公开(公告)号：EP1301827A4

公开(公告)日：2003-07-09

申请号：EP01935209

申请日：2001-05-10

Applicant: XEROX CORP

Inventor： CHUA CHRISTOPHER L ,  LEMMI FRANCESCO ,  VAN SCHUYLENBERGH KOENRAAD F ,  LU JENG PING ,  FORK DAVID K ,  PEETERS ERIC ,  SUN DECAI ,  SMITH DONALD L ,  ROMANO LINDA T

IPC: H01F41/04 ,  G01R1/067 ,  G01R3/00 ,  G03C5/00 ,  H01F17/00 ,  H01F17/02 ,  H01F27/29 ,  H01L21/02 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/522 ,  H01R9/03 ,  H05K7/02 ,  G03C5/56 ,  G03C5/58 ,  G03F7/00 ,  H01L21/027 ,  H01L33/00

CPC classification number: H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.

Abstract translation: 可用于片上集成高Q电感器和变压器的面外微结构将磁场方向置于平行于衬底（14）平面的位置，而不需要高纵横比处理。 光刻构图的线圈结构包括具有固有应力分布的弹性构件（61a）。 本征应力分布使自由部分（11）远离形成环形绕组（142）的衬底（14）。 锚定部分（12）保持固定到基底（14）。 自由部分端变成可以通过焊接或电镀连接到基板（14）的第二固定部分（61c）。 一系列单独的线圈结构（140）可以通过它们的锚固部分连接以形成电感器和变压器。

公开(公告)号：DE60142714D1

公开(公告)日：2010-09-09

申请号：DE60142714

申请日：2001-05-10

Applicant: XEROX CORP

Inventor： CHUA CHRISTOPHER L ,  LEMMI FRANCESCO ,  SCHUYLENBERGH KOENRAAD F ,  LU JENG PING ,  FORK DAVID K ,  PEETERS ERIC ,  SUN DECAI ,  SMITH DONALD L ,  ROMANO LINDA T

IPC: G03C5/56 ,  H01F41/04 ,  G01R1/067 ,  G01R3/00 ,  G03C5/00 ,  G03C5/58 ,  G03F7/00 ,  H01F17/00 ,  H01F17/02 ,  H01F27/29 ,  H01L21/02 ,  H01L21/027 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/522 ,  H01L33/00 ,  H01R9/03 ,  H05K7/02

公开(公告)号：DE60122343D1

公开(公告)日：2006-09-28

申请号：DE60122343

申请日：2001-05-10

Applicant: XEROX CORP

Inventor： CHUA L ,  LEMMI FRANCESCO ,  VAN SCHUYLENBERGH F ,  LU PING ,  FORK K ,  PEETERS ERIC ,  SUN DECAI ,  SMITH L ,  ROMANO T

IPC: G03C5/56 ,  H01F41/04 ,  G01R1/067 ,  G01R3/00 ,  G03C5/00 ,  G03C5/58 ,  G03F7/00 ,  H01F17/00 ,  H01F17/02 ,  H01F27/29 ,  H01L21/02 ,  H01L21/027 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/522 ,  H01L33/00 ,  H01R9/03 ,  H05K7/02

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.

公开(公告)号：DE69919442D1

公开(公告)日：2004-09-23

申请号：DE69919442

申请日：1999-04-28

Applicant: XEROX CORP

Inventor： HOFSTETTER DANIEL ,  DUNNROWICZ CLARENCE J ,  SUN DECAI ,  BRINGANS ROSS D ,  KNEISSL MICHAEL A

IPC: H01S5/00 ,  H01S5/02 ,  H01S5/042 ,  H01S5/323 ,  H01S5/343 ,  H01S5/40

Abstract: A side by side red/IR laser structure (160,156) is flip chip bonded by solder balls (402,404) to a blue laser structure (252) to form a red/blue/IR hybrid integrated laser structure (400).

