公开(公告)号：WO1997027624A1

公开(公告)日：1997-07-31

申请号：PCT/US1996020824

申请日：1996-12-30

Applicant: CORNELL RESEARCH FOUNDATION, INC.

Inventor： CORNELL RESEARCH FOUNDATION, INC. ,  WANG, Kuo, K. ,  HAN, Sejin

IPC: H01L21/56

CPC classification number: H01L24/75 ,  B29C33/0022 ,  B29C33/0044 ,  B29C33/06 ,  B29C33/10 ,  B29C33/14 ,  B29C33/405 ,  B29C45/14467 ,  B29C45/14639 ,  H01L21/563 ,  H01L24/28 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A new method and device to encapsulate integrated circuits such as flip chips and BGA packages. A special mold (31) to surround the chip (32) to be encapsulated in a cavity (43), and the encapsulant (41) is injected into the cavity at an elevated pressure, and possibly at an elevated temperature. This shortens the cavity filling time by two or three orders of magnitude, compared to the conventional dispensing process. The reliability of the package is increased by increasing the adhesion of encapsulant to the package, by controlling fillet shape (51) through in-mold curing, and by completely filling the cavity through proper mold design and, optionally, evacuation of the cavity prior to injection. The invention also allows the use of a wider range of encapsulants, including highly viscous material, fast curing materials and reworkable materials.

Abstract translation: 封装集成电路（如倒装芯片和BGA封装）的新方法和器件。 围绕要封装在空腔（43）中的芯片（32）的特殊模具（31），并且密封剂（41）以升高的压力并且可能在升高的温度被注入到空腔中。 与传统的分配过程相比，这将空腔充填时间缩短了两个或三个数量级。 通过通过模内固化控制圆角形状（51）并通过适当的模具设计完全填充空腔，并且可选地在空腔之前抽真空以增加密封剂对包装的粘合性，从而增加包装的可靠性 注射。 本发明还允许使用更宽范围的密封剂，包括高粘度材料，快速固化材料和可再加工材料。

公开(公告)号：WO1997021800A2

公开(公告)日：1997-06-19

申请号：PCT/US1996019018

申请日：1996-11-26

Applicant: THOMAS JEFFERSON UNIVERSITY ,  CORNELL RESEARCH FOUNDATION, INC.

Inventor： THOMAS JEFFERSON UNIVERSITY ,  CORNELL RESEARCH FOUNDATION, INC. ,  KMIEC, Eric, B. ,  HOLLOMAN, William, K. ,  GERHOLD, David

IPC: C12N00/00

CPC classification number: C12Q1/6827 ,  C07K14/47

Abstract: Disclosed are the Hmp class of polypeptides, DNA sequences encoding those polypeptides, and uses thereof, particularly in methods and kits for mismatch (for example, mutation) detection.

Abstract translation: 公开了多肽的Hmp类，编码那些多肽的DNA序列及其用途，特别是用于错配（例如突变）检测的方法和试剂盒。

公开(公告)号：WO1997013843A1

公开(公告)日：1997-04-17

申请号：PCT/US1996016181

申请日：1996-10-09

Applicant: CORNELL RESEARCH FOUNDATION, INC. ,  WASHINGTON UNIVERSITY

Inventor： CORNELL RESEARCH FOUNDATION, INC. ,  WASHINGTON UNIVERSITY ,  WU, Ray, J. ,  HO, Tuan-Hua, D.

IPC: C12N05/00

CPC classification number: C07K14/415 ,  C12N15/8273

Abstract: The present invention is directed to a method of producing a cereal plant cell or protoplast useful for regeneration of a water stress or salt stress tolerant cereal plant by transforming the cereal plant cell or protoplast with a nucleic acid encoding a late embryogenesis abundant protein. A transgenic cereal plant or cereal plant cell or protoplast transformed with a nucleic acid encoding a late embryogenesis abundant protein is also provided. An LEA protein gene, HVA1, from barley (Hordeum vulgare L.) was transformed into rice (Oryza sativa L.) plants. The resulting transgenic rice plants accumulate the HVA1 protein in both leaves and roots. Transgenic rice plants showed significantly increased tolerance to water stress (drought) and salt stress.

