公开(公告)号：JP2002246682A

公开(公告)日：2002-08-30

申请号：JP2001372217

申请日：2001-12-06

Applicant: XEROX CORP

Inventor： SUN DECAI ,  ROSA MICHEL A

IPC: B81B7/02 ,  B81C3/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/183 ,  H01S5/42 ,  H05K1/18 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive laser-incorporated micro electric/mechanical mechanism with high reliability by applying a flip chip method. SOLUTION: A first laser bonding pad 28 positioned on the first side of a laser 26 is arranged in adjacent to a first substrate bonding pad 14 at the upper face of the micro electric/mechanical mechanism substrate 10. A second laser bonding pad positioned on the second side of the laser 26 is disposed in adjacent to a second substrate bonding pad 18. A first solder connection part 38 which is brought into contact with the first substrate bonding pad 14 and the first laser bonding pad 28, and a second solder connection part 40 which is brought into contact with the second substrate bonding pad 18 and the second laser bonding pad are fused by solder reflow.

公开(公告)号：JP2002233997A

公开(公告)日：2002-08-20

申请号：JP2001356890

申请日：2001-11-22

Applicant: XEROX CORP

Inventor： ROSA MICHEL A ,  SUN DECAI

IPC: B81B3/00 ,  B81B7/00 ,  G02B6/12 ,  G02B26/08

Abstract: PROBLEM TO BE SOLVED: To provide a microhinge provided with mechanical reliability and strength necessary for out-of-a plane rotation and motion in a vertical direction of a SOI device layer structure, and of a simple structure and low cost. SOLUTION: A micro-electromechanical assembly 18 comprises an out-of-plane device (for example a mirror) 22 formed in a single crystal silicon device layer in a silicon-on-insulator substrate and a flexible ribbon structure 20 formed in the device layer. The out-of-plane device 22 and the ribbon structure are integrated. The ribbon structure 20 has width or depth smaller than those of the out-of-plane device 22. One end of the out-of-plane device 22 and one end of the ribbon structure 20 are connected at a point.

公开(公告)号：JP2002219698A

公开(公告)日：2002-08-06

申请号：JP2001356891

申请日：2001-11-22

Applicant: XEROX CORP

Inventor： SUN DECAI ,  ROSA MICHEL A

IPC: G02B26/08 ,  B81B3/00 ,  B81B7/00

Abstract: PROBLEM TO BE SOLVED: To connect electrically a hinge component to a micro device by simple constitution. SOLUTION: The present invention provides a micro device formed on or in a device layer in a single crystal silicon substrate, and ribon structure (a ribon hinge) 42 used as one portion of a micro assembly. The ribon structure 42 is formed in the device layer as the micro device. A thickness of the ribon structure 42 is thinner than that of the micro device. A conductive material 65 is deposited on a surface of the ribon structure. The first end of the micro assembly and the first end of the ribon structure 42 are connected each other when realized as the one portion of the micro assembly. The ribon structure 42 and an off-plane device are integrated thereby as one component.

公开(公告)号：JP2002162581A

公开(公告)日：2002-06-07

申请号：JP2001286786

申请日：2001-09-20

Applicant: XEROX CORP

Inventor： PEETERS ERIC ,  ROSA MICHEL A

IPC: G02B26/08 ,  G02B5/08 ,  G02B6/35 ,  G02B7/182

Abstract: PROBLEM TO BE SOLVED: To obtain an optical switch, using a reflection MEMS mirror. SOLUTION: An optical cross-connect system involves the general concept of a two-dimensional array of MEMS tilt mirrors, used to direct light, coming from a first optical fiber to a second optical fiber. Each MEMS tilt mirror in the two-dimensional array can tilt about two non-colinear axes and is suspended by plural suspension arms attached to a silicon substrate.

公开(公告)号：JP2002162579A

公开(公告)日：2002-06-07

申请号：JP2001286595

申请日：2001-09-20

Applicant: XEROX CORP

Inventor： ROSA MICHEL A ,  PEETERS ERIC

IPC: B81B3/00 ,  G02B6/35 ,  G02B26/08

Abstract: PROBLEM TO BE SOLVED: To obtain an optical switch, using a reflection MEMS mirror. SOLUTION: An optical cross-connect system involves the general concept of a two-dimensional array of MEMS tilt mirrors, used to direct light, coming from a first optical fiber to a second optical fiber. Each MEMS tilt mirror in the two-dimensional array can undergo tilt-rotation about its axes on two non-colinear lines and is suspended by plural suspension arms attached to a silicon substrate on an insulator.

公开(公告)号：JP2002156593A

公开(公告)日：2002-05-31

申请号：JP2001286788

申请日：2001-09-20

Applicant: XEROX CORP

Inventor： PEETERS ERIC ,  ROSA MICHEL A

IPC: G02B26/08 ,  B81B3/00 ,  G02B6/35

Abstract: PROBLEM TO BE SOLVED: To provide an optical switch using reflection MEMS mirrors. SOLUTION: An optical crossconnection system directs the incident light from a first optical fiber toward a second optical fiber by using a two-dimensional array of the MEMS tilting mirrors as a general concept. The respective MEMS tilting mirrors of the two-dimensional array tilt and rotate around two non-identical lines and are hung by plural suspension arms mounted to substrate of silicon on insulator.