公开(公告)号：US10734760B2

公开(公告)日：2020-08-04

申请号：US16533723

申请日：2019-08-06

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P. Franz ,  Tahir Cader

IPC: H01R13/62 ,  H01R13/52 ,  H01R25/14 ,  H05K7/20 ,  F16L29/02

Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.

公开(公告)号：US20190363485A1

公开(公告)日：2019-11-28

申请号：US16533723

申请日：2019-08-06

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader

IPC: H01R13/62 ,  H05K7/20 ,  H01R13/52 ,  H01R25/14

Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.

公开(公告)号：US10458724B2

公开(公告)日：2019-10-29

申请号：US15717313

申请日：2017-09-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael L. Sabotta ,  David A. Moore

IPC: F28F27/00 ,  F28F1/40 ,  H05K7/20 ,  H01L23/473

Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

公开(公告)号：US10455726B2

公开(公告)日：2019-10-22

申请号：US15511983

申请日：2014-09-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  John P Franz ,  David Allen Moore ,  Douglas Kent Garday ,  Wade D Vinson

IPC: H05K7/20 ,  G06F1/20

Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.

公开(公告)号：US10433458B1

公开(公告)日：2019-10-01

申请号：US15973705

申请日：2018-05-08

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  Harvey Lunsman

IPC: H05K7/20 ,  H01L23/473 ,  H01L23/427 ,  G06F1/20 ,  F28F3/04 ,  F28F21/06 ,  F28D15/02

Abstract: Cold plates are described herein. In one example, a cold plate can include a thermally conductive plastic forming a coolant channel that includes a heat spreader formed into the thermally conductive plastic and an exterior surface of the thermally conductive plastic with a coupling location to couple a heat pipe to the exterior surface of the thermally conductive plastic.

公开(公告)号：US20190227606A1

公开(公告)日：2019-07-25

申请号：US16369144

申请日：2019-03-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz ,  Tahir Cader ,  Cullen E. Bash ,  Niru Kumari ,  Sarah Anthony ,  Sergio Escobar-Vargas ,  Siamak Tavallaei

IPC: G06F1/20 ,  H05K7/20

Abstract: Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate. The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate.

公开(公告)号：US10330395B2

公开(公告)日：2019-06-25

申请号：US15819463

申请日：2017-11-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael L. Sabotta ,  David A. Moore

IPC: F28F7/00 ,  F28F1/40 ,  H05K7/20 ,  H01L23/473

Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

公开(公告)号：US20190146565A1

公开(公告)日：2019-05-16

申请号：US16189340

申请日：2018-11-13

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  Javier Izquierdo

IPC: G06F1/30 ,  H02J9/06 ,  H02J1/00 ,  H05K7/14 ,  H01M8/04537 ,  H01M8/04664

Abstract: Example implementations relate to data center fuel cells. In some examples, a controller for data center fuel cells can include instructions to: determine when a load for a data center that exceeds a power threshold, determine a first quantity of power to be provided by a first power source and a second quantity of power to be provided by a second power source such that a sum of the first quantity of power and the second quantity of power is equal to or exceeds the power threshold for the data center, provide the first quantity of power utilizing the first power source, wherein the first quantity of power is less than the power threshold, and provide the second quantity of power utilizing the second power source.

公开(公告)号：US20190037734A1

公开(公告)日：2019-01-31

申请号：US15665334

申请日：2017-07-31

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Matthew Richard Slaby

IPC: H05K7/20 ,  G05B15/02

CPC classification number: H05K7/20836 ,  G01L13/00 ,  G05B15/02 ,  H05K7/20772 ,  H05K7/20781

Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.

公开(公告)号：US20180317347A1

公开(公告)日：2018-11-01

申请号：US15772903

申请日：2015-12-18

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  David A. Moore ,  Greg Scott Long

IPC: H05K7/20 ,  G05D7/06 ,  G05B15/02

CPC classification number: G06F1/20 ,  G06F17/5009 ,  H05K7/2079 ,  H05K7/20836

Abstract: An example device in accordance with an aspect of the present disclosure includes a collection engine and a correlation engine to identify cooling loop characteristics. The collection engine is to collect data from devices associated with cooling loops. The correlation engine is to identify, based on the data collected, a common loop from among the cooling loops, and which of the devices are associated with the common loop.