公开(公告)号：AU2274601A

公开(公告)日：2001-06-25

申请号：AU2274601

申请日：2000-12-18

Applicant: ADVANCED INTERCONNECTIONS

Inventor： MURPHY JAMES W

IPC: H01R13/187 ,  H01R33/74 ,  H01R12/00

Abstract: A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.

公开(公告)号：CA1199697A

公开(公告)日：1986-01-21

申请号：CA447792

申请日：1984-02-20

Applicant: ADVANCED INTERCONNECTIONS

Inventor： MURPHY JAMES V

IPC: B23P19/02 ,  B23P19/00 ,  B23P21/00 ,  B65D73/00 ,  H01R4/02 ,  H01R43/20 ,  H05K3/30 ,  H05K3/34 ,  H05K13/04 ,  H01R23/72 ,  H01R43/00

Abstract: IMPROVED SOCKET TERMINAL POSITIONING METHOD AND CONSTRUCTION MURRAY JAMES V. An improved method and construction for positioning a plurality of socket terminals on an electrical circuit board in a predetermined configuration prior to the solder connection thereto. A sheet of electrically insulative, flexible, resinous plastic material is provided with a plurality of holes in an array conforming to the desired positioning of the sockets on the circuit boards. The socket terminals are provided with an enlarged generally cylindrical head including an intermediate groove such that the heads extend into the holes and are adapted for frictional snap engagement with the sheet. The sheet with the array of sockets temporarily held thereby is positioned on the circuit board which is then conventionally soldered so as to electrically and mechanically fix the sockets to the board, Thereafter, the sheet may be removed. The enlarged head of the circuit terminal is provided with leading edge sheet contacting surface to enable the terminals to be push positioned into the holes without injuring the sheet.

公开(公告)号：WO2012003174A1

公开(公告)日：2012-01-05

申请号：PCT/US2011/042120

申请日：2011-06-28

Applicant: ADVANCED INTERCONNECTIONS CORP. ,  GOODMAN, Glenn ,  MURPHY, Michael J.

Inventor： GOODMAN, Glenn ,  MURPHY, Michael J.

IPC: H01R13/24 ,  H01R12/71

CPC classification number: H01R13/2407 ,  H01R12/714 ,  H01R13/2464

Abstract: A connector assembly configured to electrically connect a first substrate with a second substrate is provided. The connector assembly includes an insulating support member including an array of apertures, and terminal assemblies disposed in the apertures. Each terminal assembly includes a hollow cylindrical body, and first and second terminals disposed on opposed ends of the body. The body is split by an opening extending between opposed ends, and resiliency of the body biases the first and second terminals in opposed directions along the longitudinal axis.

Abstract translation: 提供了被配置为将第一基板与第二基板电连接的连接器组件。 连接器组件包括包括孔阵列的绝缘支撑构件和设置在孔中的端子组件。 每个端子组件包括中空圆柱体，以及设置在主体的相对端上的第一和第二端子。 主体由在相对端之间延伸的开口分开，并且主体的弹性沿着纵向轴线在相反的方向上偏压第一和第二端子。

公开(公告)号：WO2009124121A3

公开(公告)日：2009-10-08

申请号：PCT/US2009/039135

申请日：2009-04-01

Applicant: ADVANCED INTERCONNECTIONS CORP. ,  GOODMAN, Glenn

Inventor： GOODMAN, Glenn

IPC: H01L23/48

Abstract: An intercoupling component is provided that electrically connects the device leads of an integrated circuit package to a substrate. The package includes external device leads, each device lead having a downwardly extending section proximate a side of the package body, and the intercoupling component includes an insulating support member. The support member includes a first surface including first electrical attachment sites, each configured for making an electrical connection with a corresponding one of the device leads of the package. The support member also includes an opposite second surface including second electrical attachment sites in electrical contact with the first electrical attachment sites, each of the second electrical attachment sites including a plurality of solder balls associated with each device lead. The plurality of solder balls are used to form an electrical connection between each surface mount pad on the substrate and the corresponding conductive pad of the intercoupling component.

