Abstract:
The invention relates to a component comprising an insert and a plastic encapsulation made of at least two plastic components, wherein the insert is encapsulated by a first plastic component A and the first plastic component A is encapsulated by a second plastic component B, wherein the first plastic component A is made of: A1: 5 to 80 wt %, relative to the total weight of the components A1 and A2, of at least one polyester based on aliphatic and aromatic dicarbolic acids and aliphatic dihydroxy compounds; A2: 20 to 95 wt %, relative to the total weight of the components A1 and A2, of at least one homo or copolyester selected from the group made up of polylactide (PLA), polycaprolactone, polyhydroxyalkanoates, and polyester made of aliphatic dicarbolic acids and aliphatic dioles; A3: 0.05 to 15 wt %, relative to the total weight of the components A1 and A2, a) of a copolymer comprising epoxide groups based on styrol, acrylic acid ester, and/or methacrylic acid ester, b) of a bisphenol-A epoxide, or c) of a natural oil, fatty acid ester, or fatty acid amide comprising epoxide groups; and the second plastic component B is made of B1: 50 to 100 wt % of at least one partially crystalline thermoplastic polyester based on aromatic dicarbolic acids and aliphatic or aromatic dihydroxy compounds, and B2: 0 to 50 wt % of at least one thermoplastic styrol(co)polymer, each relative to the polymer portion of the second plastic component B.
Abstract:
The invention relates to thermoplastic moulding masses containing: A) 10 to 99 percent by weight of at least one thermoplastic polyamide; B) 0.01 to 30 percent by weight of at least one highly branched or hyper-branched polyether amine; C) 0.5 to 80 percent by weight of a thermally conductive filler; D) 0 to 70 percent by weight of further adjuncts, wherein the sum of the weight percentages of components A) to D) is 100 %.
Abstract:
The invention relates to thermoplastic molding compounds, containing: A) 10 to 99 wt.-% of at least one thermoplastic polyamide, B) 0.01 to 30 wt.-% of at least one highly-branched or hyper-branched polyether amine, C) 0 to 70 wt.-% of further additives, wherein the sum of the weight percentages of said components A) through C) results as 100%.
Abstract:
The invention relates to thermoplastic moulding masses comprising the components A) at least one thermoplastic polyamide, B) at least one hyper-branched polyetheramine, C) at least one amorphic oxide and/or oxide hydrate of at least one metal or semi-metal having a weighted average diameter of the primary particles of 0.5 to 20 nm. The invention also relates to the use of said components B) and C) for improving the flowability and/or thermal stability of polyamides, to the use of moulding masses for producing fibres, films and moulded bodies of all types and to the thus obtained fibres, films and moulded bodies.
Abstract:
The present invention relates to an electromagnetic millimetre wave transmission reducing material, preferably having a volume resistivity of more than 1 Ocm, containing particles of at least an electrically conductive, magnetic or dielectric material and an electrically non-conductive polymer, wherein the transmission reducing material is capable of reducing transmission of electromagnetic waves in a frequency region of 60 GHz or more. The invention also relates to its use and method for reducing transmission as well as an electronic device comprising said transmission reducing material.
Abstract:
The invention relates to the use of thermoplastic molding compounds, comprising as substantial components: A) 29 to 99.95 wt % of a polyesters, B) 0.05 to 2.0 wt % of Na
Abstract:
Uso de materiales de moldeo termoplásticos, que contienen A) del 29 al 99,7 % en peso de un poliéster termoplástico, B) del 0,3 al 3 % en peso (con respecto al 100 % en peso de A) + B)) de una sal de imida de fórmula **Fórmula** o**Fórmula** o**Fórmula** o mezclas de las mismas en las que Me significa un metal alcalino, C) del 0 al 70 % en peso de aditivos adicionales, dando como resultado la suma de los porcentajes en peso A) a C) el 100 %, para la producción de cuerpos moldeados transparentes al láser con una transparencia al láser de al menos el 33 % (medida a 1064 nm en un cuerpo moldeado de 2 mm de grosor).
Abstract:
Thermoplastic molding compositions, comprising: (A) from 20 to 85% by weight of at least one polyamide whose number of amino end groups is ≧50 mmol/kg, (B) from 14.9 to 60% by weight of glass fibers. (C) from 0.01 to 2% by weight of at least one heat stabilizer, (D) from 0 to 1.5% by weight of at least one mold-release agent, and (E) from 0 to 30% by weight of other additives, where the total of the percentages by weight of (A)-(E) is 100.
Abstract:
The invention relates to thermoplastic molding compositions comprising the following components: A) at least one thermoplastic polyamide, B) at least one hyperbranched polyetheramine, C) at least one amorphous oxide and/or oxide hydrate of at least one metal or semimetal with a number-average diameter of the primary particles of from 0.5 to 20 nm. The invention further relates to the use of the components B) and C) mentioned, for improving the flowability and/or thermal stability of polyamides, to the use of the molding compositions for the production of fibers, of foils, and of moldings of any type, and also to the resultant fibers, foils, and moldings.