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公开(公告)号：JPH07176380A
公开(公告)日：1995-07-14
申请号：JP34471093
申请日：1993-12-21
Applicant: CASIO COMPUTER CO LTD
Inventor： KAWAMURA YOSHIHIRO
IPC: H05B33/04
Abstract: PURPOSE:To enhance the longevity and reliability of an electroluminescent element by preventing moisture from entering a phosphor layer. CONSTITUTION:In an electroluminescent element having a transparent electrode 5, a back electrode 2 and a phosphor layer 4 disposed between both electrodes, with both electrodes 2, 5 and the overall phosphor layer 4 covered and sealed with films 6, 7 impervious to water, water-absorptive particles 10 are dispersed in the phosphor layer 4. Moisture entering from outside the phosphor layer 4 is therefore absorbed by the water-absorptive particles 10 and retained.
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公开(公告)号：JPH05152376A
公开(公告)日：1993-06-18
申请号：JP33801391
申请日：1991-11-28
Applicant: CASIO COMPUTER CO LTD
Inventor： KAWAMURA YOSHIHIRO
IPC: H01L21/60 , H01L21/321 , H05K3/28
Abstract: PURPOSE:To enable a semiconductor device provided with smaller electrodes to be mounted on a film carrier provided with an insulating layer formed through screen printing by a method wherein a film carrier where an insulating layer is formed in such a way that a photoresist layer is formed in an opening forming region is used. CONSTITUTION:A photoresist layer is provided surrounding an insulating layer opening 14 in an opening forming region on the upside of a conductive layer 13 patterned on the upside of a film board 12, and an insulating layer 15 is formed on a region other than the opening forming region. Thereafter, the photoresist layer is peeled off, and an opening 14 is provided to the insulating layer 15 corresponding to the opening forming region. A film carrier 11 and a semiconductor device 1 possessed of a solder bump 7 located on an electrode 3 are provided. The solder bump 7 of the semiconductor device 1 is connected with the conductive layer 13 at the opening 14 of the film carrier 11.
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公开(公告)号：JPH04343289A
公开(公告)日：1992-11-30
申请号：JP14275891
申请日：1991-05-20
Applicant: CASIO COMPUTER CO LTD
Inventor： KAWAMURA YOSHIHIRO
IPC: H05K3/00
Abstract: PURPOSE:To enable a circuit pattern to be continuously formed by a method wherein conductive thin film plated films cut only for the formation of through- holes are handled as a conductive thin film plated film of continuous length. CONSTITUTION:Conductive thin film plated films 3 where through-holes 9 are provided and which are cut into prescribed shapes are arranged at a certain interval, films 11 and 12 which are of continuous length and have openings 21 provided corresponding to the films 3 are made to cover both the sides of the films 3, the conductive film plated films 3 kept in continuous length are fed to a circuit pattern process, a circuit pattern is continuously formed on both the sides of the films 3, the films 3 are blanked into prescribed shapes for the formation of double-sided flexible printed wiring boards.
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公开(公告)号：JPH04184994A
公开(公告)日：1992-07-01
申请号：JP31525190
申请日：1990-11-20
Applicant: CASIO COMPUTER CO LTD
Inventor： KAWAMURA YOSHIHIRO
Abstract: PURPOSE:To continuously form wiring patterns by coating both surfaces of a plurality of a thin film-coated film with conductive thin films and through holes on both surfaces with long sheets for forming patterns with a photoresist film and subjecting the film to exposure, development, etching, etc. CONSTITUTION:A sheet 10 for forming patterns provided with an adhesive surface 12 and photoresist film 9 on the surface is stuck to both surfaces of a plurality of thin film-coated films 1 which are provided with through holes 6 and conductive films on both surfaces and have prescribed shapes together with an exposed surface protective film 8, with the films 1 being put upon another while the holes 6 being aligned with each other. The films 1 are connected to each other to a long length and the sheet 10 is continuously subjected to exposure, development, and etching. Therefore, wiring patterns are not formed on the films 1 one by one, but successively and continuously formed.
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公开(公告)号：JPH03131085A
公开(公告)日：1991-06-04
申请号：JP26827489
申请日：1989-10-17
Applicant: CASIO COMPUTER CO LTD
Inventor： KAWAMURA YOSHIHIRO
Abstract: PURPOSE:To form a metallic film surely and easily also on the inner face of a through hole by forming a metallic film on an insulating board by deposition or sputtering. CONSTITUTION:Through holes 2 are made at the places, where the wiring pattern formation areas at the top and the wiring pattern formation areas at the bottom correspond to each other, of an insulating board 1. The entire surface of the insulating board 1 is coated, by deposition or sputtering, with metal such as, for example, copper, aluminum, etc., so as to form a metallic film 3. A plating layer 5 is made by electrolytic plating on the entire surface of the metallic film 3, where a resist layer 4 is not formed, in a word, the wiring pattern formation area which includes the inner face of the through hole 2. In this case, plating is also applied on the sideface of the insulating board 1. After removing the resist layer 4 by etching, the metallic film 3 is etched, with the plating layer 5 as a mask, to remove unnecessary part, in a word, the metallic film 3 other than the wiring pattern formation area. And, the insulating board is cut along a cutting line which connects the center of the through hole 2.
