Abstract:
A method for selecting the shape for an occluding aperture (24) which is to be positioned at a predetermined aperture location (28) in a light path (12) extending between an illuminated line object (14) and a linear photosensor array (16). Through use of the aperture (24) selected according to the method, a light intensity measurement is obtained across the linear photosensor array (16) which is uniformly proportional to the light intensity across the illuminated line object (14).
Abstract:
Process and apparatus for fabricating an extended scanning or printing array in which several smaller scanning or printing chips (5) are bonded end-to-end onto the surface of a glass substrate (10) having an opaque thermally and/or electrically conductive coating (19) thereon, with the coating removed at discrete sites (24) to allow a photocurable adhesive (30) placed at the sites to be cured through exposure to UV light from underneath the substrate, the photocurable adhesive holding the chips in place while a chip-bonding adhesive (38) deposited on the conductive coating where the chips are located is cured to provide a permanent structure.
Abstract:
An image sensor has a frame, a transparent cover which is mounted on the top of the frame and on which an original document is to be placed, and a base plate disposed within the frame. On the base plate, there are mounted a light emitting section, a lens for condensing the reflective light and a light receiving section. The base plate is disposed within the frame so that the light emitting section is located directly below the transparent cover and the optical axis of the condensing lens is inclined relative to the plane of the transparent cover. Light rays emitted from the light emitting section enter the transparent cover in a direction substantially perpendicular to the plane thereof and are reflected by the transparent cover slantingly toward the light receiving section. By arranging the condensing lens inclined relative to the plane of the transparent cover, the vertical distance between the light receiving section and the transparent cover can be reduced. The entire configuration of the frame is tapered toward the transparent cover on the top thereof. Thus, the image sensor can be more easily assembled into any electronic instrument. The light emitting section is enclosed by walls which are increased in reflectivity, resulting in an increase of the amount of irradiating light. The condensing lens can be mounted and held in a recess formed in the top of the frame without the need for any adhesive.
Abstract:
A method for selecting the shape for an occluding aperture (24) which is to be positioned at a predetermined aperture location (28) in a light path (12) extending between an illuminated line object (14) and a linear photosensor array (16). Through use of the aperture (24) selected according to the method, a light intensity measurement is obtained across the linear photosensor array (16) which is uniformly proportional to the light intensity across the illuminated line object (14).
Abstract:
PROBLEM TO BE SOLVED: To provide an image scanner which is designed for easy assembly and disassembly, which reduces costs and which also is environment-friendly. SOLUTION: This image scanner includes a housing, a rod lens array, a light source module and a sensor board. The housing accommodates the rod lens array, the light source module and the sensor board. The sensor board includes a plurality of light sensor chips. The light source module includes a light guide, a light source body and guide terminals extending from the light source body. The guide terminals are electrically connected to the sensor board with resilient contacts. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device having an airtight functional plane, preventing a contact from breakdown caused by thermal expansion. SOLUTION: A semiconductor device is constituted of a junction member 100 provided with a semiconductor element 2 having a semiconductor element functional plane 2a, and a electric distribution means 5 electrically connected to the semiconductor element functional plane 2a, with the junction member 100 being disposed on a base 1 with the distribution means 5 facing the base 1. In a portion excluding a portion between the base 1 and the distribution means 5, there are provided an adhesive agent 3 in a fixed portion for securing the semiconductor element 2 onto the base 1, and a sealing member 33 for sealing a portion excluding both the fixed portion and the portion between the base 1 and the distribution means 5, in which the sealing member 33 has less elasticity than the adhesive agent 3 provided in the fixed portion. COPYRIGHT: (C)2004,JPO
Abstract:
[PROBLEMS] To provide a light guide in which unevenness in color does not take place even at a part close to the incident face. [MEANS FOR SOLVING PROBLEMS] A rod-like light guide (3) is produced by injection molding transparent resin such as acryl, and its surface comprises an exit face (3a), a bottom face (3b), right and left side faces (3d, 3c) and end faces (3e, 3f). One end face (3e) opposes a light emitting unit (10), and a light scattering pattern for scattering incident light from the end face (3e) is formed on the bottom face (3b). The light scattering pattern provides pattern shapes different between a portion close to the end face (3e) as the incident face and a portion separated from the end face (3e). The light scattering pattern (11) formed at the portion close to the incident face consists of a large number of fine hemispherical recesses whereas the light scattering pattern (12) separated from the incident face consists of triangular grooves or half-cut tubular grooves, and the axial direction of these triangular grooves or half-cut tubular grooves is the width direction (sub-scanning direction) of the pattern-forming bottom face (3b).