公开(公告)号：US6437240B2

公开(公告)日：2002-08-20

申请号：US75789701

申请日：2001-01-10

Applicant: TESSERA INC

Inventor： SMITH JOHN W

IPC: H01L21/56 ,  H01L23/055 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01L23/28 ,  H01L23/34

CPC classification number: H01L24/10 ,  H01L21/563 ,  H01L23/055 ,  H01L23/48 ,  H01L23/49816 ,  H01L24/13 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/14181 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8192 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A method of making a microelectronic assembly includes providing a first microelectronic element and a second microelectronic element with confronting, spaced-apart surfaces defining a space therebetween and providing one or more masses of a fusible conductive material having a melting temperature below about 150° C. in said space, whereby the fusible conductive masses connect the first and second microelectronic elements to one another. Next, a flowable material is introduced between the confronting surfaces of the first and second microelectronic elements and around the one or more fusible conductive masses and the flowable material is then cured to provide a compliant layer disposed between said confronting surfaces and intimately surrounding each fusible conductive mass. The fusible conductive masses are capable of electrically interconnecting the contacts on microelectronic elements confronting one another and/or conducting heat between confronting microelectronic elements.

Abstract translation: 制造微电子组件的方法包括提供第一微电子元件和第二微电子元件，所述第一微电子元件和第二微电子元件具有在其间限定空间的相对间隔的表面，并且提供熔融温度低于约150℃的一个或多个可熔导电材料质量。 在所述空间中，由此可熔导电块将第一和第二微电子元件彼此连接。 接下来，将可流动材料引入到第一和第二微电子元件的相对表面之间并且围绕一个或多个可熔导电块，并且然后将可流动材料固化以提供设置在所述相对表面之间并且紧密围绕每个可熔导电 质量 可熔电导体能够将彼此面对的微电子元件上的触点和/或相对的微电子元件之间的热传导互连。