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公开(公告)号：JP3519731B1
公开(公告)日：2004-04-19
申请号：JP2003203036
申请日：2003-07-29
Applicant: Fcm株式会社
Inventor： 茂紀 三浦
Abstract: 【要約】 【課題】 本発明は、表面層が剥離したり溶出することがなく、挿抜性や接触抵抗に優れるとともに耐熱性、耐食性、高硬度等を兼ね備えた端子およびそれを有する部品、ならびにそれを有する製品を提供することを目的とする。 【解決手段】 本発明の端子は、導電性基体上の全面または部分に、ルテニウム単独またはルテニウムを含む合金により構成されるルテニウム層が形成されており、該ルテニウム層上の全面または部分に、白金単独または白金を含む合金により構成される白金層が形成されている。
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公开(公告)号：JP2004079486A
公开(公告)日：2004-03-11
申请号：JP2002242150
申请日：2002-08-22
Inventor： MIURA SHIGENORI
CPC classification number: H01L2224/48247 , H01L2224/85464 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078
Abstract: PROBLEM TO BE SOLVED: To provide a connector terminal, and a connector having it, excellent in insertion and pulling off ease and provided with a high degree of corrosion resistance.
SOLUTION: The connector terminal has a ruthenium layer formed on a conductive base, and a gold layer is formed on the ruthenium layer. Further, the connector terminal has at least one foundation layer formed between the conductive base and the ruthenium layer made of at least one kind of metal selected from a group consisting of Ni, Cu, Au and Ag. The connector is provided with the connector terminal.
COPYRIGHT: (C)2004,JPO-
公开(公告)号：JP2004014679A
公开(公告)日：2004-01-15
申请号：JP2002164056
申请日：2002-06-05
Inventor： MIURA SHIGENORI
CPC classification number: H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To provide a circuit board for lamination for achieving the construction of a laminated circuit extremely economically and easily without using any spacers that have been indispensably used for a conventional laminated circuit. SOLUTION: The circuit board for lamination is the one where conductive layers 102, 103 for composing a circuit are formed on both the front and rear of an insulated substrate 101. Both the conductive layers on both the front and rear can be electrically joined via a via hole 104 that physically penetrates the insulated substrate. Further, at least one conductive projecting section 105 is provided on at least one conductive layer in both the conductive layers. Additionally, the laminated circuit is the one where at least one circuit board and at least one semiconductor wafer are successively laminated, the circuit board for lamination is used as the circuit board, and each circuit board is electrically joined to the conductive projecting section. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP4964999B1
公开(公告)日：2012-07-04
申请号：JP2011271328
申请日：2011-12-12
Applicant: Fcm株式会社
Inventor： 茂紀 三浦
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a flat cable whose arc-like shape of a cross section is difficult to be deformed. SOLUTION: The method is for manufacturing a flat cable comprising a first insulating material, a second insulating material, and a conductor coated with the first insulating material and the second insulating material, and having concave on one side and convex on the other side by forming a cross section in the direction perpendicular to the length direction into an arc shape. The method includes the steps of: preparing a first precursor having the conductor formed on any one surface of the first insulating material; forming a second precursor by coating the surface, on which the conductor of the first precursor is formed, with the second insulating material so as to coat the conductor, and drying or heat treating the second insulating material adding tension in a length direction of the second precursor. COPYRIGHT: (C)2013,JPO&INPIT
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Patent Agency Ranking
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公开(公告)号：JP4156021B1
公开(公告)日：2008-09-24
申请号：JP2008017889
申请日：2008-01-29
Applicant: Fcm株式会社
Inventor： 茂紀 三浦
IPC: H01B5/14
CPC classification number: G02F1/1345 , G02F2001/13629 , H01L27/3279 , H01L27/329 , H01L2251/308 , H05K3/24 , H05K2201/0108 , H05K2201/0326 , H05K2201/0338
Abstract: 【課題】本発明の目的は、透明性と導電性とを両立した電極基板を提供することにある。
【解決手段】本発明の電極基板は、透明性基材上に第１導電性物質からなる第１導電層と第２導電性物質からなる第２導電層とを形成してなるものであって、該第１導電層は、該透明性基材上に形成され、該第２導電層は、該第１導電層の少なくとも一部を覆うようにして該透明性基材上に形成され、該第２導電層の幅は、該第１導電層の幅を１とする場合１．５以上３００以下であり、該第２導電性物質は、該第１導電性物質よりも高い光透過率を有するが、導電性は第１導電性物質より低いことを特徴としている。
【選択図】図１-
公开(公告)号：JP4072899B2
公开(公告)日：2008-04-09
申请号：JP2002356696
申请日：2002-12-09
Applicant: Fcm株式会社
Inventor： 茂紀 三浦
IPC: B32B9/00 , B32B7/02 , C23C14/02 , C23C14/14 , C23C14/20 , H01B5/14 , H01L21/3205 , H01L21/768 , H01L23/522
CPC classification number: C23C14/024 , C23C14/20
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公开(公告)号：JP2007115881A
公开(公告)日：2007-05-10
申请号：JP2005305454
申请日：2005-10-20
Applicant: Fcm Kk , Fcm株式会社 , Fujimori Kogyo Co Ltd , 藤森工業株式会社
Inventor： NAGATSUKA TOMOSHI , TAKAMURA SATOSHI , OISHI NORIO , MIURA SHIGENORI
Abstract: PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding material having high conductivity and transmittivity which can prevent the corrosion of a metal silver of a fine wiring pattern formed on a transparent base material and the peeling of the fine wiring pattern from the transparent base material, and has stable developed silver not diffusing in a plated metal layer.
SOLUTION: A fine wiring pattern of developed silver generated by a photographic method is provided on one surface of the transparent base material, and a plurality of kinds of metal plating layers selected from among a group of metals consisting of copper (Cu), nickel (Ni) and iron (Fe) are formed on the developed silver layer, thereby manufacturing the electromagnetic wave shielding material.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：提供一种具有高导电性和透射率的电磁波屏蔽材料，其能够防止形成在透明基材上的精细布线图案的金属银的腐蚀和精细布线图案从 透明基材，并且在电镀金属层中具有不扩散的稳定显影的银。 解决方案：在透明基材的一个表面上提供通过照相方法产生的显影银的精细布线图案，并且选择由铜（Cu）组成的一组金属组成的多种金属镀层， ，在显影的银层上形成镍（Ni）和铁（Fe），从而制造电磁波屏蔽材料。 版权所有（C）2007，JPO＆INPIT
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