公开(公告)号：US20230167018A1

公开(公告)日：2023-06-01

申请号：US18101668

申请日：2023-01-26

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Guangli Hu ,  William Joseph Hurley ,  Dana Ianson ,  Lin Lin ,  Santona Pal ,  James Joseph Price

IPC: C03C17/245 ,  C03C3/091 ,  C03C3/097 ,  C03C17/22

CPC classification number: C03C17/245 ,  C03C3/091 ,  C03C3/097 ,  C03C17/225 ,  C03C2217/281 ,  C03C2217/29 ,  C03C2217/78 ,  C03C2217/91 ,  C03C2218/155

Abstract: An article is described herein that includes: a substrate having a glass, glass-ceramic or a ceramic composition and comprising a primary surface; and a protective film disposed on the primary surface. The protective film comprises a thickness of greater than 1.5 microns and a maximum hardness of greater than 15 GPa at a depth of 500 nanometers, as measured on the film disposed on the substrate. Further, the protective film comprises a metal oxynitride that is graded such that an oxygen concentration in the film varies by 1.3 or more atomic %. In addition, the substrate comprises an elastic modulus less than an elastic modulus of the film.

公开(公告)号：US11608290B2

公开(公告)日：2023-03-21

申请号：US16355797

申请日：2019-03-17

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Dana Craig Bookbinder ,  Theresa Chang ,  Paul Stephen Danielson ,  Steven Edward DeMartino ,  Melinda Ann Drake ,  Andrei Gennadyevich Fadeev ,  James Patrick Hamilton ,  Robert Michael Morena ,  Santona Pal ,  John Stephen Peanasky ,  Chandan Kumar Saha ,  Robert Anthony Schaut ,  Susan Lee Schiefelbein ,  Christopher Lee Timmons

IPC: B65D23/08 ,  B65D1/40 ,  A61J1/14 ,  C03C3/087 ,  B65D25/14 ,  B32B17/06 ,  C03C17/34 ,  C03C17/00 ,  C03C17/32 ,  C03C17/30 ,  C08G73/10 ,  C09D179/08 ,  C03C21/00 ,  C03C17/42 ,  C03B23/047 ,  C08K5/544

Abstract: Disclosed herein are delamination resistant glass pharmaceutical containers which may include a glass body having a Class HGA1 hydrolytic resistance when tested according to the ISO 720:1985 testing standard. The glass body may have an interior surface and an exterior surface. The interior surface of the glass body does not comprise a boron-rich layer when the glass body is in an as-formed condition. A heat-tolerant coating may be bonded to at least a portion of the exterior surface of the glass body. The heat-tolerant coating may have a coefficient of friction of less than about 0.7 and is thermally stable at a temperature of at least 250° C. for 30 minutes.

公开(公告)号：US20220399242A1

公开(公告)日：2022-12-15

申请号：US17846320

申请日：2022-06-22

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Philip Simon Brown ,  Mandakini Kanungo ,  Prantik Mazumder ,  Rajesh Vaddi

IPC: H01L23/15 ,  C23C26/00 ,  H01L21/48 ,  H01L23/498

Abstract: A method of manufacturing a glass article comprises: (A) forming a first layer of catalyst metal on a glass substrate; (B) heating the glass substrate; (C) forming a second layer of an alloy of a first metal and a second metal on the first layer; (D) heating the glass substrate, thereby forming a glass article comprising: (i) the glass substrate; (ii) an oxide of the first metal covalently bonded thereto; and (iii) a metallic region bonded to the oxide, the metallic region comprising the catalyst, first, and second metals. In embodiments, the method further comprises (E) forming a third layer of a primary metal on the metallic region; and (F) heating the glass article thereby forming the glass article comprising: (i) the oxide of the first metal covalently bonded the glass substrate; and (ii) a new metallic region bonded to the oxide comprising the catalyst, first, second, and primary metals.

公开(公告)号：US11456225B2

公开(公告)日：2022-09-27

申请号：US17217027

申请日：2021-03-30

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Philip Simon Brown ,  Mandakini Kanungo ,  Prantik Mazumder ,  Rajesh Vaddi

IPC: H01L23/15 ,  C23C26/00 ,  H01L21/48 ,  H01L23/498

Abstract: A method of manufacturing a glass article comprises: (A) forming a first layer of catalyst metal on a glass substrate; (B) heating the glass substrate; (C) forming a second layer of an alloy of a first metal and a second metal on the first layer; (D) heating the glass substrate, thereby forming a glass article comprising: (i) the glass substrate; (ii) an oxide of the first metal covalently bonded thereto; and (iii) a metallic region bonded to the oxide, the metallic region comprising the catalyst, first, and second metals. In embodiments, the method further comprises (E) forming a third layer of a primary metal on the metallic region; and (F) heating the glass article thereby forming the glass article comprising: (i) the oxide of the first metal covalently bonded the glass substrate; and (ii) a new metallic region bonded to the oxide comprising the catalyst, first, second, and primary metals.

