Plating method for magnesium or magnesium alloy
    42.
    发明专利
    Plating method for magnesium or magnesium alloy 审中-公开
    镁或镁合金的镀层方法

    公开(公告)号:JP2011012293A

    公开(公告)日:2011-01-20

    申请号:JP2009155607

    申请日:2009-06-30

    Abstract: PROBLEM TO BE SOLVED: To provide a plating method for magnesium or magnesium alloy, which imparts adequate corrosion resistance to a plated product, produce the product with adequate efficiency, adequately suppresses the occurrence of EMI, and imparts a decorative appearance having a metallic luster on the surface of the product.SOLUTION: The plating method for magnesium or magnesium alloy includes a step of forming an electroconductive resin layer containing an electroconductive filler other than a metal on a magnesium or magnesium alloy substrate, prior to a plating step.

    Abstract translation: 要解决的问题:为了提供对镀覆产品赋予足够的耐腐蚀性的镁或镁合金的镀覆方法,以足够的效率生产产品,充分抑制EMI的发生,并赋予具有金属光泽的装饰外观 产品的表面。解决方案:镁或镁合金的电镀方法包括在电镀步骤之前,在镁或镁合金基底上形成含有金属以外的导电填料的导电树脂层的步骤。

    Plated member
    44.
    发明专利
    Plated member 有权
    备注会员

    公开(公告)号:JP2009249648A

    公开(公告)日:2009-10-29

    申请号:JP2008095187

    申请日:2008-04-01

    Abstract: PROBLEM TO BE SOLVED: To provide a plated member having a soft alloy plating film formed thereon having high durability against sulfurization and obtained by a simple method. SOLUTION: The plated member is obtained by subjecting a base material to silver plating and indium plating, and diffusing indium into silver by thermal diffusion. The rate of content of the indium in the film is preferably 0.1% or more and less than 60% by weight. In order to control hardness, one or more kinds of metal selected from among copper, zinc, gallium, germanium, tin, antimony, gold and bismuth can be added in a content of not more than 1% (wt.%) in the film. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种具有在其上形成的具有高耐硫化耐久性并通过简单方法获得的软合金镀膜的镀层构件。 解决方案:通过使基材进行镀银和铟电镀,并通过热扩散将铟扩散到银中而获得电镀部件。 膜中的铟的含有率优选为0.1重量%以上且小于60重量%。 为了控制硬度,可以在膜中添加选自铜,锌,镓,锗,锡,锑,金和铋中的一种或多种金属,其含量不超过1%(重量%) 。 版权所有(C)2010,JPO&INPIT

Patent Agency Ranking