POLYMER COMPOSITION, INK COMPOSITION AND METHOD FOR SELECTIVELY METALLIZING INSULATING SUBSTRATE
    46.
    发明公开
    POLYMER COMPOSITION, INK COMPOSITION AND METHOD FOR SELECTIVELY METALLIZING INSULATING SUBSTRATE 审中-公开
    聚合物组合物,油墨组合物和用于选择性地金属化绝缘基材的方法

    公开(公告)号:EP3189097A1

    公开(公告)日:2017-07-12

    申请号:EP15837858.8

    申请日:2015-06-05

    Abstract: A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about −5 to about 5, and a coordinate b value of about −5 to about 5 in a CIELab color space.

    Abstract translation: 提供一种掺杂的氧化锡,其可以在用于选择性地金属化绝缘基板的表面的方法中用作化学镀敷促进剂。 还提供了一种聚合物组合物,其包含掺杂的氧化锡,聚合物成型体,油墨组合物以及用于选择性地金属化绝缘基板表面的方法。 掺杂的氧化锡具有浅色,并且在其预设时不干扰衬底的颜色。 掺杂的氧化锡具有很强的促进化学镀的能力。 使用所公开的掺杂氧化锡作为化学镀促进剂,可以以高镀速形成连续金属层,同时增强金属层和绝缘基板之间的粘合性。

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