公开(公告)号：US20150027218A1

公开(公告)日：2015-01-29

申请号：US14235778

申请日：2012-07-25

Applicant: Sandrine Rancien ,  Celine Desnous

Inventor： Sandrine Rancien ,  Celine Desnous

IPC: G06T1/00 ,  G01N33/34 ,  G01N21/64 ,  G01N29/04 ,  B42D25/30 ,  B42D25/405

CPC classification number: G06T1/0042 ,  B42D25/30 ,  B42D25/405 ,  D21H21/46 ,  D21H21/48 ,  G01N21/64 ,  G01N29/041 ,  G01N33/346 ,  G01N2201/062 ,  G01N2291/0237 ,  G06T2201/0201 ,  Y10T428/28

Abstract: A security substrate may include at least one area for authentication and/or for revealing attempts at forgery using solvents. The at least one area may include individualized polymer- or copolymer-based particles comprising at least one visible or detectable marker. The polymer or copolymer may be at least partially soluble in solvents used for forgery.

Abstract translation: 安全基板可以包括用于认证的至少一个区域和/或用于揭示使用溶剂的伪造尝试。 所述至少一个区域可以包括包含至少一个可见或可检测标记的个体化聚合物或共聚物基颗粒。 聚合物或共聚物可以至少部分溶于用于伪造的溶剂中。

公开(公告)号：US20120104102A1

公开(公告)日：2012-05-03

申请号：US13263680

申请日：2010-04-12

Applicant: Sandrine Rancien ,  Thibault Le Loarer ,  Pascal Marlin

Inventor： Sandrine Rancien ,  Thibault Le Loarer ,  Pascal Marlin

IPC: G06K19/077 ,  G06K19/02 ,  B32B38/14 ,  B32B3/00

CPC classification number: B42D25/333 ,  B41M3/10 ,  B42D25/21 ,  B42D25/23 ,  B42D25/24 ,  B42D25/351 ,  B42D25/364 ,  B42D25/378 ,  B42D2033/30 ,  B42D2035/24 ,  G06K19/025 ,  G06K19/07722 ,  G06K19/07749 ,  Y10T428/24802

Abstract: The present invention relates to a sectional document (100) comprising: —a support (101) that defines at least two sections (101a, 1010b) connected by at least one fold line (102), —a structure linked to the support (101), especially at the fold line (102), with a possibility of movement relative to the latter and extending at least partially between the two sections (101a, 101b) when the sectional document is folded, the structure comprising: —a fibrous layer (103a, 103b, 104a, 104b), —a substructure (120) comprising a translucent region, —a watermark or pseudo-watermark (10a) borne by the fibrous layer and being superposed at least partially at the translucent region of the substructure, so that the watermark or pseudo-watermark can be observed in light transmitted through the structure, at the translucent region of the substructure, only from the face of the structure situate on the side of the fibrous layer.

Abstract translation: 本发明涉及一种分段文件（100），包括： - 一个支撑件（101），其限定由至少一个折叠线（102）连接的至少两个部分（101a，1010b）， - 连接到所述支撑件 ），特别是在折叠线（102）处，具有相对于后者移动的可能性，并且当部分文档被折叠时至少部分地在两个部分（101a，101b）之间延伸，该结构包括： - 纤维层 103a，103b，104a，104b）， - 包括半透明区域的子结构（120），由纤维层承载并至少部分地叠置在子结构的半透明区域的水印或伪水印（10a），因此 可以在透射结构的光中观察到水印或伪水印，在子结构的半透明区域，只有结构的表面位于纤维层的侧面。

公开(公告)号：US20110215563A1

公开(公告)日：2011-09-08

申请号：US13000898

申请日：2009-06-22

Applicant: Sandrine Rancien ,  Thibaut Le Loarer ,  Gaetan Le Gouic

Inventor： Sandrine Rancien ,  Thibaut Le Loarer ,  Gaetan Le Gouic

IPC: B42D15/00

CPC classification number: B42D25/333 ,  B42D25/00 ,  B42D25/351 ,  B42D2033/06 ,  B42D2033/28 ,  B42D2033/30 ,  B42D2033/46 ,  B42D2035/36 ,  G06K19/025 ,  G06K19/07749 ,  G06K19/10 ,  G06K19/16

Abstract: The invention provides a structure comprising: a fiber layer; a sub-structure including a translucent region; a watermark or pseudo-watermark carried by the fiber layer and superposed at least in part with the translucent region of the sub-structure, such that, in the translucent region of the sub-structure, the watermark or pseudo-watermark is observable in light transmitted through the structure only from the face of the structure that is adjacent to the fiber layer; and an integrated microcircuit device for communicating with or without contact.

