-
公开(公告)号：KR1020110034207A
公开(公告)日：2011-04-05
申请号：KR1020090091660
申请日：2009-09-28
Applicant: 한국광기술원
IPC: H01L33/50
Abstract: PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to simply implement various kinds of light source which is similar to sunlight by including a common spectrum waveform change material mixing layer. CONSTITUTION: A package substrate(10) has a housing(12) with a cavity. An LED package group(20) includes a single waveform LED package(22,24,26,28) which emits light with different wavelength on the package substrate. The single wavelength LED package respectively includes light emitting diode chips(22a,24a,26a,28a). A passivation layer(14) is formed on the LED package group and the exposed package substrate to fill cavity.
Abstract translation: 目的：提供一种发光二极管封装及其制造方法，通过包括公共频谱波形变化材料混合层简单地实现与太阳光相似的各种光源。 构成：封装衬底（10）具有带空腔的壳体（12）。 LED封装组（20）包括在封装衬底上发射具有不同波长的光的单个波形LED封装（22,24,26,28）。 单波长LED封装分别包括发光二极管芯片（22a，24a，26a，28a）。 在LED封装组和暴露的封装衬底上形成钝化层（14）以填充空腔。
-
公开(公告)号：KR1020110000835A
公开(公告)日：2011-01-06
申请号：KR1020090058125
申请日：2009-06-29
Applicant: 한국광기술원
Abstract: PURPOSE: An electromagnetic interference(EMI) shielding case and a light emitting diode illuminating apparatus including the save are provided to rapidly emit heat generated from circuits by forming a thermally conductive insulating material layer and an electrically conductive material layer in the case. CONSTITUTION: A lower case(14) is composed of a lower thermally conductive insulating material layer(14a) and a lower electrically conductive material layer(14b). An upper case(12) is arranged on the lower case. The upper case is composed of an upper thermally conductive insulating material layer and an upper electrically conductive material layer. A groove is formed in the upper case. A power module(16) including circuits is arranged in the groove.
Abstract translation: 目的：提供一种电磁干扰（EMI）屏蔽盒和包括该存储器的发光二极管照明装置，以通过在壳体中形成导热绝缘材料层和导电材料层来快速地发射由电路产生的热量。 构成：下壳体（14）由下导热绝缘材料层（14a）和下导电材料层（14b）组成。 上壳体（12）布置在下壳体上。 上壳体由上部导热绝缘材料层和上部导电材料层构成。 在上壳体中形成有凹槽。 包括电路的功率模块（16）布置在凹槽中。
-
公开(公告)号：KR1020100037471A
公开(公告)日：2010-04-09
申请号：KR1020080096805
申请日：2008-10-01
IPC: H01L33/64
CPC classification number: H01L2224/14 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: A light emitting diode package and a method for manufacturing the same are provided to improve the heat resistance of the package by plating the inner wall and the bottom surface of the closed perforation of a light emitting diode in order to emit the heat from the light emitting diode. CONSTITUTION: A wiring board includes a via hole(112) and a perforation(104). A thick film copper plate(106) is arranged on the lower side of the wiring board and is divided into an anode and a cathode. The inner wall and the bottom surface of the closed perforation is plated with a thin film and a first and a second plating layer(116, 118). A light emitting diode is stacked on the second plating layer. The first plating layer is a nickel plating layer. The second plating layer is a gold or silver plating layer.
