보강된 구조를 갖는 광통신 모듈
    41.
    发明公开
    보강된 구조를 갖는 광통신 모듈 失效
    具有强化结构的光通信模块

    公开(公告)号:KR1020030041195A

    公开(公告)日:2003-05-27

    申请号:KR1020010071831

    申请日:2001-11-19

    Abstract: PURPOSE: An optical communication module having a reinforced structure is provided to prevent an epoxy due to the external stress by coating a reinforced adhesive on the epoxy. CONSTITUTION: A silicon optical bench(220), the first and the second semiconductor chips(230,240), and an optical fiber(250) are formed on a substrate(210). The substrate is formed with a Kovar material. The silicon optical bench is adhered on the substrate by using AuSn material. A bonding pad and circuit elements are formed on an upper surface of the silicon optical bench. A V-shaped groove is formed on the upper surface of the silicon optical bench in order to fix the optical fiber. The first and the second semiconductor chips are adhered on the upper surface of the silicon optical bench by using the AuSn material. The optical fiber is formed on the V-shaped groove. An epoxy(260) is coated on an upper surface of the optical fiber. A reinforced adhesive(270) is coated on the exposed surface of the epoxy.

    Abstract translation: 目的:提供一种具有加强结构的光通信模块,以通过在环氧树脂上涂覆增强的粘合剂来防止外部应力引起的环氧树脂。 构成:在基板(210)上形成硅光学台(220),第一和第二半导体芯片(230,240)以及光纤(250)。 基板由Kovar材料形成。 使用AuSn材料将硅光学台架粘附在基板上。 接合焊盘和电路元件形成在硅光学台的上表面上。 为了固定光纤,在硅光学工作台的上表面上形成V形槽。 第一和第二半导体芯片通过使用AuSn材料粘附在硅光学台的上表面上。 光纤形成在V形槽上。 环氧树脂(260)被涂覆在光纤的上表面上。 增强粘合剂(270)涂覆在环氧树脂的暴露表面上。

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