Abstract translation: 本发明涉及通过用编码晚期胚胎发生丰富蛋白质的核酸转化谷物植物细胞或原生质体来生产可用于再生水分胁迫或耐盐胁迫谷物植物的谷物植物细胞或原生质体的方法。 还提供了用编码晚期胚胎发生丰富蛋白质的核酸转化的转基因谷物植物或谷物植物细胞或原生质体。 将来自大麦（Hordeum vulgare L.）的LEA蛋白基因HVA1转化到水稻（Oryza sativa L.）植物中。 所得转基因水稻在叶和根中积累HVA1蛋白。 转基因水稻对水胁迫（干旱）和盐胁迫的耐受性显着增加。

公开(公告)号：WO1997002393A1

公开(公告)日：1997-01-23

申请号：PCT/US1996007998

申请日：1996-05-30

Applicant: CORNELL RESEARCH FOUNDATION, INC.

Inventor： CORNELL RESEARCH FOUNDATION, INC. ,  PETRINA, Petru

IPC: E04C05/08

CPC classification number: E04C5/085 ,  E04C5/07 ,  E04C5/125 ,  E04C5/127 ,  Y10S52/07 ,  Y10S52/08

Abstract: The invention presents a non-metallic laminated composite reinforcing rod for use in reinforced or prestressed concrete. The rod is made by creating a sheet of core material (1) comprising a number of layers of "pre-preg" material. Ribs (2) are formed on top of the core from additional layers of pre-preg material laid with the fibers transverse to those in the core. The ribs (2) are then covered by additional layers of pre-preg (3) laid with fibers parallel to the core fibers. The material is heated to fuse the layers. Finally, the sheets of laminated reinforcement are cut parallel to the core fibers to the width desired. The resulting reinforcing rod (62) is superior to steel in corrosion resistance, flexibility, durability, and strength. The reinforcing rod (62) may be used as a prestressing tendon in prestressed concrete after encasing the ends of the rod in an attachment formed of a sleeve (60) filled with grouting material (63) such as mortar or epoxy. The glass-fiber embodiment is non-conductive. If carbon pre-preg made of high modulus fibers is used, then the Young modulus of the LCRs is approximately equal to that of steel.

Abstract translation: 本发明提出了一种用于增强或预应力混凝土的非金属层压复合增强棒。 杆通过产生包括多层“预浸”材料的芯材料片（1）制成。 从芯的顶部形成肋（2），其中附加的预浸材料层铺设有与纤芯横向的纤维。 肋（2）然后被铺设有平行于纤芯纤维的纤维的另外的预浸料（3）层覆盖。 材料被加热以熔化层。 最后，层叠钢筋片平行于芯纤维切割成所需的宽度。 所得到的加强杆（62）的耐腐蚀性，柔韧性，耐久性和强度优于钢。 加固杆（62）可以用作预应力混凝土中的预应力钢筋，将其末端包围在填充有诸如砂浆或环氧树脂的注浆材料（63）的套筒（60）之后。 玻璃纤维实施例是不导电的。 如果使用由高模量纤维制成的碳预浸料，则LCR的杨氏模量大致等于钢的杨氏模量。

公开(公告)号：WO1996041402A1

公开(公告)日：1996-12-19

申请号：PCT/US1996007539

申请日：1996-05-29

Applicant: CORNELL RESEARCH FOUNDATION, INC.

Inventor： CORNELL RESEARCH FOUNDATION, INC. ,  LO, Yu-Hwa

IPC: H01S03/085

CPC classification number: H01S5/187

Abstract: Grating-coupled surface emitting laser structures (10) utilize strain-compensated multiple quantum wells (18) as the laser gain with a very high grating coupling efficiency to reduce output beam spot size and overall device size. The lasers are designed with grating coupling coefficients that are much higher ( > 150/cm) than those employed in conventional grating-coupled lasers to increase the laser energy coupled vertically through the top surface of the laser. This permits a reduced output beam size that is easily matched to an optical fiber. The use of the high coupling coefficient is made possible because the increased optical gain of the strain-compensated multiple quantum well (18) offsets the increased losses that are induced in the horizontal laser cavity (15) by increased grating coupling efficiency.

