Cutting element with a region devoid of catalyst

    公开(公告)号:GB2422394A

    公开(公告)日:2006-07-26

    申请号:GB0601440

    申请日:2006-01-25

    Abstract: A cutting element includes an upper most layer 32, having an outer region 34 which is free from catalyst material. Said upper most region 34 being formed from diamond, cubic boron nitride or mixtures thereof. An intermediate layer 38, consisting bonded crystals of ultrahard material is also present which has a wear resistance less than the upper most layer 32. In an alternative embodiment, said outer region 34 may have increased thermal stability and be formed from diamond grains greater than 20 micrometers.

    Ultra hard material cutter with a shaped cutting surface

    公开(公告)号:GB2403967A

    公开(公告)日:2005-01-19

    申请号:GB0415203

    申请日:2001-11-21

    Abstract: A cutting element comprises a substrate 2 having an interface surface 3, and an ultra hard material layer 4 coupled to the interface surface 3 and having an exposed surface 5. A main depression 12 is formed on the exposed surface 5 of the ultra hard material 4, and is extending radially outward to the periphery of the ultra hard material layer 4. A plurality of secondary depressions 38 are formed on the ultra hard material layer 4 and are abutting and surrounding the main depression 12, and each secondary depression 38 is abutting another. The main depression 12 has a maximum depth, and each secondary depression 38 has a maximum depth shallower than the maximum depth of the main depression 12.

    Semiconductive polycrystalline diamond.

    公开(公告)号:ZA200301565B

    公开(公告)日:2003-09-16

    申请号:ZA200301565

    申请日:2003-02-26

    Abstract: An ultra-hard semiconductive polycrystalline diamond (PCD) material formed with semiconductive diamond particles doped with Li, Be or Al and/or insulative diamond particles having semiconductive surfaces, tools incorporating the same, and methods for forming the same, are provided. The ultra-hard PCD material may be formed using a layer of insulative diamond grit feedstock that includes additives therein, then sintering to convert a plurality of the diamond crystals to include a semiconductive surface. In another embodiment, the ultra-hard PCD material is formed by sintering semiconductive diamond grit feedstock consisting of diamond crystals doped with Li, Al or Be. The ultra-hard semiconductive PCD cutting layer exhibits increased cuttability, especially in EDM and EDG cutting operations.

    POLYCRYSTALLINE DIAMOND CARBIDE COMPOSITES

    公开(公告)号:CA2340382A1

    公开(公告)日:2001-09-09

    申请号:CA2340382

    申请日:2001-03-09

    Abstract: Polycrystalline diamond (PCD) carbide composites of this invention have a microstructure comprising a plurality of granules formed from PCD, polycrystalline cubic boron nitride, or mixture thereof, that are distributed within a substantially continuous second matrix region that substantially surrounds the granules and that is formed from a cermet material. In an example embodiment, the granules are polycrystalline diamond and the cermet material is cemented tungsten carbide. PCD carbide composites of this invention display improved properties of fracture toughness and chipping resistance, without substantially compromising wear resistance, when compared to conventional pure PCD materials.

Patent Agency Ranking