Abstract:
Die Erfindung betrifft ein Verfahren zum Herstellen eines Radoms (10), wobei eine flexible Leiterkarte (1) mit einer metallischen Struktur (2) verwendet wird, die flexible Leiterkarte (1) geprägt wird und mit einem thermoplastischen Kunststoff (11,21) hinterspritzt wird und elektrische Kontaktelemente (46) mit der flexiblen Leiterkarte verbunden werden, wobei vor dem Hinterspritzen auf die Kontaktelemente ein Steckerkorb (50) ausgesetzt wird.
Abstract:
Die Erfindung bezieht sich auf ein elektrisches Kfz-Nebenaggregat (10) mit einem elektronisch kom mutierten Antriebsmotor (14), einem von dem Antriebsmotor (14) angetriebenen Arbeitsmittel (18), einer peripheren Steckeranordnung (16) mit mindestens zwei freistehenden Steckerstiften (50), und einer mindestens teilweise In einem Vergusskörper (40) vergossenen Motorsteuerungs-Platine (34), die in einer Motorquerebene liegt und eine Kommutierungselektronik (80) aufweist. Die Steckerstifte (50) werden jeweils von einem einzigen steifen Stiftkörper (51) gebildet, der mit der Motorsteuerungs-Platine (34) unmittelbar elektrisch verbunden ist. Der Vergusskörper (40) weist einen einstöckig angeformten Steckerkern (48) auf, der die Stiftkörper (51) zwischen der Motorsteuerungs-Platine (34) und einem von dem Steckerkern (48) gebildeten Steckerboden (49) umschließt. Der Steckerkern (48) steckt in einer Gehäuseöffnung (60) eines Gehäusekörpers (26), so dass der Steckerboden (49) die Gehäuseöffnung (60) vollständig verschließt und die Stiftkörper (51) durch die Gehäuseöffnung (60) hindurch von dem Steckerboden (49) aus nach außen abragen.
Abstract:
An electronic device is provided. The electronic device includes a housing, a communication circuit, a multi-layered printed circuit board(PCB) and an antenna radiator, wherein the multi-layered printed circuit board comprises a first conductive pattern disposed in at least one of a plurality of layers thereof to form a capacitance, a second conductive pattern disposed in at least another one of the plurality of layers thereof to form an inductance and a conductive plate disposed between the at least one and the at least other one of the plurality of layers and electrically isolated from the first conductive pattern and the second conductive pattern.
Abstract:
An electrical assembly combination includes (a) a receiver having a receiver housing and a plurality of receiver housing electrical contacts, and (b) a connector device comprising a connector housing capable of accepting and retaining a terminal end of a flexible assembly having a plurality of flexible assembly electrical contacts. The connector device is capable of being reversibly attached to the receiver housing such that each of the receiver housing electrical contacts is electrically connected to a flexible assembly electrical contact in a removable, non-permanent manner.
Abstract:
An electronic display assembly where the components can be removed and serviced or replaced without having to remove the display from its position. A backplane may be in electrical communication with the image producing assembly and may contain a plurality of blind mate connectors. Various electronic assemblies may be connected to the blind mate connectors. An access panel may provide access to the electronic assemblies so that they can be removed from the housing. N+1 power supplies may be used so that if one fails the unit would continue to operate until the failed power supply could be replaced. The electronic assemblies may be removed from the left side, right side, top, or bottom surfaces of the display housing. Any flat panel electronic display may be used.
Abstract:
RFID 회로를 플렉시블 회로들(150) 내로 집적시키기 위한 시스템들 및 방법들이 제공된다. RFID 집적 회로(120)는 플렉시블 회로(150)의 유전층(170) 내에 또는 플렉시블 회로의 유전층(170) 및 도전층(180) 사이에 매립될 수 있다. 추가로 또는 대안적으로, RFID 안테나는 플렉시블 회로의 도전층 내로 집적될 수 있다. 대안적으로, RFID 회로의 안테나 및 집적 회로 전부는 플렉시블 회로에서 벗어나서 제공될 수 있지만, 집적 회로 및 안테나를 커플링하는 RFID 커넥터는 플렉시블 회로 내로 집적될 수 있다.
Abstract:
Systems and methods for integrating radio-frequency identification (RFID) circuitry into flexible circuits are provided. An RFID integrated circuit can be embedded within a dielectric layer of a flexible circuit or between a dielectric layer and a conductive layer of the flexible circuit. Additionally or alternatively, an RFID antenna may be integrated into a conductive layer of the flexible circuit. Alternatively, both the integrated circuit and antenna of RFID circuitry may be provided off of the flexible circuit but an RFID connector coupling the integrated circuit and antenna may be integrated into the flexible circuit.