公开(公告)号：KR1020090028024A

公开(公告)日：2009-03-18

申请号：KR1020070093282

申请日：2007-09-13

Applicant: 삼성전자주식회사

Inventor： 김민우 ,  박병호 ,  신동호

IPC: H01R33/76 ,  H01R12/51

CPC classification number: H01R12/721 ,  H01R12/87

Abstract: A semiconductor module typed socket is provided to improve durability, to reduce manufacturing expenses, and transfer a signal at high speed. A semiconductor module typed socket comprises the followings: a pin(110) of which one side is even and a linear type and having at least two or more curved part(R1-R3); fixing unit(140) fixing the pin on a housing and inserted into the housing with a protruded shape; the housing unit including a space unit; the space unit in which the pin is installed; and a supporting unit notifying a stop point of an end part of a semiconductor module.

Abstract translation: 提供半导体模块型插座，以提高耐用性，降低制造成本，并高速传输信号。 半导体模块插座包括：一个平面的一个引脚（110）和一个直线型并且具有至少两个或更多个弯曲部分（R1-R3）的引脚（110）; 固定单元（140）将销固定在壳体上并以突出的形状插入到壳体中; 所述壳体单元包括空间单元; 安装销的空间单元; 以及通知半导体模块的端部的停止点的支撑单元。