Abstract:
A method is provided for producing a light-emitting diode with the following steps: providing a carrier substrate (1), which has a silicon surface (1a), - depositing a series of layers (100) on the silicon surface (1a) in a direction of growth (R), and - depositing a light-emitting diode structure (16) on the series of layers (100), wherein - the series of layers (100) includes a GaN layer (5), which is formed with gallium nitride, - the series of layers includes a masking layer (12), which is formed with silicon nitride, and - the masking layer (12) follows at least part of the GaN layer (5) in the direction of growth (R).
Abstract:
The invention relates to an optoelectronic semiconductor chip having an active zone (20), comprising a multiple quantum well structure provided for the production of electromagnetic radiation, having a plurality of sequential quantum well layers (210, 220, 230). The multiple quantum well structure comprises at least one first quantum well layer (210) that is doped in an n-conductive fashion and disposed between two barrier layers (250) doped in an n-conductive fashion and adjacent to the first quantum well layer. Said quantum well structure comprises a second quantum well layer (220) that is undoped and is disposed between two barrier layers (250, 260) adjacent to the second quantum well layer, one of said layers being doped and the other being undoped. In addition, the multiple quantum well structure comprises at least one third quantum well layer (230) that is undoped and disposed between two undoped barrier layers (260) adjacent to the third quantum well layer.
Abstract:
The invention specifies a radiation detector (1) having a detector arrangement (2), which has a plurality of detector elements (4, 5, 6) which are used to obtain a detector signal (DS) during operation of the radiation detector, and having a control apparatus (3), wherein the detector elements each have a spectral sensitivity distribution (400, 500, 600) and are suitable for generating signals (S4, S5, S6), at least one detector element contains a compound semiconductor material and this detector element is designed to detect radiation in the visible spectral range, the radiation detector is designed in such a manner that the sensitivity distributions of the detector elements are used to form different spectral sensitivity channels (420, 520, 620) of the radiation detector, a channel signal (K4, K5, K6) which is assigned to the respective sensitivity channel can be generated in the sensitivity channels using the detector elements, and the control apparatus is designed in such a manner that the contributions of different channel signals to the detector signal of the radiation detector are controlled differently.
Abstract:
The invention relates to a semiconductor component having a semiconductor layer sequence (2) made of a nitridic composite semiconductor material on a substrate, wherein the substrate (1) comprises a silicon surface facing the semiconductor layer sequence (2), and the semiconductor layer sequence (2) comprises an active region (21) and at least one intermediate layer (3) made of an oxygen-doped AlN composite semiconductor material between the substrate (1) and the active region (21). The invention further relates to a method for producing a semiconductor component.
Abstract:
The invention relates to a semiconductor component (1), comprising a semiconductor body (2), which is based on a nitride compound semiconductor material, and a substrate (3), on which the semiconductor body is disposed. Impurities are deliberately formed in the substrate. The invention further relates to a substrate and to a method for producing a semiconductor layer sequence (20) for a semiconductor component (1).
Abstract:
A composite substrate (1) for a semiconductor chip (6) is specified. The composite substrate (1) comprises a first outer layer (2), which contains a semiconductor material, a second outer layer (4), and a core layer (3), which is arranged between the first outer layer (2) and the second outer layer (4), wherein the core layer (3) has a greater coefficient of thermal expansion than the outer layers (2, 4). Furthermore, an optoelectronic semiconductor chip (6) with such a composite substrate (1) is specified.