公开(公告)号：EP1039995A1

公开(公告)日：2000-10-04

申请号：EP98959577.2

申请日：1998-11-23

Applicant: Caliper Technologies Corporation

Inventor： KENNEDY, Colin

IPC: B32B3/00 ,  B32B31/00

CPC classification number: B32B38/14 ,  B01L3/502707 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2400/0415 ,  B32B3/30 ,  B41M3/006 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/0184 ,  B81C2201/0185 ,  B81C2201/019 ,  Y10T428/24744 ,  Y10T428/24826 ,  Y10T428/24876 ,  Y10T428/24893 ,  Y10T428/24926 ,  Y10T436/2575

Abstract: Laminates (600) having microfluidic structures (615-635) disposed between sheets (605-610) of the laminate (600) are provided. The microfluidic structures (615-635) are raised on a sheet (605, 610) of the laminate (600), typically by printing the structure (615-635) on the sheet (605, 610). Printing methods include Serigraph, ink-jet, intaligo, offset printing and thermal laser printing.

公开(公告)号：EP2650905A3

公开(公告)日：2014-10-01

申请号：EP13003426.7

申请日：2005-06-02

Applicant: The Board of Trustees of the University of Illinois

Inventor： Nuzzo, Ralph G. ,  Rogers, John, A. ,  Menard, Etienne ,  Lee, Keon Jae ,  Khang, Dahl-Young ,  Sun, Yugang ,  Meitl, Matthew ,  Zhu, Zhengtao

IPC: H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08 ,  H01L21/02

CPC classification number: H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：EP2461159A1

公开(公告)日：2012-06-06

申请号：EP10193535.1

申请日：2010-12-02

Applicant: Honeywell Romania S.R.L.

Inventor： Cobianu, Cornel. P.

IPC: G01N29/02 ,  G01N29/22 ,  B01L3/00 ,  G01N33/00 ,  H03H9/24 ,  B81C1/00

CPC classification number: G01N29/022 ,  B01L3/502707 ,  B81B2201/0214 ,  B81B2203/0118 ,  B81B2207/015 ,  B81C1/00214 ,  B81C2201/0185 ,  B81C2203/0118 ,  B81C2203/0714 ,  B81C2203/0735 ,  B82Y40/00 ,  G01N29/036 ,  G01N29/222 ,  G01N2291/021 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0427

Abstract: A carbon dioxide sensor comprising a first beam that includes a functionalized surface and a second beam that includes a functionalized surface such that reduced-drift differential sensing of carbon dioxide may be performed by monitoring changes in the resonant frequency of the first beam relative to the resonant frequency of second beam.

Abstract translation: 一种二氧化碳传感器，其包括包括官能化表面的第一光束和包括功能化表面的第二光束，使得可以通过监测第一光束相对于谐振的谐振频率的变化来执行二氧化碳的减少漂移差分感测 第二光束的频率。

公开(公告)号：EP2200930A2

公开(公告)日：2010-06-30

申请号：EP08786315.5

申请日：2008-07-22

Applicant: Robert Bosch GmbH

Inventor： MAY, Johanna

IPC: B81C1/00

CPC classification number: B81C1/0046 ,  B81C2201/0185 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: The invention relates to a method for printing a nanostructure and/or microstructure (5) on a substrate (1) having a three-dimensional macro-surface (6). The method is characterized in that a substance (12, 13) is applied having a three-dimensional stamp macro-surface (10), the shape of which matches the macro-surface (2) of the substrate (1) at least in some sections and which is provided with a stamp nanostructure and/or microstructure (10), and the stamp (4) is positioned relative to a substrate (1), and the stamp (4) and substrate (1) are brought together, thus printing the substance (12, 13) as a nanostructure and/or microstructure (5) onto the substrate (1). The invention further relates to a stamp (4) for carrying out the method, and to a substrate (1) produced with said method.

公开(公告)号：EP2461159B1

公开(公告)日：2017-10-25

申请号：EP10193535.1

申请日：2010-12-02

Applicant: Honeywell Romania S.R.L.

Inventor： Cobianu, Cornel. P.

IPC: G01N29/036

CPC classification number: G01N29/022 ,  B01L3/502707 ,  B81B2201/0214 ,  B81B2203/0118 ,  B81B2207/015 ,  B81C1/00214 ,  B81C2201/0185 ,  B81C2203/0118 ,  B81C2203/0714 ,  B81C2203/0735 ,  B82Y40/00 ,  G01N29/036 ,  G01N29/222 ,  G01N2291/021 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0427

公开(公告)号：EP2650907A2

公开(公告)日：2013-10-16

申请号：EP13003428.3

申请日：2005-06-02

Applicant: The Board of Trustees of the University of Illinois

Inventor： Nuzzo, Ralph G. ,  Rogers, John, A. ,  Menard, Etienne ,  Lee, Keon Jae ,  Khang, Dahl-Young ,  Sun, Yugang ,  Meitl, Matthew ,  Zhu, Zhengtao

IPC: H01L21/20 ,  H01L21/02 ,  H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08

