Abstract:
PROBLEM TO BE SOLVED: To provide an electric circuit board having a built-in passive element that incorporates a capacitive element having satisfactory precision in capacity, and a resistive element adjusted precisely by trimming in the electric circuit board having a built-in passive element, where the capacitive element and resistive element of the passive element are formed in a wiring board in advance, and to provide a method for manufacturing the electric circuit board with a built-in passive element that can ensure reliability and yields, can select a material whose characteristics are satisfactory in the capacitive element, and has such a structure. SOLUTION: The electric circuit board incorporates the capacitive element and resistive element. The capacitive element comprises a sheet-like dielectric layer; a first capacitive element electrode of a lower layer for clamping the dielectric layer; and a second capacitive element electrode of an upper layer of the dielectric layer. The resistive element comprises a pair of resistive element electrodes and a resistor for connecting the resistive element electrodes. In this case, the second capacitive element electrode and the pair of resistive element electrodes are formed on the surface of the dielectric layer, and the interface between the dielectric layer and the resistor is flat. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board in which, variations of a film thickness and the width of a resistance member are reduced, the accuracy of a resistance value is enhanced, and the resistance of the resistance member is enabled to increase, in the method for manufacturing the wiring board in which the resistance element is contained. SOLUTION: The wiring board having a member which has metal foil on one face of the resistance member and a wiring layer is adhered to wiring so that the resistance member side of the member comes into contact with a semi-curing insulating resist layer through the semi-curing insulating resist layer, and the photoresist pattern of a portion to be the wiring is formed on the surface of the metal foil, exfoliated, and formed as the wiring. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method for ensuring both capacity control and connection reliability of a passive element built-in a printed wiring board, concretely, a capacitor or a resistance element, and for manufacturing the printed wiring board with a built-in element of such a structure. SOLUTION: In the printed wiring board with one or more built-in passive elements formed of a pair of element electrodes and a functional material disposed therebetween, at least one of the pair of element electrodes and a wiring circuit are provided on the same insulator layer, and the element electrode is thinner than the wiring circuit. COPYRIGHT: (C)2005,JPO&NCIPI