42.
    发明专利
    未知

    公开(公告)号:DE502006000958D1

    公开(公告)日:2008-07-31

    申请号:DE502006000958

    申请日:2006-02-08

    Applicant: BASF SE

    Abstract: Thermoplastic molding compositions comprising A) from 10 to 99% by weight of at least one thermoplastic polyamide, B) from 0.1 to 5% by weight of at least one polyethyleneimine homo- or copolymer, C) from 0.05 to 3% by weight of a lubricant, D) from 0.05 to 3% by weight of a copper-containing stabilizer or of a sterically hindered phenol or mixtures thereof, E) from 0 to 60% by weight of further additives, the sum of the percentages by weight of components A) to E) adding up to 100%.

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