公开(公告)号：US12256186B2

公开(公告)日：2025-03-18

申请号：US18584069

申请日：2024-02-22

Applicant: Apple Inc.

Inventor： Zachary C. Rich ,  Kurt R. Stiehl ,  Arun D. Chawan ,  Michael B. Howes ,  Jonathan S. Aase ,  Esge B. Andersen ,  Yacine Azmi ,  Jahan C. Minoo ,  David J. Shaw ,  Aarti Kumar ,  Augustin Prats ,  Robert D. Watson ,  Baptiste P. Paquier ,  Axel D. Berny ,  Benjamin W. Cook ,  Jerzy S. Guterman ,  Benjamin Adair Cousins

IPC: A61F4/00 ,  H04R1/10

Abstract: A housing has a bud portion abutting an elongated stem portion. The bud portion is to fit within an ear. The bud portion has a primary sound outlet at its far end that is to be inserted into an outer ear canal, and abuts the stem portion at its near end. A speaker driver is inside the bud portion. Electronic circuitry inside the housing includes a wireless communications interface to receive audio content over-the-air and in response provides an audio signal to the speaker driver. A rechargeable battery as a power source for the electronic circuitry is located inside a cavity of the stem portion. Other embodiments are also described and claimed.

公开(公告)号：US11317196B2

公开(公告)日：2022-04-26

申请号：US16868372

申请日：2020-05-06

Applicant: Apple Inc.

Inventor： Michael B. Howes ,  Yacine Azmi ,  Scott P. Porter ,  Jonathan S. Aase ,  Andrew P. Bright ,  Christopher R. Wilk

IPC: H04R1/28 ,  H04R1/02 ,  H04R1/10

Abstract: An earphone comprising an earphone housing having a wall comprising (1) a front side that joins (2) an end portion in which a primary sound output opening is formed, which joins (3) a face portion in which a secondary output opening is formed, which joins (4) a back side which joins the front side and encloses a driver, wherein the primary output opening is dimensioned to output sound generated by a diaphragm of the driver contained within the earphone housing into the ear and the secondary output opening is dimensioned to vent the ear to a surrounding environment, and wherein the primary output opening and the secondary output opening face different directions.

公开(公告)号：US20210274273A1

公开(公告)日：2021-09-02

申请号：US17306683

申请日：2021-05-03

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  H02J50/10 ,  H02J7/00 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H01R13/52 ,  A45C13/00

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US11026010B2

公开(公告)日：2021-06-01

申请号：US16870373

申请日：2020-05-08

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  H02J50/10 ,  H02J7/00 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H02J7/02 ,  H01R13/52 ,  A45C13/00 ,  H04B1/3827 ,  H04M1/60 ,  F16B1/00

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US20200288229A1

公开(公告)日：2020-09-10

申请号：US16882020

申请日：2020-05-22

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H02J7/00 ,  H01R13/52 ,  A45C13/00

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US10694282B2

公开(公告)日：2020-06-23

申请号：US16286346

申请日：2019-02-26

Applicant: Apple Inc.

Inventor： Michael B. Howes ,  Yacine Azmi ,  Scott P. Porter ,  Jonathan S. Aase ,  Andrew P. Bright ,  Christopher R. Wilk

IPC: H04R1/02 ,  H04R1/28 ,  H04R1/10

Abstract: An earphone comprising an earphone housing having a wall comprising (1) a front side that joins (2) an end portion in which a primary sound output opening is formed, which joins (3) a face portion in which a secondary output opening is formed, which joins (4) a back side which joins the front side and encloses a driver, wherein the primary output opening is dimensioned to output sound generated by a diaphragm of the driver contained within the earphone housing into the ear and the secondary output opening is dimensioned to vent the ear to a surrounding environment, and wherein the primary output opening and the secondary output opening face different directions.

公开(公告)号：US10595112B2

公开(公告)日：2020-03-17

申请号：US15829415

申请日：2017-12-01

Applicant: Apple Inc.

Inventor： Jonathan S. Aase

IPC: H04R1/10

Abstract: Seamless earbud structures and methods for making the same are disclosed. Seamless earbud structures can be constructed using an insert molding construction method, which overmolds a cosmetic material over two sub-enclosures that are mated together. The two sub-enclosures form a housing that can encompass a driver assembly (e.g., woofer and tweeter), a conductor bundle, and provide one or more acoustic volumes. The housing has a non-occluding member and a neck member, and has a seamless or nearly seamless construction. The cosmetic material is insert molded around the housing to provide a smooth and seamless surface disposed around the periphery of the housing.

公开(公告)号：US20190289383A1

公开(公告)日：2019-09-19

申请号：US16430853

申请日：2019-06-04

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/24 ,  H02J7/02 ,  A45C13/02 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C13/10 ,  A45C13/00 ,  H04R5/033 ,  A45C11/00 ,  H01R13/52 ,  H02J7/00 ,  H04R9/06 ,  H04R9/02

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US10356510B2

公开(公告)日：2019-07-16

申请号：US15723079

申请日：2017-10-02

Applicant: Apple Inc.

Inventor： Michael B. Howes ,  Yacine Azmi ,  Scott P. Porter ,  Jonathan S. Aase ,  Andrew P. Bright ,  Christopher R. Wilk

IPC: H04R25/00 ,  H04R1/28 ,  H04R1/10 ,  H04R1/02

Abstract: An earphone comprising an earphone housing having a wall comprising (1) a front side that joins (2) an end portion in which a primary sound output opening is formed, which joins (3) a face portion in which a secondary output opening is formed, which joins (4) a back side which joins the front side and encloses a driver, wherein the primary output opening is dimensioned to output sound generated by a diaphragm of the driver contained within the earphone housing into the ear and the secondary output opening is dimensioned to vent the ear to a surrounding environment, and wherein the primary output opening and the secondary output opening face different directions.

公开(公告)号：US10299029B2

公开(公告)日：2019-05-21

申请号：US16108856

申请日：2018-08-22

Applicant: Apple Inc.

Inventor： Jonathan S. Aase

IPC: H04R1/10

Abstract: Pressure sensing earbuds and systems are disclosed. The earbuds can include one or more pressure sensors to determine the size and shape of a user's ear. The pressure signals can be relayed back to a processor, which may use them to dynamically optimize the volume levels delivered for frequencies over the audible range for a particular user.