公开(公告)号：US11192340B2

公开(公告)日：2021-12-07

申请号：US16732845

申请日：2020-01-02

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Robert George Manley ,  Prantik Mazumder

IPC: B32B17/06 ,  B32B3/26 ,  B32B7/06 ,  B32B7/12 ,  B32B9/00 ,  B32B9/04 ,  B32B17/00 ,  B32B27/06 ,  B32B38/00 ,  C03C15/00 ,  H01L21/02

Abstract: A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including: treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having: silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein; contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; and separating the device substrate having the device modified second surface from the glass carrier substrate.

公开(公告)号：US11135812B2

公开(公告)日：2021-10-05

申请号：US15574560

申请日：2016-05-17

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Robert Alan Bellman

IPC: B32B17/10 ,  B32B7/06 ,  C03C17/30 ,  C03C27/10 ,  B32B17/06 ,  B32B37/10

Abstract: Described herein are organosilicon modification layers and associated deposition methods and inert gas treatments that may be applied on a sheet, a carrier, or both, to control van der Waals, hydrogen and covalent bonding between a sheet and carrier. The modification layers bond the sheet and carrier together such that a permanent bond is prevented at high temperature processing as well as maintaining a sufficient bond to prevent delamination during high temperature processing.

公开(公告)号：US20210047236A1

公开(公告)日：2021-02-18

申请号：US17087049

申请日：2020-11-02

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Yuhui Jin ,  Benedict Yorke Johnson ,  Timothy Edward Myers ,  Eric Louis Null ,  Charles Andrew Paulson ,  James Joseph Price ,  Florence Christine Monique Verrier

IPC: C03C17/42 ,  H05K5/00 ,  H05K5/03 ,  C04B41/00 ,  C03C17/00 ,  C04B41/52 ,  C04B41/89

Abstract: An article is described herein that includes: a glass, glass-ceramic or ceramic substrate comprising a primary surface; at least one of an optical film and a scratch-resistant film disposed over the primary surface; and an easy-to-clean (ETC) coating comprising a fluorinated material that is disposed over an outer surface of the at least one of an optical film and a scratch-resistant film. The at least one of an optical film and a scratch-resistant film comprises an average hardness of 10 GPa or more. Further, the outer surface of the at least one of an optical film and a scratch-resistant film comprises a surface roughness (Rq) of less than 1.0 nm.

公开(公告)号：US10273049B2

公开(公告)日：2019-04-30

申请号：US13930647

申请日：2013-06-28

Applicant: Corning Incorporated

Inventor： Kaveh Adib ,  Dana Craig Bookbinder ,  Theresa Chang ,  Paul Stephen Danielson ,  Steven Edward DeMartino ,  Melinda Ann Drake ,  Andrei Gennadyevich Fadeev ,  James Patrick Hamilton ,  Robert Michael Morena ,  Santona Pal ,  John Stephen Peanasky ,  Chandan Kumar Saha ,  Robert Anthony Schaut ,  Susan Lee Schiefelbein ,  Christopher Lee Timmons

IPC: B65D23/08 ,  B65D1/40 ,  A61J1/14 ,  C03C17/00 ,  C03C17/30 ,  C03C17/32 ,  C03C17/42 ,  C03C21/00 ,  C09D179/08 ,  C08G73/10 ,  B32B17/06 ,  B65D25/14 ,  C03C3/087 ,  C03C17/34

Abstract: Delamination resistant glass containers with heat-tolerant coatings are disclosed. In one embodiment, a glass container may include a glass body having an interior surface, an exterior surface and a wall thickness extending from the exterior surface to the interior surface. At least the interior surface of the glass body is delamination resistant. The glass container may further include a heat-tolerant coating positioned on at least a portion of the exterior surface of the glass body. The heat-tolerant coating may be thermally stable at temperatures greater than or equal to 260° C. for 30 minutes.

公开(公告)号：US10046542B2

公开(公告)日：2018-08-14

申请号：US15122366

申请日：2015-01-26

Applicant: Corning Incorporated

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Dana Craig Bookbinder ,  Theresa Chang ,  Shiwen Liu ,  Robert George Manley ,  Prantik Mazumder

IPC: B32B7/06 ,  B32B37/26 ,  B32B7/02 ,  B32B17/06 ,  C03C17/22 ,  C03C23/00 ,  C03C27/06 ,  C03C27/10

Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.

公开(公告)号：US20180126705A1

公开(公告)日：2018-05-10

申请号：US15574560

申请日：2016-05-17

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Robert Alan Bellman

IPC: B32B17/10 ,  B32B7/06 ,  B32B37/10 ,  C03C17/30 ,  C03C27/10

CPC classification number: B32B17/10798 ,  B32B7/06 ,  B32B17/06 ,  B32B17/10036 ,  B32B37/1018 ,  B32B2307/714 ,  B32B2307/748 ,  B32B2457/206 ,  C03C17/30 ,  C03C27/10 ,  C03C2218/33

Abstract: Described herein are organosilicon modification layers and associated deposition methods and inert gas treatments that may be applied on a sheet, a carrier, or both, to control van der Waals, hydrogen and covalent bonding between a sheet and carrier. The modification layers bond the sheet and carrier together such that a permanent bond is prevented at high temperature processing as well as maintaining a sufficient bond to prevent delamination during high temperature processing.