IMAGE SENSOR UNIT AND IMAGE READER
    7.
    发明申请
    IMAGE SENSOR UNIT AND IMAGE READER 有权
    图像传感器单元和图像读取器

    公开(公告)号:US20120154876A1

    公开(公告)日:2012-06-21

    申请号:US13333751

    申请日:2011-12-21

    Inventor: Shuuichi SHIMODA

    Abstract: An illumination device includes a light guide made of plastic, and a light source including a light emitting element whose dominant wavelength is a light emission wavelength in an infrared region, and identifies a banknote. White reference plates are provided at positions that are at opposite ends of a rod lens array and cover respective areas external to an image region across the banknote. A correction coefficient is acquired by calculation. The calculation is made by correcting an illuminance such that IR correction data is substantially identical to IR reference data preliminarily stored in a memory circuit in a signal processor on the basis of IR white reference data representing a white reference illuminance generated from light reflected from the white reference plates. The correction coefficient is used for correcting IR image data when the banknote is read.

    Abstract translation: 照明装置包括由塑料制成的导光体,以及包含主要波长为红外区域的发光波长的发光元件的光源,并识别纸币。 白色参考板设置在杆状透镜阵列的相对端的位置,并覆盖横跨纸币的图像区域外的各个区域。 通过计算获得校正系数。 通过校正照度来进行计算,使得IR校正数据基本上等同于基于从白色反射的光产生的白色参考照度的IR白色参考数据,IR信号预先存储在信号处理器中的存储器电路中的IR参考数据 参考板。 当读取纸币时,校正系数用于校正IR图像数据。

    Contact type image sensor
    9.
    发明申请
    Contact type image sensor 审中-公开
    接触式图像传感器

    公开(公告)号:US20030025950A1

    公开(公告)日:2003-02-06

    申请号:US10196240

    申请日:2002-07-17

    Inventor: Shiro Tsunai

    Abstract: A sensor chip arranged in a casing having a window portion on the side thereof to be faced to a medium to be read takes in the form of a single long chip. In particular, a single long and seamless sensor chip having a plurality of photoelectric conversion elements arranged thereon throughout a length of the window portion of the casing is mounted on a long supporting substrate having a length long enough to support the whole sensor chip. The sensor chip and the supporting substrate are bonded together such that transmission of stress due to external force exerted on the supporting substrate to the sensor chip is restricted.

    Abstract translation: 布置在壳体中的传感器芯片具有在其一侧上具有窗口部分以面对待读取的介质的传感器芯片,其形式为单个长芯片。 特别地,具有多个光电转换元件的单个长且无缝的传感器芯片安装在整个壳体的窗口部分的整个长度上,其长度足够长以支撑整个传感器芯片。 传感器芯片和支撑基板被接合在一起,使得由于施加在支撑基板上的外力而产生的应力传递到传感器芯片受到限制。

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