Abstract:
A polyphenylene oxide resin belongs to a polymerized and/or modified thermosetting polyphenylene oxide resin, having a structure represented by formula (I): The polymerized and/or modified thermosetting polyphenylene oxide resin has better flame retardancy, thermal resistance, dielectric constant, dissipation factor, toughness, reactivity, viscosity and solubility. Therefore, the polyphenylene oxide resin is suitable for producing prepregs, resin films, laminates, printed circuit boards and other articles. A method of preparing polyphenylene oxide resins, a prepolymer thereof and a resin composition containing the polyphenylene oxide resin are also provided.
Abstract:
A low-smoke, non-halogenated flame retardant composition made from and/or containing polypropylene, magnesium dihydroxide, and aluminum magnesium layered double hydroxide modified with a hydrogenated fatty acid is disclosed. A composition containing and/or made from (a) a polypropylene, (b) a first distribution of magnesium dihydroxide particles having a d50 in the range of about 0.75 microns to about 1.25 microns, (c) a second distribution of magnesium dihydroxide particles having a d50 in the range of about 1.50 microns to about 3.50 microns, and (d) aluminum magnesium layered double hydroxide modified with a hydrogenated fatty acid is disclosed. A power cable having a jacket made from and/or containing a low-smoke non-halogenated flame retardant composition is also disclosed.
Abstract:
A flame resistant polymer is obtained by reacting polyacrylonitrile with amine and nitro compounds, the polyacrylonitrile being polymerized by aqueous suspension polymerization using a redox initiator and containing an S component at an amount of 3,000 μg/g or less. A PAN-based polymer in which both yarn producing properties and flame resistance are improved can be realized.
Abstract:
A bridged polysilsesquioxane-based flame retardant filler imparts flame retardancy to printed circuit boards (PCBs). In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having two or more trialkoxysilyl groups attached to an organic bridging group that contains a fire retardant group (e.g., a halogen atom, a phosphinate, a phosphonate, a phosphate ester, and combinations thereof). Bridged polysilsesquioxane particles formed by sol-gel polymerization of (((2,5-dibromo-1,4-phenylene)bis(oxy))bis(ethane-2,1-diyl))bis(trimethoxysilane), for example, and follow-on sol-gel processing may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an embodiment of the present invention, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a bridged polysilsesquioxane-based flame retardant filler.
Abstract:
A flame retardant filler includes a bridged polysilsesquioxane prepared by sol-gel polymerization. In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having two or more trialkoxysilyl groups attached to an organic bridging group that contains a fire retardant group (e.g., a halogen atom, a phosphinate, a phosphonate, a phosphate ester, and combinations thereof). Bridged polysilsesquioxane particles formed by sol-gel polymerization of (((2,5-dibromo-1,4-phenylene)bis(oxy))bis(ethane-2,1-diyl))bis(trimethoxysilane), for example, and follow-on sol-gel processing may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant.
Abstract:
A phosphorus-containing polyester composite and method of manufacturing the same is related to the field of compound formulation. The composite is prepared by condensation under certain conditions of (A) a poly-functional phosphorus-containing aromatic hydroxy compound; (B) a difunctional aromatic acryl chloride compound and (C) a monofunctional aromatic phenol compound used as a blocking agent. The composite is used as a curing agent for epoxy. The phosphorus-containing polyester composite is reacted with the epoxy group of the epoxy to obtain non-halogen and flame-retardant cured composite being environment friendly and having low dielectric, low dielectric loss factor and high heat resistance. It can be used in an integrated circuit board and used as a semiconductor packaging material.
Abstract:
The invention relates to a polymer composition comprising high impact polystyrene (HIPS) and a combination of flame retardants which are brominated epoxy oligomers and polymers. A process for preparing the HIPS composition through a masterbatch route and a masterbatch composition which contains the flame retardants are also disclosed.
Abstract:
Provided are a resin blend for melt processing, a pellet and a method of preparing a resin article using the same. The resin blend may include a first resin, and a second resin having a difference in surface energy from the first resin at 25° C. of 0.1 to 35 mN/m. The resin blend can improve mechanical and surface characteristics of a resin article. Further, since coating or plating is not required for manufacturing a resin article, a manufacturing time and/or cost can be reduced, and productivity can be increased.
Abstract:
A vibration damping material according to one aspect of the present invention comprises a composition as a main component, the composition being prepared by mixing based on 100 parts by weight of acrylic rubber, at least, in an external ratio, 0.01 to 15 parts by weight of organic peroxide that can crosslink between epoxy-based crosslinking points with each other, 25 to 50 parts by weight of carbon black having a mean particle diameter of 22 to 45 nm, and 15 to 35 parts by weight of carbon black having a mean particle diameter of 70 to 85 nm; and crosslinking crosslinking points in the acrylic rubber with each other through the organic peroxide.
Abstract:
The present invention relates to phosphorous-containing triazine compounds. Polymers containing the phosphorous-containing triazine compounds also are provided. The polymers may include thermoplastic or thermoset polymers. The phosphorous-containing triazine compounds may be flame retardants.