Abstract translation: 本发明提供一种结构，包括：纤维层; 包括半透明区域的子结构; 由纤维层承载的水印或伪水印，至少部分地与子结构的半透明区域重叠，使得在子结构的半透明区域中，水印或伪水印在光中是可观察的 仅从与纤维层相邻的结构的表面透过结构; 以及用于与或不具有接触通信的集成微电路设备。

公开(公告)号：US20100282855A1

公开(公告)日：2010-11-11

申请号：US12805166

申请日：2010-07-15

Applicant: Sandrine Rancien ,  Thierry Mayade

Inventor： Sandrine Rancien ,  Thierry Mayade

IPC: G06K19/07 ,  B42D15/10

CPC classification number: G06K19/07758 ,  B42D25/24 ,  G06K19/025 ,  G06K19/027 ,  G06K19/07728 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2924/0002 ,  Y10T156/1039 ,  H01L2924/00

Abstract: The invention relates to a multilayer structure such as a cover paper for a booklet, in particular a passport. The structure includes a radiofrequency identification device having a chip which is received in the thickness of the multilayer structure without generating extra thickness, the materials constituting the various layers of the multilayer structure are selected, as are the thicknesses of said layers, in such a manner that the cover withstands mechanical and thermal shocks, and in particular is capable of being subjected to graining treatment, and/or to decoration treatment by depositing a film by hot transfer under pressure, and/or to lamination treatment while depositing security films.

Abstract translation: 本发明涉及一种多层结构，例如小册子的封面纸，特别是护照。 该结构包括射频识别装置，其具有以多层结构的厚度接收的芯片，而不产生额外的厚度，选择构成多层结构的各个层的材料以及所述层的厚度，以这样的方式 特别是能够承受机械和热冲击，并且特别是能够进行磨粒处理，和/或通过在压力下热转印来沉积膜和/或在沉积安全膜的同时进行层压处理来进行装饰处理。

公开(公告)号：US07429308B2

公开(公告)日：2008-09-30

申请号：US10472828

申请日：2002-07-30

Applicant: Sandrine Rancien ,  Jacques Terliska

Inventor： Sandrine Rancien ,  Jacques Terliska

IPC: D21H21/42 ,  G06K19/077

CPC classification number: G07F7/086 ,  D21H21/48 ,  G06K19/022 ,  G06K19/07743 ,  G06K19/07749 ,  G07D7/01

Abstract: The present invention provides a method of manufacturing an article comprising a fiber layer and at least one electronic chip, the fiber layer being formed by depositing fibers on a surface immersed in a dispersion of fiber material. The method includes the following step:Using an elongate flexible support to bring the electronic chip into contact with the fiber layer that is being formed.

公开(公告)号：US20080202715A1

公开(公告)日：2008-08-28

申请号：US12081910

申请日：2008-04-23

Applicant: Sandrine Rancien ,  Jacques Terliska

Inventor： Sandrine Rancien ,  Jacques Terliska

IPC: D21H21/00

CPC classification number: G07F7/086 ,  D21H21/48 ,  G06K19/022 ,  G06K19/07743 ,  G06K19/07749 ,  G07D7/01

Abstract: The present invention provides a method of manufacturing an article comprising a fiber layer and at least one electronic chip, the fiber layer being formed by depositing fibers on a surface immersed in a dispersion of fiber material. The method includes the following step: Using an elongate flexible support to bring the electronic chip into contact with the fiber layer that is being formed.

Abstract translation: 本发明提供一种制造包含纤维层和至少一个电子芯片的制品的方法，所述纤维层通过在浸渍在纤维材料分散体中的表面上沉积纤维而形成。 该方法包括以下步骤：使用细长的柔性支撑件使电子芯片与正在形成的纤维层接触。