公开(公告)号：US20110156061A1

公开(公告)日：2011-06-30

申请号：US12845722

申请日：2010-07-28

Applicant: Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

IPC: H01L33/48

CPC classification number: H01L25/0753 ,  H01L33/54 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.

Abstract translation: 提供发光模块。 发光模块包括基板，设置在基板上的多个LED芯片，荧光胶体和围绕多个LED芯片的封装胶体。 基板包括基板主体和设置在其上的用于承载LED芯片的多个芯片焊盘。 通过芯片焊盘和衬底主体形成多个通孔，以增强LED芯片的散热。 荧光胶体和封装胶体都具有导光结构，以改善颜色稳定性和处理发光模块的光形状的能力。

公开(公告)号：US07828464B2

公开(公告)日：2010-11-09

申请号：US11984447

申请日：2007-11-19

Applicant: Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

Inventor： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

IPC: F21V29/00

CPC classification number: F21V29/83 ,  F21K9/00 ,  F21V29/70 ,  F21V29/71 ,  F21V29/773

Abstract: An LED lamp structure with high-efficiency heat-dissipating function includes a heat-dissipating module, a light-emitting module, a power-transmitting module, and a casing module. The heat-dissipating module has a plurality of heat-dissipating fins, and the heat-dissipating fins are combined together to form a radial shape and a receiving space. The light-emitting module is received in the receiving space of the heat-dissipating module. The power-transmitting module is electrically connected with the light-emitting module. The casing module has a top board body, a bottom board body mated with the top board body, and a joint board body disposed between the top board body and the heat-dissipating fins. Both the top board body and the joint board body have an opening for exposing the light-emitting module. Each heat-dissipating fin has a top side contacted with the joint board body and a bottom side separated from the bottom board body by a predetermined distance.

Abstract translation: 具有高效散热功能的LED灯具结构包括散热模块，发光模块，电力传输模块和壳体模块。 散热模块具有多个散热翅片，并且散热翅片组合在一起形成径向形状和容纳空间。 发光模块被接收在散热模块的接收空间中。 电力传输模块与发光模块电连接。 套管模块具有顶板主体，与顶板主体配合的底板体，以及设置在顶板主体和散热翅片之间的接合板体。 顶板主体和联合板体均具有用于使发光模块曝光的开口。 每个散热翅片具有与接合板体接触的顶面和与底板主体分离预定距离的底侧。

公开(公告)号：US20100166290A1

公开(公告)日：2010-07-01

申请号：US12489878

申请日：2009-06-23

Applicant: Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Chien-Chi Huang ,  Chung-Yi Tsai

Inventor： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Chien-Chi Huang ,  Chung-Yi Tsai

IPC: G06K9/00

CPC classification number: G01N21/9501 ,  G01N21/95607 ,  H01L22/12

Abstract: A die defect inspecting system with a die defect inspecting function includes a wafer-positioning module, an image-capturing module, a die-sucking module, a die defect analyzing module, a die-classifying module and a control module. The image-capturing module is disposed beside one side of the wafer-positioning module in order to capture an image of each die. The die-sucking module is disposed above the wafer-positioning module and the image-capturing module in order to suck each die from the wafer-positioning module to a position above the image-capturing module for capturing a back image of a back surface of each die. The die defect analyzing module is electrically connected to the image-capturing module in order to judge whether the back image of the back surface of each die passes inspection standard.

Abstract translation: 具有模具缺陷检查功能的模具缺陷检查系统包括晶片定位模块，图像捕获模块，模具吸收模块，模具缺陷分析模块，模具分类模块和控制模块。 图像捕获模块设置在晶片定位模块的一侧旁边，以便捕获每个模具的图像。 模具吸附模块设置在晶片定位模块和图像捕获模块上方，以便将每个模具从晶片定位模块吸入到图像捕获模块上方的位置，用于捕获背景图像 每个死亡。 模具缺陷分析模块电连接到图像捕获模块，以便判断每个模具的背面的背面图像是否经过检查标准。

公开(公告)号：US07741648B2

公开(公告)日：2010-06-22

申请号：US11976340

申请日：2007-10-24

Applicant: Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

Inventor： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC: H01L29/18

CPC classification number: H01L33/483 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  H01L2924/00014

Abstract: An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.

