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    MOUNTING STRUCTURE OF MICROELECTRONIC ELEMENT AND ITS MANUFACTURE
    5.
    发明专利
    MOUNTING STRUCTURE OF MICROELECTRONIC ELEMENT AND ITS MANUFACTURE 失效

    公开(公告)号：JPH10256314A

    公开(公告)日：1998-09-25

    申请号：JP552498

    申请日：1998-01-14

    Applicant: TESSERA INC

    Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W

    IPC: H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40

    Abstract: PROBLEM TO BE SOLVED: To provide a high-performance connecting part for microelectronics. SOLUTION: A connecting part is provided with an insulating sheet (first element) 34 carrying a plurality of leads arranged on the surface of the sheet 34 in the form of a surface array. Each lead 60 has a terminal-side end section 66 fixed to the sheet 34 and a front-side end section 68 which can be separated from the sheet 34. The front-side end section 68 of the lead 60 is attached to another insulating sheet 34, a semiconductor wafer (second element), etc. The leads 60 are deformed in bent shapes having heights in the vertical direction by relatively moving the first and second elements against each other. When the connecting parts are used, a semiconductor chip assembly can be constituted. The assembly is composed of a plurality of contacts arranged on a chip in the form of a surface array, a plurality of terminals which are arranged on the insulating sheet 34 in the form of a surface array, and a plurality of S- shaped metallic ribbons which respectively connect the terminals to the contacts. It is possible to provide an easily deformable insulating material around the leads 60 between the sheet 34 and the chip.

    Compliant thermal connectors, methods and assemblies
    7.
    发明专利
    Compliant thermal connectors, methods and assemblies 未知

    公开(公告)号：AU4406996A

    公开(公告)日：1996-06-17

    申请号：AU4406996

    申请日：1995-11-16

    Applicant: TESSERA INC

    Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W

    IPC: H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H05K7/20

    Abstract: A thermal connector for conducting heat from microelectronic components such as semiconductor chips to a heat sink. The connector includes a large number of flexible thermal conductors desirably formed as elongated "S"-shaped strips or ribbons. The conductors can flex to accommodate tolerances in the assembly and displacement of the components caused by thermal expansion. The conductors may have relatively thin neck sections to increase the flexibility of the conductors, The connector may be fabricated by a process which includes fabrication of the conductors as flat strips, bonding of the conductors to a pair of opposed planar sheets and vertically moving the sheets away from one another to expand the conductors vertically to their final three-dimensional configuration.

    Microelectronic lead structures with dielectric layers
    10.
    发明专利
    Microelectronic lead structures with dielectric layers 未知

    公开(公告)号：AU7161596A

    公开(公告)日：1997-04-09

    申请号：AU7161596

    申请日：1996-09-18

    Applicant: TESSERA INC

    Inventor： FJELSTAD JOSEPH ,  SMITH JOHN W

    IPC: H05K1/18 ,  H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01R12/04 ,  H05K1/02

    Abstract: A microelectronic connection component has flexible leads formed by polymeric strips with metallic conductors thereon. The metallic conductors may be very thin, desirably less than 5 microns thick, and provide good fatigue resistance. Each strip may have two conductors thereon, one serving as a principal or signal conductor for connection to a contact on a chip or other microelectronic element and the other serving as potential reference or ground conductor. The potential reference conductor on the lead provides enhanced resistance to crosstalk.

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