Abstract translation: 光栅耦合表面发射激光器结构（10）利用应变补偿多量子阱（18）作为具有非常高的光栅耦合效率的激光增益，以减少输出光束尺寸和整体器件尺寸。 激光器被设计为具有比常规光栅耦合激光器中使用的光栅耦合系数高得多（> 150 / cm）的光栅耦合系数，以增加通过激光器顶表面垂直耦合的激光能量。 这允许与光纤容易匹配的减小的输出光束尺寸。 使得高耦合系数成为可能，因为应变补偿多量子阱（18）的增加的光学增益通过增加的光栅耦合效率来抵消在水平激光腔（15）中引起的增加的损耗。

公开(公告)号：WO1996022021A1

公开(公告)日：1996-07-25

申请号：PCT/US1996000599

申请日：1996-01-17

Applicant: CORNELL RESEARCH FOUNDATION, INC.

Inventor： CORNELL RESEARCH FOUNDATION, INC. ,  HANAUSKE-ABEL, Hartmut, M. ,  McCAFFREY, Timothy, A. ,  GRADY, Robert, W.

IPC: A01N43/40

CPC classification number: A61K31/00 ,  A61K31/4412 ,  A61K31/4422 ,  C07K5/02 ,  C07K5/0215

Abstract: A method for the treatment of fibroproliferative disorders is disclosed in which an effective dose of hydroxypyridone compounds is applied topically or systemically.

Abstract translation: 公开了一种治疗纤维增生性疾病的方法，其中有效剂量的羟吡啶酮化合物被局部或全身施用。

公开(公告)号：WO1996021033A2

公开(公告)日：1996-07-11

申请号：PCT/US1995007185

申请日：1995-06-07

Applicant: ASGROW SEED COMPANY ,  CORNELL RESEARCH FOUNDATION, INC. ,  McMASTER, J., Russell ,  BOESHORE, Maury, L. ,  TRICOLI, David, M. ,  REYNOLDS, John, F. ,  CARNEY, Kim, J. ,  SLIGHTON, Jerry, L. ,  GONSALVES, Dennis

Inventor： ASGROW SEED COMPANY ,  CORNELL RESEARCH FOUNDATION, INC.

IPC: C12N15/82

CPC classification number: C12N15/8283 ,  C12N9/506

Abstract: NIa protease genes of papaya ringspot virus strains FLA83 W and USA P-type (HA attenuated) strain are provided.

Abstract translation: 提供番木瓜环斑病毒株FLA83W和美国P型（HA减毒）菌株的NIa蛋白酶基因。

公开(公告)号：WO1996013604A1

公开(公告)日：1996-05-09

申请号：PCT/US1995013909

申请日：1995-10-27

Applicant: CORNELL RESEARCH FOUNDATION, INC.

Inventor： CORNELL RESEARCH FOUNDATION, INC. ,  HO, John, L.

IPC: C12Q01/00

CPC classification number: C12Q1/703 ,  G01N33/56988

Abstract: An in vitro method for the detection of human immunodeficiency virus (HIV) in patient samples employing oxidative agents capable of augmenting viral expression is disclosed. Patient cells are prepared and an oxidative agent is added to the culture medium to induce HIV expression. The levels of intracellular and extracellular p24 are measured using conventional immunological assays. The number of HIV-infected patient cells can be quantitatively determined using the appropriate standards and controls.