Abstract translation: LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，许多LED芯片和封装胶体。 陶瓷基板具有主体，从主体延伸的许多突起，分别穿过突起的许多穿透孔和形成在主体的侧面上并分别形成在每个两个突起之间的许多半通孔。 导电单元具有分别形成在突起上的许多第一导电层，分别形成在半通孔的内表面上的许多第二导电层和主体的底面，以及分别填充在穿透孔中的许多第三导电层。 中空陶瓷壳体固定在主体上以形成容纳空间。 LED芯片被接收在接收空间中。 包装胶体填充在用于覆盖LED芯片的接收空间中。

公开(公告)号：US07662661B2

公开(公告)日：2010-02-16

申请号：US11304558

申请日：2005-12-16

Applicant: Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

Inventor： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC: H01L21/66 ,  G01R31/26 ,  H01L21/00 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC classification number: H05K3/0052 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/09881 ,  H05K2203/0228 ,  H05K2203/0278 ,  H05K2203/1536

Abstract: A method of manufacturing a substrate structure includes the steps of: (1) providing a metal substrate having a metal portion; (2) chemically etching a plurality of trenches in the metal substrate; (3) applying a polymer composite material into the trenches to form a substrate having a polymer composite portion abutted to the metal portion; (4) polishing a surface of the substrate to make a height of the polymer composite portion equal to that of the metal portion; (5) forming a covering material on the surface of the substrate; and (6) cutting the substrate via the polymer composite portion for decreasing cutting bur produced on the metal portion. Furthermore, the method is provided for combining the metal substrate and the polymer composite material, thereby to increase cutting precision and strength of the substrate structure.

Abstract translation: 一种制造衬底结构的方法包括以下步骤：（1）提供具有金属部分的金属衬底; （2）化学蚀刻金属基板中的多个沟槽; （3）将聚合物复合材料施加到沟槽中以形成具有与金属部分邻接的聚合物复合部分的基底; （4）研磨基板的表面，使聚合物复合部的高度与金属部的高度相等; （5）在基板的表面上形成覆盖材料; 和（6）通过聚合物复合部分切割基底以减少在金属部分上产生的切割毛刺。 此外，提供了用于组合金属基板和聚合物复合材料的方法，从而提高基板结构的切割精度和强度。

公开(公告)号：US20100006880A1

公开(公告)日：2010-01-14

申请号：US12457222

申请日：2009-06-04

Applicant: Bily Wang ,  Shih-Yu Wu ,  Chao-Yuan Huang ,  Ping-Chou Yang ,  Cheng-Yen Chiang

Inventor： Bily Wang ,  Shih-Yu Wu ,  Chao-Yuan Huang ,  Ping-Chou Yang ,  Cheng-Yen Chiang

IPC: H01L33/00 ,  H01L21/56

CPC classification number: H01L33/52 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.

Abstract translation: 使用沉淀的LED芯片封装结构包括封装体，至少两个导电基板，至少一个发光元件和封装单元。 包装体具有接收空间。 两个导电基板被接收在接收空间中。 发光元件被容纳在接收空间中并与两个导电基板电连接。 包装单元具有包装胶体层和混合到包装胶体层中的粉末，并且包装单元填充到容纳空间中。 首先将包装单元保持在室温下，将粉末均匀地沉积在接收空间中，并通过加热到预定温度使粉末在接收空间中固化。

公开(公告)号：US20090251815A1

公开(公告)日：2009-10-08

申请号：US12285184

申请日：2008-09-30

Applicant: Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Ming-Hao Chou

Inventor： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Ming-Hao Chou

IPC: G11B27/36

CPC classification number: G01N21/95 ,  G01N21/8806

Abstract: A testing system for inspecting electronic devices includes a first transparent disk, a first image capturing unit disposed under the first transparent disk, a second disk disposed next to the first transparent disk, a guiding unit disposed on adjacent area between the transparent disk and the second disk, and a plurality of second image capturing units disposed around the second disk. A plurality of electronic devices is continuingly supplied onto the first transparent disk and the first image capturing unit is used for capturing the images of the bottom surfaces of the electronic devices. Then, the electronic devices are guided to the second disk via the guiding unit and the second image capturing units are used for capturing the images of other surfaces of the electronic devices. A testing method for electronic devices is further disclosed.