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Patent Agency Ranking
公开(公告)号：JPH03124458A
公开(公告)日：1991-05-28
申请号：JP26324989
申请日：1989-10-09
Applicant: CASIO COMPUTER CO LTD
Inventor： KAWAMURA YOSHIHIRO
Abstract: PURPOSE:To form a metallic lead on a film substrate with a sufficient bonding strength to realize a fine pitch by a method wherein metallic layers are plated on the top and rear surfaces of the heat-resistant film substrate having needle holes passing through vertically at predetermined positions, the metallic layers are patterned into a predetermined form, and the top and rear surface of the film substrate are electrically connected with each other at the position of the needle holes. CONSTITUTION:A film substrate 1 made of a heat resistant resin having flexibility, such as polyimide, is formed into a thin and long rectangle. On the right hand side of the film substrate 1, a plurality of needle holes 9 pass through vertically. A metallic lead 2 is formed by laminating a metallic thin film layer 10, a copper plated layer 11, a nickel plated layer 12, and a gold plated layer 13. The metallic leads 2 are directly provided on the top and rear surface of the film substrate 1 and inside the needle holes 9. The metallic lead 2 on the top surface of the film substrate 1 serves as a wiring lead 14, the metallic lead 2 on the rear surface serves as a connection lead 15 connected to an external circuit. These upper and lower leads 14, 15 are connected to each other through the lead of the needle holes 9.
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公开(公告)号：JPH02192793A
公开(公告)日：1990-07-30
申请号：JP1136889
申请日：1989-01-20
Applicant: CASIO COMPUTER CO LTD
Inventor： YARITA YOSHIO , KAWAMURA YOSHIHIRO
Abstract: PURPOSE:To improve reliability by providing a metallic thin film and a coat layer on the inner wall of a pin hole by specific processes and forming wiring patterns on the top and rear faces of an insulative film such that they are connected with each other at the place of the pin hole. CONSTITUTION:A metallic thin film 4 is formed by vapor deposition or sputtering on the top and rear faces of an insulative film 1 in which a pin hole 3 has been formed. The thin film 4 serves as an underlying coat layer on the surface of which a desirable coat layer 6 can be obtained easily. Then, the metallic thin film on the top and rear faces of the insulative film 1 is removed except its parts corresponding to the regions where wiring patterns are to be formed. Since the inner wall of the pin hole 3 is covered with the metallic thin film 4 and the coat layer 7, wiring patterns 7 on the top and rear faces can be connected with each other at a low resistance. According to this method, the pointed tip end of a pin 2 can pierce the film to form the pin hole 3 without being crushed and, therefore, any trouble due to chips or the like can be prevented.
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公开(公告)号：JPH02192791A
公开(公告)日：1990-07-30
申请号：JP1136789
申请日：1989-01-20
Applicant: CASIO COMPUTER CO LTD
Inventor： YARITA YOSHIO , KAWAMURA YOSHIHIRO
Abstract: PURPOSE:To improve reliability while improving manufacturing efficiency by providing a metallic thin film and a coat layer on the inner wall of a pin hole by specific processes, and forming wiring patterns on the top and rear faces of an insulative film such that the wiring patterns are connected with each other at the place of the pin hole. CONSTITUTION:A metallic thin film 5 is formed by vapor deposition or sputtering on the top and rear faces of an insulative film 1 in which a pin hole 3 has been formed. The thin film 5 serves as an underlying coat on the surface of which a desirable coat layer 6 can be obtained easily. Since the inner wall of the pin hole 3 is coated with the metallic thin film 5 and the coat layer 6, wiring patterns 7 on the top and rear faces can be connected electrically with a low resistance. In this manner, a structure capable of connecting the wiring patterns on the top and rear faces reliably and having high reliability in conduction can be obtained. Finally, an insulating layer 4 is peeled off and parts of the thin film 5 outside the wiring pattern forming regions are removed.
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公开(公告)号：JPH02192789A
公开(公告)日：1990-07-30
申请号：JP1136689
申请日：1989-01-20
Applicant: CASIO COMPUTER CO LTD
Inventor： YARITA YOSHIO , KAWAMURA YOSHIHIRO
Abstract: PURPOSE:To improve reliability in resistance to weather and current capacity by providing a metallic thin film and a coat layer on the inner walls of a pin hole by specific processes and forming resist patterns on the surface of the coat layer so as to connect wiring patterns at a low resistance. CONSTITUTION:A metallic thin film 4 is formed by vapor deposition or sputtering on the top and rear faces of an insulative film 1 having a pin hole 3. The thin film 4 serves as an underlying coat on the surface of which a desirable coat layer 5 can be obtained easily. Resist patterns 6 are formed in the place of the pin hole 3 in the coat layer 5 by a screen printing or photo patterning process. The thin film 4 on the top and rear faces of the film 2 and the coat layer 5 masked with the resist patterns are etched so that wiring patterns 7 are formed in the place of the pin hole 3. The wiring patterns 7 thus connected with each other through the thin film 4 and the coat layer 5 have a low value of electric resistance and is allowed to have improved reliability in resistance to weather and current capacity.
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公开(公告)号：JP2001246753A
公开(公告)日：2001-09-11
申请号：JP2000057535
申请日：2000-03-02
Applicant: CASIO COMPUTER CO LTD
Inventor： KAWAMURA YOSHIHIRO
IPC: B41J2/135
Abstract: PROBLEM TO BE SOLVED: To provide an ink-jet printer head in which an ink repellency of a surface of an orifice plate can be easily changed and a manufacturing method thereof. SOLUTION: First a metallic film 29 coated to the surface of the orifice plate 18 after having discharge nozzles 22 formed thereto is treated by anodic oxidation. Pin holes 38 of a desired density are formed on an oxidized film 37 by controlling an oxidation process conduction time in this anodic oxidation process. Then, the surface of the metallic film 29 is subjected to electrodeposition coating with ink repellent resin. The ink repellent resin 39 is not electrodeposited to oxidized coating parts 37' because of insulating properties, while the ink repellent resin 39 is electrodeposited in the pin holes 38 because the pin holes are kept conductive. A ink repellent film with desired ink repellent characteristics can thus be formed on the surface of the orifice plate 18.
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