公开(公告)号：US09202766B2

公开(公告)日：2015-12-01

申请号：US13871861

申请日：2013-04-26

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Gaetano Pignataro ,  Maurizio Maria Ferrara

IPC: H01L23/34 ,  H01L25/07 ,  H01L23/433 ,  H01L23/492 ,  H01L23/495

CPC classification number: H01L23/34 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L25/074 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A power device includes a chip of semiconductor material and a further chip of semiconductor material on each of which at least one power transistor is integrated; each chip comprises a first conduction terminal on a first surface, and a second conduction terminal and a control terminal on a second surface opposite the first surface, and an insulating body embedding said chip and said further chip. In the solution according to one or more embodiments of the present disclosure, the first surface of said chip faces the second surface of said further chip, and the power device further comprises a first heat-sink arranged between said chip and said further chip and electrically coupled with the first conduction terminal of said chip and with the second conduction terminal of said further chip, the control terminal of said further chip being electrically insulated from the first heat-sink.

Abstract translation: 功率器件包括半导体材料芯片和另外的半导体材料芯片，其中至少一个功率晶体管被集成在其中; 每个芯片包括在第一表面上的第一导电端子，以及在与第一表面相对的第二表面上的第二导电端子和控制端子，以及嵌入所述芯片和所述另外的芯片的绝缘体。 在根据本公开的一个或多个实施例的解决方案中，所述芯片的第一表面面向所述另外的芯片的第二表面，并且功率器件还包括布置在所述芯片和所述另外的芯片之间的第一散热器， 与所述芯片的第一导电端子和所述另外芯片的第二导电端子耦合，所述另外芯片的控制端子与第一散热器电绝缘。

公开(公告)号：US09159644B2

公开(公告)日：2015-10-13

申请号：US13629156

申请日：2012-09-27

Applicant: STMicroelectronics S.r.l.

Inventor： Tommaso Casabianca ,  Cristiano Gianluca Stella

IPC: H01L23/433 ,  H01L23/495 ,  H01L21/56 ,  A01B1/00

CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L23/49562 ,  H01L2224/48091 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A DSC type device manufacturing process includes placing a circuit assembly in a mold. The circuit assembly includes a first heat sink, a semiconductor chip mounted on the first heat sink, a second heat sink mounted on the semiconductor chip and a pin block electrically connected to the semiconductor chip. An outer surface of the first heat sink and an outer surface of the pin block are placed in contact with a first inner surface of the mold. A spacer insert is placed in contact with, and positioned between, a second inner surface of the mold and an outer surface of the second heat sink. The mold is filled with an insulating material that is subsequently hardened. After hardening, a resulting device is extracted from the mold with the outer surfaces of the first heat sink, the pin block and the second heat sink exposed.

Abstract translation: DSC型器件制造工艺包括将电路组件放置在模具中。 电路组件包括第一散热器，安装在第一散热器上的半导体芯片，安装在半导体芯片上的第二散热器和与半导体芯片电连接的引脚块。 第一散热器的外表面和销块的外表面与模具的第一内表面接触。 间隔件插入件放置成与模具的第二内表面和第二散热器的外表面接触并定位在模具的第二内表面之间。 模具填充有随后硬化的绝缘材料。 硬化后，从第一散热器，销块和第二散热片的外表面暴露出来，从模具中取出所得装置。

公开(公告)号：US09012787B2

公开(公告)日：2015-04-21

申请号：US13626229

申请日：2012-09-25

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Rosalba Cacciola

IPC: H05K1/16 ,  H05K3/34 ,  H05K1/11 ,  H05K3/30

CPC classification number: H05K3/3468 ,  H01L2224/73203 ,  H01L2924/13091 ,  H05K1/111 ,  H05K3/305 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2203/044 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for mounting to the board includes insulating windows that define gluing sites within one or more pins. An electronic system is formed by one or more of such surface mount technology electronic devices mounted to electronic board. The devices are attached using a wave soldering technique that flows through channels formed by the sunken conductive traces.

Abstract translation: 电子板包括具有相对于板的胶合表面至少部分凹陷的上表面的导电迹线。 用于安装到板上的表面贴装技术电子器件包括限定一个或多个引脚内的胶合位置的绝缘窗。 电子系统由安装到电子板的一种或多种这样的表面贴装技术电子装置形成。 这些装置使用波峰焊技术连接，该技术流过由凹陷的导电迹线形成的通道。

公开(公告)号：US20130154155A1

公开(公告)日：2013-06-20

申请号：US13629156

申请日：2012-09-27

Applicant: STMicroelectronics S.r.l.

Inventor： Tommaso Casabianca ,  Cristiano Gianluca Stella

IPC: B29C45/14

CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L23/49562 ,  H01L2224/48091 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A DSC type device manufacturing process includes placing a circuit assembly in a mold. The circuit assembly includes a first heat sink, a semiconductor chip mounted on the first heat sink, a second heat sink mounted on the semiconductor chip and a pin block electrically connected to the semiconductor chip. An outer surface of the first heat sink and an outer surface of the pin block are placed in contact with a first inner surface of the mold. A spacer insert is placed in contact with, and positioned between, a second inner surface of the mold and an outer surface of the second heat sink. The mold is filled with an insulating material that is subsequently hardened. After hardening, a resulting device is extracted from the mold with the outer surfaces of the first heat sink, the pin block and the second heat sink exposed.

Abstract translation: DSC型器件制造工艺包括将电路组件放置在模具中。 电路组件包括第一散热器，安装在第一散热器上的半导体芯片，安装在半导体芯片上的第二散热器和与半导体芯片电连接的引脚块。 第一散热器的外表面和销块的外表面与模具的第一内表面接触。 间隔件插入件放置成与模具的第二内表面和第二散热器的外表面接触并定位在模具的第二内表面之间。 模具填充有随后硬化的绝缘材料。 硬化后，从第一散热器，销块和第二散热片的外表面暴露出来，从模具中取出所得装置。

公开(公告)号：US08453917B1

公开(公告)日：2013-06-04

申请号：US13655555

申请日：2012-10-19

Applicant: STMicroelectronics S.r.l.

Inventor： Concetto Privitera ,  Cristiano Gianluca Stella

IPC: B23K31/02

CPC classification number: H05K3/3468 ,  H05K1/0206 ,  H05K1/112 ,  H05K3/303 ,  H05K3/3431 ,  H05K2201/09836 ,  H05K2201/10166 ,  H05K2203/044 ,  Y02P70/613

Abstract: A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board.

Abstract translation: 一种系统包括表面安装型的装置，其具有设置有安装表面的绝缘封套和暴露在安装表面上的接触销。 该装置附接到包括胶合表面和相对表面的绝缘板。 制造该系统的方法包括在胶合表面上形成通孔的接触区域。 安装表面胶合到胶合表面，接触销与接触区域对准。 进行波峰焊接以通过用焊膏波撞击相对表面来将该装置电连接到板上，通过毛细作用形成通过在通孔中上升至焊接表面上的溢流的焊膏的导电接触 通过焊接连接将电子设备的接触针电连接到电子板的接触区域。