Abstract translation: 用于检查电子设备的测试系统包括第一透明盘，设置在第一透明盘下方的第一图像捕获单元，邻近第一透明盘设置的第二盘，设置在透明盘和第二透明盘之间的相邻区域上的引导单元 盘，以及设置在第二盘周围的多个第二图像捕获单元。 多个电子设备被连续地提供到第一透明盘上，并且第一图像捕获单元用于捕获电子设备的底面的图像。 然后，电子设备经由引导单元被引导到第二盘，并且第二图像捕获单元用于捕获电子设备的其他表面的图像。 进一步公开了一种电子设备的测试方法。

公开(公告)号：US20090206759A1

公开(公告)日：2009-08-20

申请号：US12232928

申请日：2008-09-26

Applicant: Bily Wang ,  Min-Chih Hsuan

Inventor： Bily Wang ,  Min-Chih Hsuan

IPC: H05B39/04 ,  G01J1/20

CPC classification number: H05B37/0227 ,  F21S9/03 ,  F21W2131/109 ,  F21Y2115/10 ,  H05B37/0218 ,  Y02B20/40 ,  Y02B20/46 ,  Y02B20/72

Abstract: A controlling system for illumination of a golf course and a controlling method thereof are provided. The illumination controlling system is used for a golf course that has multiple holes. The illumination controlling system has multiple groups of lighting modules respectively corresponding to the multiple holes. Each group of lighting module comprises a plurality of light-emitting devices, a plurality of power devices having control circuit units and chargeable batteries, a plurality of solar panels, and a plurality of motion sensors. Each chargeable battery provides a first working voltage for each light-emitting device. Each control circuit unit connects electrically to utility power to supplies a second working voltage for each light-emitting device. Each motion sensor connects electrically with the control circuit unit of each power device for switching each light-emitting device. The controlling system and method are provided for saving energy of golf course.

Abstract translation: 提供了一种用于照明高尔夫球场的控制系统及其控制方法。 照明控制系统用于具有多个孔的高尔夫球场。 照明控制系统具有分别对应于多个孔的多组照明模块。 每组照明模块包括多个发光装置，具有控制电路单元和可充电电池的多个功率装置，多个太阳能电池板和多个运动传感器。 每个可充电电池为每个发光器件提供第一工作电压。 每个控制电路单元电连接到市电以为每个发光装置提供第二工作电压。 每个运动传感器与每个功率器件的控制电路单元电连接，用于切换每个发光器件。 提供控制系统和方法来节省高尔夫球场的能量。

公开(公告)号：US20090152574A1

公开(公告)日：2009-06-18

申请号：US12379258

申请日：2009-02-18

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin

IPC: H01L33/00

CPC classification number: C09K11/7787 ,  C09K11/7789 ,  C09K11/7794 ,  F21K9/00 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  Y02B20/181 ,  H01L2924/00014

Abstract: A multi-wavelength white light-emitting structure uses a UV light emitting diode chip and a blue light emitting diode chip to excite a red phosphor and a green phosphor and generates a white light-emitting structure having good color rendering. The multi-wavelength white light-emitting structure uses a UV light emitting diode chip that emits light having a wavelength of between 350˜430 nm to excite a red phosphor to emit red light having a wavelength of between 600˜700 nm. The present invention then uses a blue light emitting diode chip that emits light having a wavelength between of 400˜500 nm to emit blue light and uses the blue light emitting diode chip to excite a green phosphor to emit green light having a wavelength of between 490˜560 nm. Mixing the red light, the blue light and the green light forms a white light.

Abstract translation: 多波长白色发光结构使用UV发光二极管芯片和蓝色发光二极管芯片来激发红色荧光体和绿色荧光体，并产生具有良好显色性能的白色发光结构。 多波长白色发光结构使用发射波长在350〜430nm之间的光的UV发光二极管芯片，以激发红色荧光体发射波长在600〜700nm之间的红色光。 然后，本发明使用发射波长在400〜500nm之间的光的蓝色发光二极管芯片发射蓝色光并使用蓝色发光二极管芯片来激发绿色荧光体，发出波长在490nm之间的绿色光 〜560nm。 混合红光，蓝光和绿光形成白光。

公开(公告)号：US20090020770A1

公开(公告)日：2009-01-22

申请号：US11779556

申请日：2007-07-18

Applicant: Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

IPC: H01L33/00 ,  H01L21/00

CPC classification number: B29C45/14655 ,  B29C33/0022 ,  F21K9/00 ,  F21K9/20 ,  F21Y2103/10 ,  F21Y2115/10 ,  G09F9/33 ,  G09F13/22 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips.

Abstract translation: 具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。 基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。 发光单元具有布置在基板主体上的多个LED芯片，并且每个LED芯片分别具有正极侧和负极侧，并与基板单元的正极迹线和负极迹线电连接。 封装胶体单元具有分别覆盖在LED芯片上的多个封装胶体。