Abstract:
Methods and devices are provided for fabricating a semiconductor device having barrier regions within regions of insulating material resulting in outgassing paths from the regions of insulating material. A method comprises forming a barrier region within an insulating material proximate the isolated region of semiconductor material and forming a gate structure overlying the isolated region of semiconductor material. The barrier region is adjacent to the isolated region of semiconductor material, resulting in an outgassing path within the insulating material.
Abstract:
The disclosed subject matter relates to semiconductor transistor devices and associated fabrication techniques that can be utilized to form silicide contacts having an increased effective size, relative to conventional silicide contacts. A semiconductor device fabricated in accordance with the processes disclosed herein includes a layer of semiconductor material and a gate structure overlying the layer of semiconductor material. A channel region is formed in the layer of semiconductor material, the channel region underlying the gate structure. The semiconductor device also includes source and drain regions in the layer of semiconductor material, wherein the channel region is located between the source and drain regions. Moreover, the semiconductor device includes facet-shaped silicide contact areas overlying the source and drain regions.
Abstract:
Novel pyrrolopyrimidines as shown in formula (I): and pharmaceutically acceptable derivatives thereof. The compounds are useful in the inhibition of IGF-1R.
Abstract:
Semiconductor transistor devices and related fabrication methods are provided. An exemplary transistor device includes a layer of semiconductor material having a channel region defined therein and a gate structure overlying the channel region. Recesses are formed in the layer of semiconductor material adjacent to the channel region, such that the recesses extend asymmetrically toward the channel region. The transistor device also includes stress-inducing semiconductor material formed in the recesses. The asymmetric profile of the stress-inducing semiconductor material enhances carrier mobility in a manner that does not exacerbate the short channel effect.
Abstract:
An apparatus for generating Viterbi-processed data using an input signal obtained from reading an optical disc includes a Viterbi decoding unit and a control circuit. The Viterbi decoding unit is arranged to process the input signal and generate the Viterbi-processed data. In addition, the control circuit is arranged to control at least one component of the apparatus based upon at least one signal within the apparatus. Additionally, the component includes a phase locked loop (PLL) processing unit, an equalizer, and/or the Viterbi decoding unit. An associated apparatus including an equalizer and a Viterbi module is further provided. An associated apparatus including a Viterbi decoding unit and a control circuit is also provided. An associated apparatus including an equalizer, at least one offset/gain controller, and a Viterbi module is further provided. An associated apparatus including an equalizer, a Viterbi module, and a peak/bottom/central (PK/BM/DC) detector is also provided.
Abstract:
A method for fabricating a nitrogen-containing dielectric layer and semiconductor device including the dielectric layer in which a silicon oxide layer is formed on a substrate, such that an interface region resides adjacent to substrate and a surface region resides opposite the interface region. Nitrogen is introduced into the silicon oxide layer by applying a nitrogen plasma. After applying nitrogen plasma, the silicon oxide layer is annealed. The processes of introducing nitrogen into the silicon oxide layer and annealing the silicon oxide layer are repeated to create a bi-modal nitrogen concentration profile in the silicon oxide layer. In the silicon oxide layer, the peak nitrogen concentrations are situated away from the interface region and at least one of the peak nitrogen concentrations is situated in proximity to the surface region. A method for fabricating a semiconductor device is incorporating the nitrogen-containing silicon oxide layers also disclosed.
Abstract:
A method for fabricating a MOSFET (e.g., a PMOS FET) includes providing a semiconductor substrate having surface characterized by a (110) surface orientation or (110) sidewall surfaces, forming a gate structure on the surface, and forming a source extension and a drain extension in the semiconductor substrate asymmetrically positioned with respect to the gate structure. An ion implantation process is performed at a non-zero tilt angle. At least one spacer and the gate electrode mask a portion of the surface during the ion implantation process such that the source extension and drain extension are asymmetrically positioned with respect to the gate structure by an asymmetry measure.
Abstract:
The invention provides apparatuses and techniques for controlling flow between a manifold and two or more connecting microchannels. Flow between plural connecting microchannels, that share a common manifold, can be made more uniform by the use of flow straighteners and distributors that equalize flow in connecting channels. Alternatively, flow can be made more uniform by sections of narrowed diameter within the channels. Methods of making apparatus and methods of conducting unit operations in connecting channels are also described.
Abstract:
A button for an implant healing abutment includes a button body coupled to an implant healing abutment; and a pressing part projecting sideward from the button body, wherein the pressing part covers, fixes and heals an incised gingival flap including attached gingiva. An implant healing abutment having a pressing part includes an implant healing abutment joined to an implant fixture; and a pressing part projecting sideward from the implant healing abutment, wherein the pressing part covers, fixes and heals an incised gingival flap including attached gingiva.