Abstract translation: 目的：提供一种发光二极管封装及其制造方法，以通过电镀发光二极管的封闭穿孔的内壁和底表面来改善封装的耐热性，从而从 发光二极管。 构成：布线板包括通孔（112）和穿孔（104）。 在该布线基板的下侧配置有厚膜铜板（106），分为阳极和阴极。 封闭穿孔的内壁和底表面镀有薄膜和第一和第二镀层（116,118）。 发光二极管堆叠在第二镀层上。 第一镀层是镀镍层。 第二镀层是金或银镀层。
-
公开(公告)号：KR1020100013584A
公开(公告)日：2010-02-10
申请号：KR1020080075176
申请日：2008-07-31
Applicant: 한국광기술원
CPC classification number: G02B9/34 , G02B1/041 , G02B5/09 , G02B13/18 , G02B26/105
Abstract: PURPOSE: An asymmetric projection lens is provided to improve good resolution by rectifying deformation of screen rates and distortion of a phase with an asymmetry projection lens, and to reduce manufacturing costs of the lens. CONSTITUTION: A reflecting mirror(110) revises a view angle and distortion of a received light source(100). A lens part(120) includes at least one or more asymmetric projection lens. The lens part includes two or 4 lenses. The reflecting mirror is selected among a scan mirror, a polygon mirror and an optical prism. The lens part includes a first lens member and a second lens member.
Abstract translation: 目的：提供一种不对称投影透镜，通过整理屏幕速率的变形和使用不对称投影透镜的相位变形来提高分辨率，并降低镜头的制造成本。 构成：反射镜（110）修正接收的光源（100）的视角和变形。 透镜部分（120）包括至少一个或多个非对称投影透镜。 透镜部分包括两个或四个透镜。 反射镜选自扫描镜，多面镜和光学棱镜。 透镜部分包括第一透镜部件和第二透镜部件。
-
公开(公告)号：KR1020090080289A
公开(公告)日：2009-07-24
申请号：KR1020080006164
申请日：2008-01-21
Applicant: 한국광기술원
IPC: H01L33/48
Abstract: A light emitting diode lamp having a flexible substrate and a manufacturing method thereof are provided to perform easily a light-distributing angle control operation by forming light emitting diode packages on all surfaces including a spherical surface and a non-linear surface of a lamp. An adhesive plate(120), a flexible substrate(110), and a light emitting diode package(100) are sequentially laminated on a predetermined part of an illuminating module(130) for forming the light emitting diode package. The illuminating module is formed with a hemispherical structure. The illuminating module is formed with a non-linear structure. The flexible substrate includes an insulating layer. The flexible substrate includes a copper wiring. A thickness of an insulating layer is less than the double thickness of the copper wiring when the flexible substrate is formed with a both-sided substrate.
Abstract translation: 提供一种具有柔性基板的发光二极管灯及其制造方法，其通过在包括灯的球面和非线性面的所有表面上形成发光二极管封装而容易进行配光角度控制。 顺序层压在用于形成发光二极管封装的照明模块（130）的预定部分上的粘合板（120），柔性基板（110）和发光二极管封装（100）。 照明模块形成有半球形结构。 照明模块形成为非线性结构。 柔性基板包括绝缘层。 柔性基板包括铜布线。 当柔性基板形成双面基板时，绝缘层的厚度小于铜布线的双重厚度。
-
Patent Agency Ranking
公开(公告)号：KR100819652B1
公开(公告)日：2008-04-04
申请号：KR1020060136909
申请日：2006-12-28
Applicant: 우리이티아이 주식회사 , 한국광기술원
IPC: G02F1/13357 , H01L33/00 , F21S2/00
Abstract: An LED(Light Emitting Diode) back light apparatus is provided to prevent the color spot phenomenon at the square corner of a back light by arranging white light emitting diodes instead of RGB light emitting diodes. Plural red(16), green(12) and blue(14) light emitting diodes are repetitively arrayed on a substrate(20) of a back light apparatus. White light emitting diodes(11) are arrayed at the corner of each substrate instead of the RGB light emitting diodes so that the color spot phenomenon is prevented at the square corner portion of the back light apparatus. The white light emitting diodes are arrayed additionally to the sides for connecting corners of the substrate instead of the RGB light emitting diodes. The RGB light emitting diodes are assembled so that a cluster as one unit is formed. The white light emitting diodes are arrayed instead of the RGB light emitting diodes for constructing the cluster and at this time, the R light emitting diode falls vacant.