公开(公告)号：WO2008067182B1

公开(公告)日：2008-10-30

申请号：PCT/US2007084830

申请日：2007-11-15

Applicant: ADVANCED INTERCONNECTIONS ,  GOODMAN GLENN

Inventor： GOODMAN GLENN

IPC: H01R13/24 ,  H05K7/10

CPC classification number: H01R13/2421 ,  H05K7/1061

Abstract: A male contact (18), a connector assembly of the type used to electrically connect electrical devices, and a method of manufacturing an electrical connector are disclosed; the connector assembly (10) including at least said male contact.

Abstract translation: 公开了一种阳接触件（18），一种用于电气连接电气设备的连接器组件，以及一种制造电连接器的方法。 所述连接器组件（10）至少包括所述阳接触件。

公开(公告)号：WO2008006045A3

公开(公告)日：2008-03-27

申请号：PCT/US2007072901

申请日：2007-07-06

Applicant: ADVANCED INTERCONNECTIONS ,  GOODMAN GLENN

Inventor： GOODMAN GLENN

IPC: G01R1/04 ,  H01L23/32 ,  H01R13/24

CPC classification number: H01R13/2421 ,  G01R1/0483 ,  H01L23/4338 ,  H01L2924/0002 ,  H05K7/1069 ,  H01L2924/00

Abstract: An intercoupling component used to couple an array of electrical connection regions disposed on a first substrate to an array of electrical connection regions disposed on a second substrate. The intercoupling component includes an insulative support member including an array of holes extending therethrough, the array of holes located in a pattern corresponding to the array of electrical connection regions on the first substrate; and a plurality of terminals. Each terminal includes a socket including a socket head and a socket body, the socket defining a socket cavity; a pin including a pin head and a pin body, the pin head positioned within one of the array of holes, the pin body extending from the pin head and received at least partially within the socket cavity; and a resilient member configured to bias the socket head is biased away from the pin head.

Abstract translation: 用于将设置在第一基板上的电连接区域阵列耦合到设置在第二基板上的电连接区域阵列的互耦组件。 所述互耦组件包括绝缘支撑构件，所述绝缘支撑构件包括延伸穿过其中的孔阵列，所述阵列阵列以对应于所述第一基板上的电连接区域阵列的图案定位; 和多个终端。 每个终端包括一个包括一个插座头和一个插座主体的插座，该插座限定一个插座腔; 销钉包括销头和销体，所述销头位于所述孔阵列之一内，所述销体从所述销头延伸并至少部分地容纳在所述插座腔内; 并且构造成偏置插座头的弹性构件被偏压远离销头。

公开(公告)号：WO1999014823A1

公开(公告)日：1999-03-25

申请号：PCT/US1997016297

申请日：1997-09-16

Applicant: ADVANCED INTERCONNECTIONS CORPORATION

Inventor： ADVANCED INTERCONNECTIONS CORPORATION ,  MURPHY, James, V. ,  MURPHY, Michael, J. ,  FISHER, Burton ,  TAYLOR, Robert

IPC: H01R09/09

CPC classification number: H01R13/2478 ,  H01R13/2485 ,  H05K3/325 ,  H05K7/1061 ,  H05K7/1084

Abstract: A ball grid array assembly (10) consists of a socket body (24) having a plurality of vias (30) extending therethrough, a plurality of electrically conductive contact assemblies (26) respectively disposed in corresponding vias (30), and a releasable cover plate (28). Each of the contact assemblies (26) includes a lower terminal end for engaging a terminal pad (14) on a circuit board (16), and further includes an upper multi-fingered contact arrangement (48) for engaging a ball contact (20) of a ball grid array package (12). Three separate embodiments are disclosed. In use, the ball grid array package (12) is received in assembled relation with the socket body (24) wherein the ball contacts (20) of the ball grid array package (12) are received into the vias (30) in engaging electrical communication with the upper contact ends of the contacts assemblies (26).