Abstract translation: 公开了一种在使用能够增强病毒表达的氧化剂的患者样品中检测人类免疫缺陷病毒（HIV）的体外方法。 制备患者细胞，并向培养基中加入氧化剂以诱导HIV表达。 使用常规免疫测定法测量细胞内和细胞外p24的水平。 HIV感染患者细胞的数量可以使用适当的标准和对照进行定量测定。

公开(公告)号：WO1996007196A1

公开(公告)日：1996-03-07

申请号：PCT/US1995010874

申请日：1995-08-28

Applicant: CORNELL RESEARCH FOUNDATION, INC.

Inventor： CORNELL RESEARCH FOUNDATION, INC. ,  LI, Che-Yu

IPC: H01J63/04

CPC classification number: H01J9/185 ,  G09F9/33 ,  H01J29/028 ,  H01J29/92 ,  H01J31/125 ,  H01J2201/304 ,  H01J2329/863 ,  H01L27/3293 ,  Y10T29/49002 ,  Y10T156/1092

Abstract: A panel display (10) includes a common substrate (56) on which a plurality of small display tiles (12, 13, 14, 15) are mounted in an array and electrically interconnected to replicate a large area panel. Each tile includes a plurality of contact pads (44, 46, 52) which are aligned with corresponding contact pads (72, 74, 78) on the substrate. Solder joints (60, 62, 68) between corresponding contact pads mechanically align and secure the tiles on the substrate, and provide electrical connections therebetween. Selected substrate pads (80, 81) are interconnected to provide electrical connections between adjacent tiles (14, 15).

Abstract translation: 面板显示器（10）包括公共基板（56），多个小显示瓦片（12,13,14,15）以阵列的形式安装在其上并电互连以复制大面积面板。 每个瓦片包括与衬底上的对应的接触焊盘（72,74,78）对准的多个接触焊盘（44,46,52）。 在相应的接触垫之间的焊接接头（60,62,68）将瓦片机械地对准并固定在基板上，并在其间提供电连接。 所选择的基板焊盘（80,81）互连以提供相邻瓦片（14,15）之间的电连接。

公开(公告)号：WO1995031021A1

公开(公告)日：1995-11-16

申请号：PCT/US1995005218

申请日：1995-05-04

Applicant: CORNELL RESEARCH FOUNDATION, INC.

Inventor： CORNELL RESEARCH FOUNDATION, INC. ,  LO, Yu-Hwa

IPC: H01S03/06

CPC classification number: B82Y20/00 ,  H01S5/18341 ,  H01S5/18369 ,  H01S5/18375 ,  H01S5/18394 ,  H01S5/187 ,  H01S5/3054 ,  H01S5/3406 ,  H01S5/34306 ,  H01S5/34313 ,  H01S5/3434 ,  H01S5/4087 ,  H01S5/423

Abstract: Semiconductor lasers (10) utilize strain-compensated multiple quantum wells (20) to increase gain in long wavelength (1.3 and 1.5 microns) devices. The strain-compensated quantum well structures (18) contain a plurality of strained well (20) and barrier (22) layers, where the barrier layers (22) are placed under a strain equal and opposite to that of the well layers (20). As a result, the normal thickness restriction on strained layers is lifted. In addition, the well layers are p-doped to further increase optical gain. Another embodiment uses strain-compensated multiple quantum wells in a grating-coupled laser (100 and 120). Because of the increased gain of the strain-compensated quantum well structure, the grating can made on the surface of the laser with a strong light coupling characteristic, allowing simpler fabrication and shorter length of the laser.

Abstract translation: 半导体激光器（10）利用应变补偿多量子阱（20）来增加长波长（1.3和1.5微米）器件的增益。 应变补偿量子阱结构（18）包含多个应变阱（20）和势垒层（22），其中阻挡层（22）被放置在与阱层（20）相同和相反的应变下， 。 结果，对应变层的正常厚度限制被提升。 此外，阱层被p掺杂以进一步增加光学增益。 另一实施例在光栅耦合激光器（100和120）中使用应变补偿多量子阱。 由于应变补偿量子阱结构的增益增加，光栅可以在激光的表面上具有强的光耦合特性，允许更简单的制造和更短的激光长度。