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    Micromachining method and micromachined structure
    31.
    发明授权
    Micromachining method and micromachined structure 失效
    微加工方法和微加工结构

    公开(公告)号：US5976390A

    公开(公告)日：1999-11-02

    申请号：US769376

    申请日：1996-12-19

    Applicant: Hiroshi Muramatsu

    Inventor： Hiroshi Muramatsu

    IPC: B23K26/00 ,  B29C67/00 ,  B81C1/00 ,  B81C99/00 ,  G01P15/08 ,  G01P15/18 ,  H01L29/84 ,  H01L41/08 ,  H01L41/22 ,  H01L21/00 ,  B44C1/22

    CPC classification number: B81C3/008 ,  B81B2201/0235 ,  B81B2201/13 ,  B81B2203/0118 ,  B81B2203/0353

    Abstract: A minute structure such as a cantilever 11 is formed on a silicon substrate 10 and heated by irradiating a laser beam to a part of the cantilever 11, by which the cantilever 11 is bent. The two bent cantilevers 11 are inserted into through holes 14 in a crystal substrate 10 formed in advance, and the tip end portions 15 thereof are heated. The heared tip end portions 15 become thicker and at the same time shorter, so that the crystal substrate 12 can be fixed to the silicon substrate 10 without play. By heating a part of the minute structure by such a method, plastic deformation is produced, so that bending and deforming can be performed. Thereby, a three-dimensional micromachined structure is constructed and assembled.

    Abstract translation: 在硅基板10上形成诸如悬臂11的微小结构，并通过将激光束照射到悬臂11的一部分进行加热，悬臂11弯曲。 将两个弯曲的悬臂11插入到预先形成的晶体基板10中的通孔14中，并且其前端部15被加热。 再有，前端部15越来越厚，同时变短，晶体基板12能够在不发生游隙的情况下固定在硅基板10上。 通过这种方法加热微小结构的一部分，产生塑性变形，从而可进行弯曲变形。 由此，构造并组装三维微加工结构。

    THREE-DIMENSIONAL ELECTROMECHANICAL ADHESIVE DEVICES AND RELATED SYSTEMS AND METHODS
    32.
    发明申请
    THREE-DIMENSIONAL ELECTROMECHANICAL ADHESIVE DEVICES AND RELATED SYSTEMS AND METHODS 审中-公开

    公开(公告)号：US20190240845A1

    公开(公告)日：2019-08-08

    申请号：US16268381

    申请日：2019-02-05

    Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY

    Inventor： Anastasios John Hart ,  Sanha Kim

    IPC: B25J15/00 ,  H02N13/00 ,  B81B3/00

    CPC classification number: B25J15/0085 ,  B81B3/0054 ,  B81B2201/13 ,  H02N13/00

    Abstract: Controllable electromechanical adhesive devices including three-dimensional dielectrically-coated microstructures that are mechanically compliant are provided. The microstructures can be controlled to provide tunable electromechanical surface adhesion, allowing for dexterous gripping of microscale and/or macroscale objects. For example, the devices can tune the surface adhesion strength of one or more microstructures without complex mechanical actuation in a wide range of on/off ratios with low voltage. The devices can be configured as a force sensor capable of providing tactile feedback for determining the load applied against the microstructures by the surface of an object. For example, the devices can provide output indicative of changes in an electrical property of one or more microstructures for determining the applied load of an object. The devices can be pixelated or otherwise configured to provide localized force sensing and/or surface adhesion. Related systems and methods for controlling the disclosed electromechanical adhesive devices are also described.

    Method of manufacturing micro structure, and substrate structure
    33.
    发明授权
    Method of manufacturing micro structure, and substrate structure 有权
    微结构制造方法及基板结构

    公开(公告)号：US08974626B2

    公开(公告)日：2015-03-10

    申请号：US13069154

    申请日：2011-03-22

    Applicant: Takamichi Fujii ,  Akihiro Mukaiyama

    Inventor： Takamichi Fujii ,  Akihiro Mukaiyama

    IPC: B29C65/00 ,  H01L21/00 ,  B32B7/02 ,  B81C3/00

    CPC classification number: B32B7/02 ,  B32B2457/14 ,  B81B2201/13 ,  B81B2203/0338 ,  B81B2207/07 ,  B81C3/004 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T156/10 ,  Y10T428/2495

    Abstract: A method of manufacturing a micro structure, includes the steps of: preparing separate first and second substrates, the first substrate having a first surface on which a first structural body having a first height and a second structural body having a second height greater than the first height of the first structural body are arranged, the second substrate having a second surface; then placing the first and second substrates to cause the first and second surfaces to face each other across the first and second structural bodies; and then bonding the first and second substrates to each other while compressing the second structural body in a height direction thereof between the first and second surfaces to cause the second structural body to have a height defined by the first structural body.

