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    42.
    发明专利
    未知

    公开(公告)号：SE513341C2

    公开(公告)日：2000-08-28

    申请号：SE9803392

    申请日：1998-10-06

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER ,  BOUSTEDT KATARINA

    IPC: H05K1/18 ,  H05K3/38 ,  H05K3/46 ,  H05K1/03 ,  H05K1/16

    Abstract: Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.

    Printed board assembly and method of its manufacture
    43.
    发明专利
    Printed board assembly and method of its manufacture 未知

    公开(公告)号：AU1303900A

    公开(公告)日：2000-04-26

    申请号：AU1303900

    申请日：1999-10-05

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER ,  BOUSTEDT KATARINA

    IPC: H05K1/18 ,  H05K3/38 ,  H05K3/46 ,  H05K1/03 ,  H05K1/16

    Abstract: Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.

    46.
    发明专利
    未知

    公开(公告)号：SE9900840D0

    公开(公告)日：1999-03-09

    申请号：SE9900840

    申请日：1999-03-09

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER

    IPC: H05K1/02 ,  H05K3/40 ,  H05K3/46 ,  H05K

    Abstract: A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method.

    47.
    发明专利
    未知

    公开(公告)号：SE9803392D0

    公开(公告)日：1998-10-06

    申请号：SE9803392

    申请日：1998-10-06

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER ,  BOUSTEDT KATARINA

    IPC: H05K1/18 ,  H05K3/38 ,  H05K3/46 ,  H05K

    Abstract: Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.

    48.
    发明专利
    未知

    公开(公告)号：DE69840749D1

    公开(公告)日：2009-05-28

    申请号：DE69840749

    申请日：1998-06-16

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER

    IPC: H01Q1/38 ,  H01P3/08 ,  H01Q13/08 ,  H01Q21/00

    Abstract: An environmentally compatible microstrip structure for electromagnetic signals in the microwave frequency range and higher. The microstrip structure according to the invention comprises at least two dielectric bodies made of an inorganic non-metallic material. Conductors of the microstrip structure are disposed on a first dielectric body. The ground plane of the microstrip structure is disposed on a second dielectric body. The dielectric bodies are so oriented that the second dielectric is between the at least one conductor and the ground plane while the first dielectric body is not. At least one cavitity is formed in the second dielectric body around at least one of the conductors to thereby create a composite dielectric comprising gas/air/vacuum of the cavity and the second dielectric body. The composite dielectric giving the microstrip structure adequate performance with dielectrically poor but environmentally compatible dielectric materials forming the dielectric bodies.

    49.
    发明专利
    未知

    公开(公告)号：DE60012899T2

    公开(公告)日：2005-09-08

    申请号：DE60012899

    申请日：2000-01-14

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER ,  GEVORGIAN SPARTAK

    IPC: H05K1/02 ,  H05K1/16 ,  H05K3/32 ,  H01P3/08

    Abstract: Method and arrangements for reducing crosstalk between conductors on a conductor carrier, and methods for manufacturing conductor carriers including these arrangements are presented. Crosstalk between the conductors is prevented by providing a dielectric material in the space between each conductor and an earth plane so that the electric field can be tied down within this space and thus prevent leakage of field lines to the co-lateral conductors. The capacitance is increased by an arrangement in the space immediately beneath the conductor so as to reduce the distance between conductors and the earth plane and/or through the medium of a dielectric material that has a higher dielectric index epsir than the dielectric material.

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