METHOD OF FORMING A DEVICE WITH A PIEZOELECTRIC TRANSDUCER

    公开(公告)号:HK1107873A1

    公开(公告)日:2008-04-18

    申请号:HK08101478

    申请日:2008-02-06

    Abstract: A method of forming a microelectromechanical device with a piezoelectric transducer is described, the method comprising the steps of bonding a first surface of a body of piezoelectric material (107) to a first surface of a handle layer (135); forming alignment cuts (171) into a second surface of the body of piezoelectric material, the alignment cuts extending entirely through the body of piezoelectric material and partially into the handle layer; after forming the alignment cuts, attaching the second surface of the body of piezoelectric material to a device body; and after attaching the body of piezoelectric material to the device body, removing the handle layer from the first surface of the body of piezoelectric material.

    Apparatus for depositing droplets
    43.
    发明专利

    公开(公告)号:HK1091441A1

    公开(公告)日:2007-01-19

    申请号:HK06111908

    申请日:2006-10-27

    Abstract: An apparatus for depositing droplets on a substrate is disclosed. The apparatus includes a support for the substrate, a droplet ejection assembly which includes a pumping chamber, a controller and a source of static pressure to maintain the total pressure in the pumping chamber above a threshold pressure level to avoid rectified diffusion type bubble growth in the pumping chamber. The droplet ejection assembly is positioned over the support for depositing the droplets on the substrate and includes, in addition to a pumping chamber, a displacement member and an orifice that ejects the droplets. The controller provides signals to the displacement member to eject drops.

    APPARATUS FOR DEPOSITING DROPLETS
    48.
    发明公开
    APPARATUS FOR DEPOSITING DROPLETS 有权
    DEVICE液滴分离

    公开(公告)号:EP1633565A4

    公开(公告)日:2009-08-05

    申请号:EP04755154

    申请日:2004-06-14

    CPC classification number: B41J2/14 B41J2/19 B41J2202/07

    Abstract: An apparatus for depositing droplets on a substrate is disclosed. The apparatus includes a support for the substrate, a droplet ejection assembly which includes a pumping chamber, a controller and a source of static pressure to maintain the total pressure in the pumping chamber above a threshold pressure level to avoid rectified diffusion type bubble growth in the pumping chamber. The droplet ejection assembly is positioned over the support for depositing the droplets on the substrate and includes, in addition to a pumping chamber, a displacement member and an orifice that ejects the droplets. The controller provides signals to the displacement member to eject drops.

    FLUID EJECTION MODULE MOUNTING
    49.
    发明公开
    FLUID EJECTION MODULE MOUNTING 审中-公开
    BEFESTIGUNG EINESFLÜSSIGKEITSAUSSTOSSMODULS

    公开(公告)号:EP2969570A4

    公开(公告)日:2017-09-20

    申请号:EP14773685

    申请日:2014-03-13

    Abstract: A fluid ejection module mounting apparatus, including a module mount having a horizontal portion and a vertical portion, a fluid ejection module mounted to the module mount, and a clamp assembly including a recessed portion, a clamp along a wall of the recessed portion, and a lever coupled to the clamp and configured to move the clamp from an open position to a closed position. The horizontal portion has an opening configured to receive a fluid ejection module and the vertical portion has a protruding portion. The protruding portion of the module mount is configured to mate with the recessed portion of the clamp assembly.

    Abstract translation: 一种流体喷射模块安装装置,包括具有水平部分和垂直部分的模块安装件,安装到模块安装件的流体喷射模块,以及夹具组件,该夹具组件包括凹陷部分,沿着凹陷部分的壁的夹具,以及 杠杆,所述杠杆联接到所述夹具并且构造成将所述夹具从打开位置移动到闭合位置。 水平部分具有构造成接收流体喷射模块的开口,并且垂直部分具有突出部分。 模块安装件的突出部分构造成与夹具组件的凹陷部分配合。

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