    Abstract translation: 一种制造微结构的方法包括以下步骤：制备单独的第一和第二基底，所述第一基底具有第一表面，第一表面具有第一高度的第一结构体和具有第二高度的第二高度的第二结构体 布置第一结构体的高度，第二基底具有第二表面; 然后放置第一和第二基板以使第一和第二表面跨过第一和第二结构体彼此面对; 然后在第一和第二表面之间沿其高度方向压缩第二结构体以使第二结构体具有由第一结构体限定的高度，将第一和第二基板彼此接合。

    METHOD OF MANUFACTURING MICRO STRUCTURE, AND SUBSTRATE STRUCTURE
    34.
    发明申请
    METHOD OF MANUFACTURING MICRO STRUCTURE, AND SUBSTRATE STRUCTURE 有权
    制造微结构的方法和基板结构

    公开(公告)号：US20110236659A1

    公开(公告)日：2011-09-29

    申请号：US13069154

    申请日：2011-03-22

    Applicant: Takamichi FUJII ,  Akihiro Mukaiyama

    Inventor： Takamichi FUJII ,  Akihiro Mukaiyama

    IPC: B32B7/02 ,  B32B37/00

    CPC classification number: B32B7/02 ,  B32B2457/14 ,  B81B2201/13 ,  B81B2203/0338 ,  B81B2207/07 ,  B81C3/004 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T156/10 ,  Y10T428/2495

    Abstract: A method of manufacturing a micro structure, includes the steps of: preparing separate first and second substrates, the first substrate having a first surface on which a first structural body having a first height and a second structural body having a second height greater than the first height of the first structural body are arranged, the second substrate having a second surface; then placing the first and second substrates to cause the first and second surfaces to face each other across the first and second structural bodies; and then bonding the first and second substrates to each other while compressing the second structural body in a height direction thereof between the first and second surfaces to cause the second structural body to have a height defined by the first structural body.

    Abstract translation: 一种制造微结构的方法包括以下步骤：制备单独的第一和第二基底，所述第一基底具有第一表面，第一表面具有第一高度的第一结构体和具有第二高度的第二高度的第二结构体 布置第一结构体的高度，第二基底具有第二表面; 然后放置第一和第二基板以使第一和第二表面跨过第一和第二结构体彼此面对; 然后在第一和第二表面之间沿其高度方向压缩第二结构体以使第二结构体具有由第一结构体限定的高度，将第一和第二基板彼此接合。

    Sockets for microassembly
    36.
    发明申请
    Sockets for microassembly 失效
    微组装插座

    公开(公告)号：US20050181636A1

    公开(公告)日：2005-08-18

    申请号：US11074448

    申请日：2005-03-08

    Applicant: Kenneth Tsui ,  Aaron Geisberger

    Inventor： Kenneth Tsui ,  Aaron Geisberger

    IPC: B81B3/00 ,  B81B7/00 ,  B81C3/00 ,  H01R11/30 ,  H01R13/627 ,  H01R24/00 ,  H01R43/00

    CPC classification number: B81C3/008 ,  B81B2201/13 ,  B81C99/002

    Abstract: An apparatus including at least three deflectable members each configured to deflect during assembly with a component, and also configured to remain in contact with the component after assembly with the component. At least one of the deflectable members and the component has a thickness not greater than about 1000 microns.

    Abstract translation: 一种装置，包括至少三个可偏转构件，每个可挠曲构件构造成在与构件组装期间偏转，并且还构造成在与构件组装之后保持与构件接触。 可偏转构件和部件中的至少一个具有不大于约1000微米的厚度。

    System and method for coupling microcomponents
    39.
    发明授权
    System and method for coupling microcomponents 失效
    用于耦合微元件的系统和方法

    公开(公告)号：US06672795B1

    公开(公告)日：2004-01-06

    申请号：US09570170

    申请日：2000-05-11

    Applicant: Matthew D. Ellis ,  George D. Skidmore

    Inventor： Matthew D. Ellis ,  George D. Skidmore

    IPC: H01R16627

    CPC classification number: B81C3/008 ,  B81B2201/13 ,  F16B2/20 ,  Y10T24/45581 ,  Y10T403/602

    Abstract: A system and method which provide a general-purpose snap connector suitable for coupling microcomponents are disclosed. A snap connector is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a snap connector is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a snap connector may be pressure fit with a receptacle (or aperture) of a mating component in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the snap connector. A preferred embodiment provides a “preloaded” snap connector that may be utilized to perform general assembly of microcomponents. An alternative embodiments provides a non-preloaded snap connector suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides a “squeeze” snap connector that is suitable for performing general assembly of microcomponents. Such snap connectors may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone snap connectors. For example, a dual-ended snap connector is disclosed herein, which may be coupled to a first microcomponent, and then used to couple the first microcomponent to a second microcomponent.

    Abstract translation: 公开了一种提供适用于连接微型部件的通用卡扣连接器的系统和方法。 公开了一种适于执行总体组装的卡扣式连接器，包括微型部件的平面外的3-D组装，其中这种微型部件可以牢固地联接在一起。 也就是说，公开了一种卡扣连接器，其使得能够以限制耦合部件相对于彼此的不期望的运动的方式耦合微部件。 优选地，这种卡扣连接器可以以限制配合部件相对于卡扣连接器的平移和旋转自由度的方式与配合部件的插座（或孔）压配合。 一个优选实施例提供了一种“预加载”卡扣连接器，其可用于执行微型部件的总体组装。 替代实施例提供了适用于执行微型部件的总体组装的非预加载卡扣连接器。 另一替代实施例提供了适用于执行微型部件的总体组装的“挤压”卡扣连接器。 这种快速连接器可以被实现为微型部件的集成部件，或者它们可以被实现为单独的独立卡扣连接器。 例如，本文公开了双端卡扣连接器，其可以耦合到第一微型部件，然后用于将第一微型部件耦合到第二微型部件。

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