Metal plate processing method, lead frame processing method, lead frame,
semiconductor device manufacturing method, and semiconductor device
    31.
    发明授权
    Metal plate processing method, lead frame processing method, lead frame, semiconductor device manufacturing method, and semiconductor device 失效
    金属板加工方法,引线框架加工方法,引线框架,半导体器件制造方法和半导体器件

    公开(公告)号:US5580466A

    公开(公告)日:1996-12-03

    申请号:US343446

    申请日:1994-11-23

    Abstract: An object of the present invention is to, in methods of processing metal plates and lead frames, enable workpieces to be finely processed into a satisfactory configuration with high dimensional accuracy without suffering the effect of heat produced under irradiation of a laser beam. According to the present invention, resist films (1) are first coated on both surfaces of a metal plate (1), and a laser beam (202) is then irradiated to the metal plate (101) from surfaces of the resist films (1) to form a multiplicity of discontinuous through holes (3) in line, while leaving joints (6) as not-processed portions between the adjacent through holes (3). Openings (2) formed in each resist film (1) by the laser cutting are joined with each other to serve as an etching pattern. Next, etching is carried out to etch side walls (6) defining the through holes and also to remove the joints (6), thereby interconnecting the through holes (3) formed in line to form a gap (303a) of a desired shape. Instead of forming the through holes (3) and the joints (6) in the metal plate (101) by irradiating the laser beam (202), non-penetrating cut grooves (51) may be formed in the metal plate (101) with a joint (52) left as a non-processed portion at the bottoms of the cut grooves, followed by removing the joint by etching.

    Abstract translation: PCT No.PCT / JP94 / 00550 371日期1994年11月23日 102(e)1994年11月23日PCT PCT 1994年4月4日PCT公布。 出版物WO94 / 24705 日期为1994年10月27日本发明的目的在于,在金属板和引线框架的加工方法中,能够将工件精细加工成具有高尺寸精度的令人满意的结构,而不会受到激光照射下产生的热的影响 光束。 根据本发明,首先在金属板(1)的两个表面上涂覆抗蚀剂膜(1),然后从抗蚀膜(1)的表面向金属板(101)照射激光束 )以在相邻的通孔(3)之间留下作为未处理部分的接头(6)的同时形成多个不连续的通孔(3)。 通过激光切割在每个抗蚀剂膜(1)中形成的开口(2)彼此接合以用作蚀刻图案。 接下来,进行蚀刻以蚀刻限定通孔的侧壁(6)并且还去除接头(6),从而将形成在一起的通孔(3)互相连接,形成所需形状的间隙(303a)。 代替通过照射激光束(202)在金属板(101)中形成通孔(3)和接头(6),可以在金属板(101)中形成非穿透切割槽(51) 在切割槽的底部留下作为未加工部分的接头(52),然后通过蚀刻去除接头。

    Method and system for selective removal of material coating from a
substrate using a flashlamp
    33.
    发明授权
    Method and system for selective removal of material coating from a substrate using a flashlamp 失效
    使用闪光灯从基板选择性去除材料涂层的方法和系统

    公开(公告)号:US5281798A

    公开(公告)日:1994-01-25

    申请号:US813864

    申请日:1991-12-24

    Abstract: Pulsed light sources, such as a flashlamp or laser, remove coatings from substrates via the ablation method. A photodetector circuit, sensing reflected light from the surface being ablated, provides a feedback signal that indicates the reflected color intensity of the surface being ablated. The boundary between the coatings or substrate surfaces is distinguished by a change in color intensity between an upper coating and an undercoating, e.g., between a topcoat of paint and a primer coat of paint, or between a coating and the substrate surface itself. The color intensity determination thus provides a measure relative to when one coating has been removed and another coating remains. The photodetector circuit is also useful for providing feedback information relative to the quality of a stripped work surface for quality control or other purposes.

    Abstract translation: 诸如闪光灯或激光器的脉冲光源通过消融方法从衬底去除涂层。 感测来自被烧蚀的表面的反射光的光电检测器电路提供指示正被烧蚀的表面的反射颜色强度的反馈信号。 涂层或基材表面之间的边界的区别在于上涂层和底涂层之间的颜色强度的变化,例如在涂料的顶涂层和涂料底漆之间,或涂层和基材表面本身之间。 因此,颜色强度确定提供了相对于何时去除一个涂层并且剩余另一涂层的测量。 光电检测器电路也可用于提供相对于剥离的工作表面的质量的反馈信息以进行质量控制或其他目的。

    Diamond cutting method
    34.
    发明授权
    Diamond cutting method 失效
    钻石切割方法

    公开(公告)号:US5012067A

    公开(公告)日:1991-04-30

    申请号:US424447

    申请日:1989-10-20

    Abstract: A method of machining a diamond workpiece by a laser beam in which a metallic membrane or layer is formed on at least one surface of the workpiece before the workpiece is subjected to the machining operation. The metallic membrane or layer is preferably formed on both side surfaces of a plate-like diamond workpiece. The workpiece machined according to the present invention has a good appearance without cracks and splinters, and a smooth cut surface.

