Head-mounted device with active optical foveation

    公开(公告)号:US10962788B2

    公开(公告)日:2021-03-30

    申请号:US16831306

    申请日:2020-03-26

    Applicant: Apple Inc.

    Abstract: A pass-through camera in a head-mounted device may capture image data for displaying on a display in the head-mounted device. However, only low-resolution image data may be needed to display low-resolution images in the periphery of the user's field of view on the display. Therefore, the pass-through camera may only capture high-resolution images that correspond to the portion of the user's field-of-view that is being directly viewed and may capture lower resolution image data that corresponds to the real-world objects in the user's peripheral vision. To enable the camera module to selectively capture high-resolution images, the pass-through camera may include an image sensor with two or more pixel densities, a distortion lens, and/or one or more planar or curved mirrors. Any of the components in the camera module may be adjusted to change which portion of a scene is captured with high-resolution image data.

    RECEPTACLE FOR CONNECTING TO FLEXIBLE CIRCUIT BOARD

    公开(公告)号:US20210084758A1

    公开(公告)日:2021-03-18

    申请号:US17027407

    申请日:2020-09-21

    Applicant: Apple Inc.

    Abstract: Connector receptacles that may be space efficient and provide a direct connection to a flexible circuit board. One example may provide an electronic device having a receptacle including a recess formed in a housing of the electronic device. The recess may have a sidewall and a bottom surface portion, and the bottom surface portion may include one or more openings extending through the bottom surface portion from an external surface to an internal surface. One or more contacts formed on a flexible circuit board may be aligned with the one or more openings in the bottom surface portion. In this way, the receptacle may be space efficient and provide a direct connection to a flexible circuit board inside an electronic device. A cosmetic cap may be placed in the recess to obscure the existence of the connector receptacle.

    Electronic Device System With Supplemental Lenses

    公开(公告)号:US20200033560A1

    公开(公告)日:2020-01-30

    申请号:US16276286

    申请日:2019-02-14

    Applicant: Apple Inc.

    Abstract: A head-mounted device may have a display that displays content for a user. Head-mounted support structures in the device support the device on the head of the user. A non-removable lens system may be supported by the head-mounted support structures. The head-mounted support structures may be configured to receive a removable supplemental lens system. The removable supplemental lens system may be used to customize the head-mounted display to accommodate the user's vision. Information such as information on the optical characteristics of the removable supplemental lens system and the user's eyeglass prescription may be stored in the removable supplemental lens system using bar codes, text, programmable memory, or other data storage. When the removable supplemental lens system is installed in the head-mounted device, control circuitry in the head-mounted device may retrieve the stored information. A gaze tracker system or other sensors may be used in retrieving the stored information.

    Display with vias to access driver circuitry

    公开(公告)号:US10170711B2

    公开(公告)日:2019-01-01

    申请号:US15091333

    申请日:2016-04-05

    Applicant: Apple Inc.

    Abstract: A thin-film transistor layer, an organic light-emitting diode layer, and other layers may be used in forming an array of pixels on a substrate in a display. Vias may be formed through one or more layers of the display such as the substrate layer to form vertical signal paths. The vertical signal paths may convey signals between display driver circuitry underneath the display and the pixels. The vias may pass through a polymer layer and may contact pads formed within openings in the substrate. Vias may pass through a glass support layer. Metal traces may be formed in the thin-film transistor layer to create signal paths such as data lines and gate lines. Portions of the metal traces may form vias through a polymer layer such as a substrate layer or a polymer layer that has been formed on top of the substrate layer.

    MAGNETIC FIELD CONTAINMENT INDUCTORS
    50.
    发明申请

    公开(公告)号:US20180068784A1

    公开(公告)日:2018-03-08

    申请号:US15405027

    申请日:2017-01-12

    Applicant: Apple Inc.

    Abstract: A system includes a circuit board, an inductor including windings mounted on the circuit board, and a plurality of magnetic field containment devices. Each magnetic field containment device includes an independent electrical circuit that is not directly electrically connected via a conductor to any other magnetic field containment device. Each magnetic field containment device also includes a material of a certain relative permeability. Each magnetic field containment device at least partially surrounds the inductor and, in operation, at least partially contains a magnetic B-Field generated by electrical current in the windings of the inductor. The plurality of magnetic field containment devices, in operation, enables a certain saturation current in the inductor.

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