公开(公告)号：JPH0663788A

公开(公告)日：1994-03-08

申请号：JP21525392

申请日：1992-08-12

Applicant: SHOWA DENKO KK

Inventor： UTSUNOMIYA MASAHIDE ,  SHOJI TAKASHI

IPC: B23K35/22 ,  B23K35/363

Abstract: PURPOSE:To provide the cream solder which is extremely less changed with lapse of time, can be applied stably over a long period of time, can maintain adhesive power even when rested over a long period of time after application, has good solderability and less generates solder balls. CONSTITUTION:This cream solder is prepd. by kneading a flux and solder powder and incorporating 0.01 to 6wt.% 12 to 30C dicarboxylic acid which is solid at ordinary temp. and is subjected to ring opening and its salt therein.

公开(公告)号：JPH04100692A

公开(公告)日：1992-04-02

申请号：JP21449990

申请日：1990-08-14

Applicant: SHOWA DENKO KK

Inventor： UTSUNOMIYA MASAHIDE ,  SHOJI TAKASHI

IPC: B23K35/22 ,  B23K35/363 ,  C01B7/09 ,  C07C211/06

Abstract: PURPOSE:To obtain the cream solder having excellent solderability and low corrosiveness by incorporating isopropylamine hydrobromide as the activator in a flux into the cream solder formed by kneading a flux and solder powder. CONSTITUTION:The effect of an activator is exhibited and the low corrosive cream solder is obtd. without requiring the addition of an activator of an amine hydrochloride system if the IPA-HBr is compounded with the cream solder. This cream solder contains 87 to 93% powder solder, 1 to 6% resin, 1 to 8% solvent, 0.1 to 1.0 thixo agent, and 0.01 to 0.2% isopropylamine hydrobromide. Rosins, for example, polymerized rosins, natural rosins, etc., are used as the resin. An org. solvent is usable as the solvent. Hardened castor oil, coconut oil, etc., are used as the thixo agent. The need for washing after soldering is eliminated by adding the IPA-HBr to the activator. The workability and productivity in a packaging line are greatly improved in this way.

公开(公告)号：JPH0477369A

公开(公告)日：1992-03-11

申请号：JP18749390

申请日：1990-07-16

Applicant: SHOWA DENKO KK

Inventor： SHOJI TAKASHI ,  HAGIWARA MASARU ,  KAWACHI TSUNEO ,  UTSUNOMIYA MASAHIDE ,  SHIBUE YOSHIHIRO

IPC: B32B15/04 ,  C04B37/02 ,  H01L23/12 ,  H01L23/15 ,  H05K3/00

Abstract: PURPOSE:To improve the cracking resistance of a metal-ceramic laminated substrate by making a binder layer interposed between a metallic sheet and a ceramic substrate larger than the metallic sheet and relieving stress. CONSTITUTION:A binder 3 contg. an active metal is spread on the surface of a ceramic substrate 1 so that the resulting binder layer is made larger than a metallic material 2. This metallic material 2 is stuck to the substrate 1, pressed and heated to obtain a metal-ceramic laminated substrate. The thermal shock resistance, that is, cracking resistance of the laminated substrate is remarkably improved.