公开(公告)号：CA3004760A1

公开(公告)日：2016-06-16

申请号：CA3004760

申请日：2015-12-02

Applicant: MOTION ENGINE INC

Inventor： BOYSEL ROBERT MARK

IPC: G01R33/02

Abstract: A micro-electro-mechanical system (MEMS) magnetometer is provided for measuring magnetic field components along three orthogonal axes. The MEMS magnetometer includes a top cap wafer, a bottom cap wafer and a MEMS wafer having opposed top and bottom sides bonded respectively to the top and bottom cap wafers. The MEMS wafer includes a frame structure and current-carrying first, second and third magnetic field transducers. The top cap, bottom cap and MEMS wafer are electrically conductive and stacked along the third axis. The top cap wafer, bottom cap wafer and frame structure together form one or more cavities enclosing the magnetic field transducers. The MEMS magnetometer further includes first, second and third electrode assemblies, the first and second electrode assemblies being formed in the top and/or bottom cap wafers. Each electrode assembly is configured to sense an output of a respective magnetic field transducer induced by a respective magnetic field component.

公开(公告)号：EP3028007A4

公开(公告)日：2017-07-12

申请号：EP14831791

申请日：2014-08-01

Applicant: MOTION ENGINE INC

Inventor： BOYSEL ROBERT MARK ,  ROSS LOUIS

IPC: G01C19/5769 ,  B81B7/00 ,  G01P15/14 ,  G01P15/18

CPC classification number: G01C19/56 ,  G01C19/5769 ,  H01L2224/94

公开(公告)号：EP3019442A4

公开(公告)日：2017-01-25

申请号：EP14822259

申请日：2014-07-04

Applicant: MOTION ENGINE INC

Inventor： BOYSEL ROBERT MARK ,  ROSS LOUIS

IPC: B81C1/00 ,  B81B7/02

CPC classification number: B81B7/007 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00301 ,  H01L2224/94

公开(公告)号：EP3019442A1

公开(公告)日：2016-05-18

申请号：EP14822259.9

申请日：2014-07-04

Applicant: Motion Engine Inc.

Inventor： BOYSEL, Robert, Mark ,  ROSS, Louis

IPC: B81C1/00 ,  B81B7/02

CPC classification number: B81B7/007 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00301 ,  H01L2224/94

Abstract: A MEMS device is provided. The device includes a MEMS wafer, a top cap wafer and a bottom cap wafer. The top and bottom cap wafers are respectively bonded to first and second sides of the MEMS wafer, the MEMS and cap wafers being electrically conductive. The outer side of the top cap wafer is provided with electrical contacts. The MEMS wafer, the top cap wafer and the bottom cap wafer define a cavity for housing a MEMS structure. The device includes insulated conducting pathways extending from within the bottom cap wafer, through the MEMS wafer and through the top cap wafer. The pathways are connected to the respective electrical contacts on the top cap wafer, for routing electrical signals from the bottom cap wafer to the electrical contacts on the top cap wafer. A method of manufacturing the MEMS device is also provided.

公开(公告)号：EP3028007A1

公开(公告)日：2016-06-08

申请号：EP14831791.0

申请日：2014-08-01

Applicant: Motion Engine Inc.

Inventor： BOYSEL, Robert Mark ,  ROSS, Louis

IPC: G01C19/5712 ,  G01P15/14 ,  G01P15/18

CPC classification number: G01C19/56 ,  G01C19/5769 ,  H01L2224/94

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

Abstract translation: 提供了MEMS运动传感器及其制造方法。 该传感器包括一个MEMS晶片，其中包括一个检测质量块和弹性弹簧，悬挂该质量块，并使检测质量块相对于外框沿着相互正交的x，y和z轴移动。 传感器包括顶盖和底盖晶片，其包括形成具有检测质量的电容器的顶部和底部电极电极，电极被配置为检测检测质量块的运动。 电触点设置在顶盖晶片上，其中一些连接到相应的顶盖电极，而另一些则通过绝缘导电路径连接到相应的底盖电极，绝缘导电通道沿着z轴从相应的底部电极之一延伸 帽电极并且依次通过底盖晶片，MEMS晶片的外框架和顶盖晶片。