Abstract:
A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property.A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.
Abstract:
A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property. A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.
Abstract:
In one aspect the invention is a composition comprising a prepolymer which is the reaction product of di(isocyanatophenyl)methane or a polymeric di(isocyanatophenyl)methane having an isocyanato functionality of about 2.1 to about 3.0 with a mixture of one or more diols and one or more triols wherein the ratio of isocyanate equivalents to hydroxyl equivalents in the reaction mixtures used to prepare the prepolymer is from about 1.2 to about 1.8 and the ratio of diol to triol where the diisocyanate is a di(isocyanatophenyl)methane in the reaction mixture is from about 5:1 to about 1:1. and where the isocyanate is a polymeric di(isocyanatophenyl)methane is from about 8:1 to about 4:1; wherein the prepolymer could further react with an isocyanate reactive monofunctional compound. The prepolymer herein has an isocyanate content of about 0.5 to about 1.5 percent by weight, a free isocyanate monomer content of about 1.0 percent by weight or less as measured by high pressure liquid chromatography. These prepolymers can be used in many applications including adhesive, sound dampening sealer and coating and especially in making adhesives or adhesive systems with a low content of monomeric isocyanate to bond together similar or dissimilar substrates such as metal, glass, ceramics, plastic and painted steel panel.
Abstract:
A novel diazirine-based biocompatible polymer that can be used as on-demand or tunable bioadhesive and applied across various clinically important surfaces. The biocompatible polymer comprises a single strand of repeating units and up to 5,000 photoreactive diazirine groups covalently attached to it. A bioadhesive composition comprises the polymer of the present invention and suitable solvents, surfactants, stabilizers, fillers and other additives. The composition may additionally contain metallic particles of size less than 50 micron made of rare earth elements and has UV or NIR transparency less than 1 optical density unit per 1 centimeter. The poly-diazirine surface grafted thin films can be used for minimally invasive surgeries.
Abstract:
The present invention relates to a curing agent for moisture-curing compositions which includes at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated curing of moisture-curing compositions which are based on polyurethane polymers that have isocyanate groups or of silane-functional polymers.
Abstract:
A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property.A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.
Abstract:
In one aspect the invention is a composition comprising a prepolymer which is the reaction product of di(isocyanatophenyl) methane or a polymeric di(isocyanatophenyl) methane having an isocyanato functionality of about 2.1 to about 3.0 with a mixture of one or more diols and one or more triols wherein the ratio of isocyanate equivalents to hydroxyl equivalents in the reaction mixtures used to prepare the prepolymer is from about 1.2 to about 1.8 and the ratio of diol to triol where the diisocyanate is a di(isocyanatophenyl) methane in the reaction mixture is from about 5:1 to about 1:1. and where the isocyanate is a polymeric di(isocyanatophenyl) methane is from about 8:1 to about 4:1; wherein the prepolymer could further react with an isocyanate reactive monofunctional compound. The prepolymer herein has an isocyanate content of about 0.5 to about 1.5 percent by weight, a free isocyanate monomer content of about 1.0 percent by weight or less as measured by high pressure liquid chromatography. These prepolymers can be used in many applications including adhesive, sound dampening sealer and coating and especially in making adhesives or adhesive systems with a low content of monomeric isocyanate to bond together similar or dissimilar substrates such as metal, glass, ceramics, plastic and painted steel panel.
Abstract:
Composition curable thermally and with actinic radiation (dual-cure composition) comprising A) at least one constituent containing on average per molecule at least one primary or secondary carbamate group and at least one bond which can be activated with actinic radiation and preparable by from polyfunctional compounds containing at least two isocyanate-reactive, acid-reactive or epoxide-reactive functional groups and suitable monoisocyanates, monoacids or monoepoxides or from polyisocyanates, polyacids or polyepoxides and suitable compounds which contain an isocyanate-reactive, acid-reactive or epoxide-reactive functional group; and B) at least one constituent containing on average per molecule at least one carbamate-reactive functional group and also, where appropriate, at least one bond which can be activated with actinic radiation; and its use as adhesive, sealing compound and coating material.
Abstract:
A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property. A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.