    Abstract translation: 一种通过激光束加工金刚石工件的方法,其中在工件经受加工操作之前,在工件的至少一个表面上形成金属膜或层。 金属膜或层优选地形成在板状金刚石工件的两个侧表面上。 根据本发明加工的工件具有良好的外观,没有裂缝和碎片,并且具有平滑的切割表面。

    System and process for controlled removal of material to produce a
desired surface contour
    37.
    发明授权
    System and process for controlled removal of material to produce a desired surface contour 失效
    用于控制去除材料以产生期望的表面轮廓的系统和过程

    公开(公告)号:US4986664A

    公开(公告)日:1991-01-22

    申请号:US180208

    申请日:1988-04-11

    Applicant: Paul A. Lovoi

    Inventor: Paul A. Lovoi

    Abstract: A method and apparatus for controlling the milling of an ablatable material and the like from substrate is disclosed. Embodiments for controlling the milling of ablatable materials and the like by pulses of high intensity radiant energy are described. The control process is accomplished by generating an electronic signal representative of the substrate surface topology through use of a structured light or other three dimensional mapping system and feeding the signal to a system control unit. By applying pre-programmed criteria regarding the final desired surface to the generated electronic signal, an electronic reference signal indicative of the dimensional coordinates of the final desired surface may be generated. An ablatable coating is then applied to a height sufficiently above the final desired surface to permit a milling off of the excess coating to produce the desired final surface topology. In the milling process the mapping system is used as a real-time feedback control mechanism for directing a laser. By scanning the surface ahead of the laser, the mapping system generates a new electronic signal representative of the coated surface topology, and this signal is compared to the desired-topology reference signal. At each spot where the comparison indicates the coated surface is above the final desired surface, the controller will order the laser to fire upon that spot, and this is reiterated until the surface features fall within the prescribed limits.

    Abstract translation: 公开了一种用于控制可烧蚀材料等从衬底的研磨的方法和装置。 描述了通过高强度辐射能的脉冲控制可烧蚀材料等的研磨的实施例。 通过使用结构光或其他三维映射系统生成表示衬底表面拓扑的电子信号并将信号馈送到系统控制单元来实现控制过程。 通过对所生成的电子信号应用关于最终所需表面的预编程标准,可以产生指示最终期望表面的尺寸坐标的电子参考信号。 然后将可烧蚀的涂层施加到足够高于最终所需表面的高度,以允许磨掉多余的涂层以产生所需的最终表面拓扑。 在铣削过程中,映射系统被用作用于引导激光器的实时反馈控制机构。 通过扫描激光前的表面,映射系统产生代表涂覆表面拓扑的新电子信号,并将该信号与期望拓扑参考信号进行比较。 在比较表明涂层表面高于最终所需表面的每个点处,控制器将命令激光在该点上点燃,并且重复这一点,直到表面特征落入规定限度内。

    Formation of features in optical material
    39.
    发明授权
    Formation of features in optical material 失效
    形成光学材料的特征

    公开(公告)号:US4598039A

    公开(公告)日:1986-07-01

    申请号:US627025

    申请日:1984-07-02

    Abstract: A laser or other source of radiant electromagnetic energy removes optically transparent material (e.g., LiNbO.sub.3) to form various structures. To enhance coupling the radiant energy to the optical material, a layer of an ablative absorber (e.g., a metal or organic material) can be used. Alternately, the radiant source can be initially operated above a threshold that causes removal of a surface layer of the optical material. After selectively thus removing a surface layer of the optical material, subsequent sub-threshold applications of radiant energy remove additional optical material due to a change in the underlying material, rendering it more absorptive at the wavelength of the electromagnetic energy. Optical devices, including waveguides, can be formed, as well as isolation grooves, alignment structures, etc.

    Abstract translation: 激光或其他辐射电磁能源消除光学透明材料(例如LiNbO 3)以形成各种结构。 为了将辐射能耦合到光学材料,可以使用消融吸收体(例如,金属或有机材料)的层。 或者,辐射源可以首先在导致去除光学材料的表面层的阈值以上操作。 在选择性地因此去除光学材料的表面层之后,辐射能量的后续次级阈值应用由于下层材料的变化而移除附加的光学材料,使得其在电磁能的波长处更吸收。 可以形成包括波导在内的光学器件,以及隔离槽,对准结构等。

    Welding process using radiant energy
    40.
    发明授权
    Welding process using radiant energy 失效
    使用辐射能的焊接工艺

    公开(公告)号:US3417223A

    公开(公告)日:1968-12-17

    申请号:US45301365

    申请日:1965-05-04

    Abstract: 1,114,857. Welding by fusion. K. H. STEIGERWALD. 4 May, 1965 [6 May, 1964], No. 18663/65. Heading B3R. In electron beam or like, e.g. light or laser, welding filler metal in the form of wire, strip, powder or liquid is fed to the seam and is heated adjacent the weld zone by an arc, a second beam, or the same beam as heats the weld zone. In the latter case, the beam is deflected from the weld zone to the filler material or the weld zone and the filler material are heated by different portions of the beam. The filler wire may be transversely oscillated. The filler material is welded to a higher temperature than the weld zone to assist in the transfer of molten metal. An electric field may be set up more positively to transfer the molten metal. The work and the filler material are fed continuously. In one modification, the filler is fed in horizontally and the work is lowered vertically to effect a vertical weld with gravity assisted metal transfer. The method may be used for cladding, for V-groove welding or for parallel-sided gap welding using one or more passes. The filler wire or strip is fed at an acute angle or perpendicularly into the gap and may be fed centrally or into contact with one of the workpieces. When a single beam is used deflected from the weld zone to the filler material, the relative heat inputs may be controlled by intensity duration or focusing. A continuous or pulsed beam may be used. The beam may be oscillated from side-to-side of the gap, and at each end of its oscillation it impinges in part on the filler wire and in part on the work.

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