Abstract translation: 提供LED（发光二极管）背光装置，通过布置白色发光二极管代替RGB发光二极管来防止背光的正方角处的色斑现象。 多个红色（16），绿色（12）和蓝色（14）发光二极管重复排列在背光装置的基板（20）上。 白色发光二极管（11）排列在每个基板的角部，而不是RGB发光二极管，使得在背光装置的方角部分防止色斑现象。 除了RGB发光二极管之外，还将白色发光二极管排列到用于连接基板的角部的侧面。 组装RGB发光二极管，从而形成作为一个单元的簇。 排列白色发光二极管代替构成簇的RGB发光二极管，此时，R发光二极管空置。
-
公开(公告)号：KR100693462B1
公开(公告)日：2007-03-12
申请号：KR1020050070781
申请日：2005-08-02
Applicant: 한국광기술원
IPC: H01L33/50
Abstract: 본 발명은 파장변환형 발광장치 및 그 제조방법에 관한 것으로서, 특히 형광체를 이용하여 방출되는 광의 일부를 파장변환시킴으로써 백색과 같은 특정색의 광을 생성한 발광장치 및 그 제조방법에 관한 것이다. 본 발명의 형광체를 이용한 파장변환형 발광다이오드 패키지는 빛을 발산하는 발광다이오드; 상기 발광다이오드에서 발산되는 빛의 파장을 변환하여 방출하는 형광체층; 상기 형광체층의 퍼짐을 방지하는 코팅부; 및 상기 발광다이오드의 전원을 제공하는 전극부를 포함한다. 본 발명에 따르면 발광다이오드가 컵의 바닥면에 본딩되고, 상기 발광다이오드의 주위에 형광체를 코팅한 물질과 극성이 다른 물질로 코팅하고, 이 안쪽에 형광체를 도포하여 발광다이오드 전체에 균일하게 코팅함으로써 광방출면 전체에 대해 형광체층이 코팅된 발광장치를 제공하여 광파장변환효율을 향상시킨다.
형광체(phosphor), 백색 발광다이오드(white color light emitting diode), 토출(dispensing)Abstract translation: 本发明涉及到，特别地，由磷光体发射的光的一部分，以产生光，的特定颜色，例如通过将波长白色发光装置和相关的波长变换型发光装置的制造方法及其制造的方法。 使用本发明的荧光体的波长转换型发光二极管封装包括：发光的发光二极管; 荧光体层，用于转换和发射从发光二极管发射的光的波长; 防止荧光体层扩散的涂层部分; 以及用于向发光二极管供电的电极单元。 被接合到所述二极管的底表面是杯光发射根据本发明，通过将材料与极性涂层周围涂覆有不同材料的LED的荧光体，和由上的均匀地涂布在整个发光二极管的内部涂敷的荧光材料 提供具有涂覆在整个发光表面上的荧光体层的发光器件以提高光波长转换效率。
-
-
公开(公告)号：KR102157253B1
公开(公告)日：2020-09-17
申请号：KR1020180165171
申请日：2018-12-19
Applicant: 한국광기술원
IPC: H01L21/67 , H01L21/687 , B23K26/20 , B23K101/36
-
公开(公告)号：KR101933317B1
公开(公告)日：2018-12-27
申请号：KR1020170112354
申请日：2017-09-04
Applicant: 한국광기술원
Abstract: 본 발명은 LED 패키지 및 그의 제조방법에 관한 것으로, LED 패키지는 LED칩; 상기 LED칩의 전극단자에 형성된 도전성 범프; 및 적어도 상기 도전성 범프를 제외한 상기 LED칩을 감싸고, 확산제 분말 및 형광체(phosphor) 분말이 분산되어 있는 투명봉지층;을 포함한다.
-
-
-
-
-
-
-
-
-
Search Results
223
records
(took 0.021 seconds)
