公开(公告)号：AU2011254776A1

公开(公告)日：2012-12-20

申请号：AU2011254776

申请日：2011-05-10

Applicant: BASF SE

Inventor： BENTEN REBEKKA VON ,  EIBECK PETER

IPC: C08K3/00 ,  C08K3/26 ,  B23K26/20 ,  B29C65/00 ,  B29C65/16

Abstract: The invention relates to the use of thermoplastic molding compounds, comprising as substantial components: A) 29 to 99.95 wt % of a polyesters, B) 0.05 to 2.0 wt % of Na

公开(公告)号：AT555157T

公开(公告)日：2012-05-15

申请号：AT09769191

申请日：2009-06-19

Applicant: BASF SE

Inventor： BENTEN REBEKKA VON

IPC: C08K3/22 ,  C08K3/00

Abstract: The present invention relates to thermoplastic molding compositions, comprising A) from 19.9 to 69.99% by weight of a thermoplastic polyamide B) from 30 to 80% by weight of an aluminum oxide C) from 0.01 to 30% by weight of diatomaceous earth D) from 0 to 30% by weight of further additives, where the total of the percentages by weight of A) to D) is 100%.

公开(公告)号：CA2798879A1

公开(公告)日：2011-11-07

申请号：CA2798879

申请日：2011-05-10

Applicant: BASF SE

Inventor： BENTEN REBEKKA VON ,  EIBECK PETER

IPC: C08K3/00 ,  C08K3/26 ,  B23K26/20 ,  B29C65/00 ,  B29C65/16

Abstract: The invention relates to the use of thermoplastic molding compounds, comprising as substantial components: A) 29 to 99.95 wt % of a polyesters, B) 0.05 to 2.0 wt % of Na2CO3, K2CO3, NaHCO3, KHCO3 or mixtures thereof, relative to 100 wt % of A) and B), and additionally, C) 0 to 70 wt % of further additives, where the sum of the wt % of A) to C) is 100 %, for producing laser-transparent molded parts of any kind.