Abstract translation: 球栅阵列组件（10）由具有穿过其延伸的多个通孔（30）的插座本体（24）组成，分别设置在对应的通路（30）中的多个导电触头组件（26）和可释放的盖 板（28）。 每个接触组件（26）包括用于接合电路板（16）上的端子焊盘（14）的下终端，并且还包括用于接合球接触件（20）的上多个多指接触装置（48） 的球栅阵列封装（12）。 公开了三个单独的实施例。 在使用中，球栅阵列封装（12）以与插座主体（24）组装的关系接收，其中球栅阵列封装（12）的球触点（20）被接收到通孔（30）中，以接合电 与触头组件（26）的上接触端的连通。

公开(公告)号：WO1994028697A1

公开(公告)日：1994-12-08

申请号：PCT/US1994005174

申请日：1994-05-10

Applicant: ADVANCED INTERCONNECTIONS CORPORATION ,  MURPHY, James, V.

Inventor： ADVANCED INTERCONNECTIONS CORPORATION

IPC: H05K07/02

CPC classification number: H05K7/1023

Abstract: An intercoupling component (e.g. adapter or socket) (10) for interconnecting an integrated circuit (IC) package (22) to a printed circuit board (12) includes a molded polymer member (18) having alignment member (e.g. ribs) (26) extending between adjacent connection regions of the component. The molded ribs (26) assure accurate alignment of each connection lead (24) of the IC package (22) to connection regions (16) of the printed circuit board (12). The intercoupling component further includes resilient members (50), each member (50) associated with a connection lead (24) of the IC package (22) for assuring that reliable contact is maintained between each connection lead (24) and connection region (16) of the circuit board (12).

Abstract translation: 用于将集成电路（IC）封装（22）互连到印刷电路板（12）的相互耦合部件（例如，适配器或插座）（10）包括具有对准部件（例如肋）（26）的模制聚合物部件（18） 在部件的相邻连接区域之间延伸。 模制肋（26）确保IC封装（22）的每个连接引线（24）与印刷电路板（12）的连接区域（16）的精确对准。 所述互耦组件还包括弹性构件（50），每个构件（50）与所述IC封装（22）的连接引线（24）相关联，用于确保在每个连接引线（24）和连接区域（16）之间保持可靠的接触 ）电路板（12）。

公开(公告)号：WO1984003653A1

公开(公告)日：1984-09-27

申请号：PCT/US1984000163

申请日：1984-02-06

Applicant: ADVANCED INTERCONNECTIONS, INC.

Inventor： ADVANCED INTERCONNECTIONS, INC. ,  MURPHY, James, V.

IPC: B23P17/00

CPC classification number: B65D73/0042 ,  H01R4/02 ,  H01R12/58 ,  H01R12/65 ,  H01R43/205 ,  H05K3/306 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2203/0195 ,  Y10T29/4987 ,  Y10T29/49876

Abstract: An improved method and construction for positioning a plurality of socket terminals (34) on an electrical circuit board (22) in a predetermined configuration prior to the solder connection thereto. A sheet of electrically insulative, flexible, resinous plastic material (30, 30a) is provided with a plurality of holes (32, 32a) in an array conforming to the desired positioning of the sockets on the circuit boards. The socket terminals are provided with an enlarged generally cylindrical head (50) including an intermediate groove (68) such that the heads extend into the holes (32, 32a) and are adapted for frictional snap engagement with the sheet (30, 30a). The sheet with the array of sockets temporarily held thereby is positioned on the circuit board which is then conventionally soldered so as to electrically and mechanically fix the sockets to the boards. Thereafter, the sheet may be removed. The enlarged head (50) of the circuit terminal is provided with leading edge sheet contacting surface (66) to enable the terminals to be push positioned into the holes without injuring the sheet.

公开(公告)号：EP1540779A1

公开(公告)日：2005-06-15

申请号：EP03761284.3

申请日：2003-06-24

Applicant: ADVANCED INTERCONNECTIONS CORPORATION

Inventor： PERUGINI, Michael ,  SAYDAM, Erol, D. ,  EASTMAN, Gary, D. ,  LANGON, Alfred, J. ,  PREW, Raymond, A.

IPC: H01R13/648

CPC classification number: H01R12/716 ,  H01R12/52 ,  H01R13/187 ,  H01R13/405 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6477 ,  H01R13/6586 ,  H01R13/6591 ,  H01R13/6598

Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.