公开(公告)号：DE60117216D1

公开(公告)日：2006-04-20

申请号：DE60117216

申请日：2001-12-04

Applicant: XEROX CORP

Inventor： SUN DECAI ,  ROSA MICHEL A ,  YEH CHINGWEN

IPC: G02B26/08 ,  B81B3/00 ,  G02B26/10 ,  G06K7/10

Abstract: A micro-optical-electrical-mechanical laser scanner is configured from a silicon-on-insulator substrate having a silicon substrate layer, a buried oxide layer, and a single crystal silicon device layer. A first device layer portion having a micro-mirror (34) fabricated therefrom. A laser (36) is connected to a second device layer portion, and a hinge (24) connects the first device layer portion and the second device layer portion. The hinge is formed with a bimorph material, wherein the bimorph material creates built-in stresses in the hinge. The bimorph hinge moves the released micro-mirror out of the horizontal plane to a position for either directly or indirectly reflecting laser light emitted from the laser.

公开(公告)号：DE69919442T2

公开(公告)日：2005-01-20

申请号：DE69919442

申请日：1999-04-28

Applicant: XEROX CORP

Inventor： HOFSTETTER DANIEL ,  DUNNROWICZ CLARENCE J ,  SUN DECAI ,  BRINGANS ROSS D ,  KNEISSL MICHAEL A

IPC: H01S5/00 ,  H01S5/02 ,  H01S5/042 ,  H01S5/323 ,  H01S5/343 ,  H01S5/40

Abstract: A side by side red/IR laser structure (160,156) is flip chip bonded by solder balls (402,404) to a blue laser structure (252) to form a red/blue/IR hybrid integrated laser structure (400).

公开(公告)号：DE69809675T2

公开(公告)日：2003-04-10

申请号：DE69809675

申请日：1998-08-17

Applicant: XEROX CORP

Inventor： SUN DECAI

IPC: H01S5/00 ,  H01S5/10 ,  H01S5/22 ,  H01S5/227 ,  H01S5/32 ,  H01S3/083

公开(公告)号：DE60129914T2

公开(公告)日：2007-12-06

申请号：DE60129914

申请日：2001-11-28

Applicant: XEROX CORP

Inventor： SUN DECAI ,  ROSA MICHEL A

IPC: B81B3/00 ,  G02B26/08 ,  B81B7/00

Abstract: Provided is a ribbon structure which may be used as part of a micro-assembly including a micro-device formed on or in a device layer of a single crystal silicon substrate. The ribbon structure is also formed in the device layer, where the ribbon structure is thinned to a thickness less than the thickness of the micro-device. The ribbon structure has an electrical conductive material deposited on its surface. When implemented as part of the micro-assembly, a first end of the micro-device and a first end of a ribbon structure are interconnected, wherein the ribbon structure and out-of-plane device are formed as a single piece.

公开(公告)号：DE69828760D1

公开(公告)日：2005-03-03

申请号：DE69828760

申请日：1998-10-23

Applicant: XEROX CORP

Inventor： SUN DECAI ,  FLOYD PHILIP D

IPC: H01S5/183 ,  H01S5/10

Abstract: The present invention relates to a vertical cavity surface emitting laser with an accurately defined and controlled aperture (134) which directs the current path within the laser. Specifically, the oxide regions (106) surrounding the aperture are formed by a pre-oxidation layer disordering process which controls the regions within which oxidation can occur. The present invention allows for the manufacture of highly compact lasers with reproducible optical and electrical characteristics.

公开(公告)号：DE69804561T2

公开(公告)日：2002-07-18

申请号：DE69804561

申请日：1998-09-16

Applicant: XEROX CORP

Inventor： SUN DECAI

IPC: H01S5/042 ,  H01S5/22 ,  H01S5/00 ,  H01S5/40 ,  H01L21/31

Abstract: The present invention provides an independently addressable, high density, edge emitting laser array structure (100) formed by a lateral wet oxidation process. The aperture (180,182,184,186) of the laser structure is formed by selective layer intermixing and lateral wet oxidation from adjacent grooves (168,170,172,174,176) etched in the laser structure.