CPC classification number: H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Abstract translation: 本发明提供了用于制造可印刷的半导体元件和组装可印刷的半导体元件到衬底上表面的方法和装置。 方法，设备和设备部件本发明的能够产生宽范围的柔性电子和光电子器件和基底包含聚合物材料上的设备的阵列。 本发明因此提供了可拉伸的半导体结构，并且能够在拉伸构型良好的性能可拉伸电子器件。

公开(公告)号：EP2650906A2

公开(公告)日：2013-10-16

申请号：EP13003427.5

申请日：2005-06-02

Applicant: The Board of Trustees of the University of Illinois

Inventor： Nuzzo, Ralph G. ,  Rogers, John, A. ,  Menard, Etienne ,  Lee, Keon Jae ,  Khang, Dahl-Young ,  Sun, Yugang ,  Meitl, Matthew ,  Zhu, Zhengtao

IPC: H01L21/20 ,  H01L21/02 ,  H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08

CPC classification number: H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：EP2438608A2

公开(公告)日：2012-04-11

申请号：EP10784163.7

申请日：2010-06-04

Applicant: Northwestern University

Inventor： MIRKIN, Chad, A. ,  SHIM, Wooyoung ,  BRAUNSCHWEIG, Adam, B. ,  LIAO, Xing ,  CHAI, Jinan ,  LIM, Jong, Kuk ,  ZHENG, Gengfeng ,  ZHENG, Zijian

IPC: H01L21/027

CPC classification number: G03F7/0002 ,  B81B2203/0361 ,  B81B2207/056 ,  B81C1/00111 ,  B81C1/0046 ,  B81C2201/0154 ,  B81C2201/0185 ,  B82Y10/00 ,  B82Y40/00 ,  Y10S977/732

Abstract: Disclosed are methods of lithography using a tip array having a plurality of pens attached to a backing layer, where the tips can comprise a metal, metalloid, and/or semi-conducting material, and the backing layer can comprise an elastomeric polymer. The tip array can be used to perform a lithography process in which the tips are coated with an ink (e.g., a patterning composition) that is deposited onto a substrate upon contact of the tip with the substrate surface. The tips can be easily leveled onto a substrate and the leveling can be monitored optically by a change in light reflection of the backing layer and/or near the vicinity of the tips upon contact of the tip to the substrate surface.

公开(公告)号：EP2104954A1

公开(公告)日：2009-09-30

申请号：EP07874095.8

申请日：2007-10-31

Applicant: The Board Of Trustees Of The University Of Illinois ,  Semprius, Inc.

Inventor： ROGERS, John ,  NUZZO, Ralph ,  MEITL, Matthew ,  MENARD, Etienne ,  BACA, Alfred, J. ,  MOTALA, Michael ,  AHN, Jong-Hyun ,  PARK, Sang-Il ,  YU, Chang-Jae ,  KO, Heung, Cho ,  STOYKOVICH, Mark ,  YOON, Jongseung

IPC: H01L27/15

CPC classification number: H01L25/50 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/00 ,  H01L25/042 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L29/78603 ,  H01L29/78681 ,  H01L31/02005 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/0288 ,  H01L31/03046 ,  H01L31/043 ,  H01L31/0525 ,  H01L31/0543 ,  H01L31/0547 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/167 ,  H01L31/1804 ,  H01L31/1824 ,  H01L31/1868 ,  H01L31/1876 ,  H01L31/1892 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/30 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01S5/021 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/3013 ,  H01S5/34326 ,  H01S5/423 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

公开(公告)号：WO2015073734A1

公开(公告)日：2015-05-21

申请号：PCT/US2014/065561

申请日：2014-11-13

Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY

Inventor： BULOVIC, Vladimir ,  LANG, Jeffrey Hastings ,  WANG, Annie I-Jen ,  MURARKA, Apoorva ,  CHANG, Wendi

IPC: B81B7/02 ,  B81C1/00 ,  H01L29/84

CPC classification number: B81B7/02 ,  B81B2201/047 ,  B81B2203/0127 ,  B81C1/00 ,  B81C1/00158 ,  B81C1/00373 ,  B81C2201/0185 ,  H04B10/572 ,  H05B33/0857

Abstract: The disclosure relates to method and apparatus for micro-contact printing of microelectromechanical systems ("MEMS") in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias.

Abstract translation: 本公开涉及在无溶剂环境中微机电系统（“MEMS”）的微接触印刷的方法和装置。 所公开的实施方案使得能够在聚对二甲苯层上形成复合膜并将复合结构转移到接收结构以形成由复合膜覆盖的一个或多个微腔。 聚对二甲苯膜的厚度可以在约100nm-2微米的范围内; 200nm-1微米，200-300nm，300-500nm，500nm至1微米和1-30微米。 接下来，在聚对二甲苯之上形成一个或多个二次层以产生复合膜。 复合膜可以具有约100nm至700nm至几微米的厚度。 可以测量复合膜的响应于外力的偏转以提供无接触检测器。 相反，可以使用外部偏压来致动复合膜，以产生与施加的偏压相称的偏转。