) SURROUNDING THE ENCLOSURE (8) AND THE PROTECTIVE AND/OR ACTIVE GAS ATMOSPHERE OF THE SECOND COMPOSITION. FURTHERMORE, THE .INVENTION RELATES TO A CORRESPONDING METHOD FOR WAVE SOLDERING.

Patent Agency Ranking