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    FLUID DEPOSITION DEVICE
    4.
    发明申请
    FLUID DEPOSITION DEVICE 审中-公开
    流体沉积装置

    公开(公告)号：WO2007008998A3

    公开(公告)日：2007-06-14

    申请号：PCT/US2006027077

    申请日：2006-07-12

    Applicant: FUJIFILM DIMATIX INC ,  HIGGINSON JOHN A ,  ROCCHIO MICHAEL ,  BIRKMEYER JEFFREY ,  DEMING STEPHEN R ,  VON ESSEN KEVIN ,  BIBL ANDREAS ,  GARDNER DEANE A ,  WEST DANIEL ALAN

    Inventor： HIGGINSON JOHN A ,  ROCCHIO MICHAEL ,  BIRKMEYER JEFFREY ,  DEMING STEPHEN R ,  VON ESSEN KEVIN ,  BIBL ANDREAS ,  GARDNER DEANE A ,  WEST DANIEL ALAN

    IPC: B41J2/175

    CPC classification number: B41J29/13 ,  B41J2/175 ,  B41J2/1752 ,  B41J2/17526 ,  B41J2/17556 ,  B41J2/17596 ,  B41J29/02

    Abstract: A fluid deposition device (100) including a platen (102) and a cartridge mount assembly (104) is described. The platen (102) is configured to support a substrate upon which a fluid will be deposited. The cartridge mount assembly (104) includes a receptacle (122) configured to receive a print cartridge (114) and multiple electrical contacts (124) configured to mate with corresponding electrical contacts on the print cartridge (114). In one implementation, the cartridge mount assembly (104) further includes a vacuum connector (131) configured to mate with a vacuum inlet included on the print cartridge (114). When the print cartridge is received in the receptacle, the print cartridge can form connections with the electrical contacts and with the vacuum connector (113) of the receptacle at substantially the same time.

    Abstract translation: 描述了包括台板（102）和盒安装组件（104）的流体沉积设备（100）。 台板（102）构造成支撑其上将沉积流体的基板。 盒安装组件（104）包括构造成接纳打印盒（114）的容器（122）和构造成与打印盒（114）上的相应电触点配合的多个电触点（124）。 在一个实施方式中，盒安装组件（104）还包括构造成与包括在打印盒（114）上的真空入口配合的真空连接器（131）。 当打印盒被容纳在容器中时，打印盒可基本上同时与电触点和容器的真空连接器（113）形成连接。

    FLUID EJECTION MODULE MOUNTING
    5.
    发明公开
    FLUID EJECTION MODULE MOUNTING 审中-公开
    BEFESTIGUNG EINESFLÜSSIGKEITSAUSSTOSSMODULS

    公开(公告)号：EP2969570A4

    公开(公告)日：2017-09-20

    申请号：EP14773685

    申请日：2014-03-13

    Applicant: FUJIFILM DIMATIX INC

    Inventor： VON ESSEN KEVIN ,  HOISINGTON PAUL A ,  ROCCHIO MICHAEL

    IPC: B41J2/14 ,  B41J2/175 ,  B41J25/00 ,  B41J25/34 ,  B41J29/00

    CPC classification number: B41J25/001 ,  B41J2/1752 ,  B41J25/34 ,  B41J29/00 ,  Y10T29/4978 ,  Y10T29/53091

    Abstract: A fluid ejection module mounting apparatus, including a module mount having a horizontal portion and a vertical portion, a fluid ejection module mounted to the module mount, and a clamp assembly including a recessed portion, a clamp along a wall of the recessed portion, and a lever coupled to the clamp and configured to move the clamp from an open position to a closed position. The horizontal portion has an opening configured to receive a fluid ejection module and the vertical portion has a protruding portion. The protruding portion of the module mount is configured to mate with the recessed portion of the clamp assembly.

    Abstract translation: 一种流体喷射模块安装装置，包括具有水平部分和垂直部分的模块安装件，安装到模块安装件的流体喷射模块，以及夹具组件，该夹具组件包括凹陷部分，沿着凹陷部分的壁的夹具，以及 杠杆，所述杠杆联接到所述夹具并且构造成将所述夹具从打开位置移动到闭合位置。 水平部分具有构造成接收流体喷射模块的开口，并且垂直部分具有突出部分。 模块安装件的突出部分构造成与夹具组件的凹陷部分配合。

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