Abstract:
PROBLEM TO BE SOLVED: To provide a heating device having a new holding structure of an electrical heating element, and to provide a substrate-treating device using the heating device, a method of manufacturing a semiconductor device, and a penetrating member. SOLUTION: The heating device comprises: the planar electrical heating element 20 having a cutout or a through hole; a sidewall member 50 that surrounds a heating space 18 and is made of a conductive material; a holding section 30 that is arranged at the side of the heating space 18 in the sidewall member 50 and holds the electrical heating element 20 only by one end; a penetration 40d that projects at the side of the heating space 18 in the sidewall member 50 for arrangement and penetrates the cutout of the electrical heating element 20 or the through hole 40a between one end 20a of the electrical heating element 20 and the other end; and a penetrating member 40 having projections 40b, 40c that project toward a cross direction crossing a direction penetrating from the penetration 40d on the front and rear of the electrical heating element 20 as compared with the penetration 40d and regulates the movement of the electrical heating element 20 to the penetration direction. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a new structure of a heating device capable of improving the responsiveness. SOLUTION: This substrate processing device is provided with a reaction vessel for processing a substrate and a heating device for heating the substrate in the reaction vessel. The heating device has an inner layer 50 of a sidewall, a middle layer 60 of the sidewall and an outer layer 70 of the sidewall, at least the inner layer 50 of the sidewall and the middle layer 60 of the sidewall have electrical conductivity, and the inner layer 50 of the sidewall holds a heating element 20. The middle layer 60 of the sidewall is fixed from the outside with a first fastening member 54 via an insulating member 51 fixed to the inner layer 50 of the sidewall. A second fastening member 71, fixed from the outside of the outer layer 70 of the sidewall for preventing the first fastening member 54 from dropping off, is provided at a position where it overlaps the first fastening member 54. COPYRIGHT: (C)2009,JPO&INPIT